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Mounting assembly for power semiconductors

  • US 5,586,004 A
  • Filed: 06/22/1995
  • Issued: 12/17/1996
  • Est. Priority Date: 01/20/1993
  • Status: Expired due to Fees
First Claim
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1. A mounting assembly for power semiconductors, the assembly comprising:

  • a plurality of plate-like modules arranged around a central axis, each module comprising;

    at least two walls, at least one of said walls defining a flat major surface providing a heat sink for the direct mounting of semiconductor components thereon; and

    an internal passage defined between said walls for the passage of a fluid cooling medium therethrough in order to cool semiconductor components mounted on said surface.

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