Mounting assembly for power semiconductors
First Claim
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1. A mounting assembly for power semiconductors, the assembly comprising:
- a plurality of plate-like modules arranged around a central axis, each module comprising;
at least two walls, at least one of said walls defining a flat major surface providing a heat sink for the direct mounting of semiconductor components thereon; and
an internal passage defined between said walls for the passage of a fluid cooling medium therethrough in order to cool semiconductor components mounted on said surface.
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Abstract
A mounting assembly for power semiconductors comprises a plurality of modules (20) arranged in a symmetrical arrangement around a central axis. Each module has one or more heat sink substrate surfaces (201,203) for the mounting of semiconductor components (205) and an internal passage (202) for passing a fluid cooling medium therethrough in order to cool the semiconductor components. The assembly may comprise a prismatic body (24) providing the substrate surfaces (243).
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Citations
15 Claims
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1. A mounting assembly for power semiconductors, the assembly comprising:
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a plurality of plate-like modules arranged around a central axis, each module comprising; at least two walls, at least one of said walls defining a flat major surface providing a heat sink for the direct mounting of semiconductor components thereon; and an internal passage defined between said walls for the passage of a fluid cooling medium therethrough in order to cool semiconductor components mounted on said surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification