Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together
First Claim
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1. A multi-chip module, comprising:
- a base board;
a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, wherein said thin-film multi-layer circuit board includes at least one of said wiring conductors which extends to a main external surface thereof;
circuit elements mounted on said main external surface of the thin-film multi-layer circuit board; and
terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted, wherein the terminals are attached and supported between said at least one of said wiring conductors of the thin-film multi-layer circuit board and said circuits on said wiring board, wherein said wiring conductors are located at different layer levels, and have longitudinally extending portions and laterally extending portions, and wherein said wiring conductors are electrically connected to each other by way of said longitudinally extending portions passing through via holes formed in the insulating layers.
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Abstract
A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.
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Citations
32 Claims
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1. A multi-chip module, comprising:
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a base board; a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, wherein said thin-film multi-layer circuit board includes at least one of said wiring conductors which extends to a main external surface thereof; circuit elements mounted on said main external surface of the thin-film multi-layer circuit board; and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted, wherein the terminals are attached and supported between said at least one of said wiring conductors of the thin-film multi-layer circuit board and said circuits on said wiring board, wherein said wiring conductors are located at different layer levels, and have longitudinally extending portions and laterally extending portions, and wherein said wiring conductors are electrically connected to each other by way of said longitudinally extending portions passing through via holes formed in the insulating layers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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Specification