Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together

• US 5,586,006 A
• Filed: 12/15/1995
• Issued: 12/17/1996
• Est. Priority Date: 08/12/1993
• Status: Expired due to Term

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Sumiyoshi, Makoto, Yasuda, Naoki, Kikuchi, Shunichi, Seyama, Kiyotaka, Nori, Hitoshi, Hirano, Minoru
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US08/573,577
• Time in Patent Office: 368 Days
• Field of Search: 439/65, 439/67-72, 439/74, 439/75, 439/77, 174/250, 174/252, 174/255, 174/256, 174/260, 428/210, 428/901, 257/672, 257/701, 257/703, 257/712, 257/778, 257/780, 257/787, 361/690, 361/701-704, 361/708, 361/718, 361/719, 361/749, 361/760, 361/767, 361/768, 361/772, 361/773, 361/777, 361/778, 361/784, 361/789, 361/790, 361/792
• US Class Current: 361/719
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06555 Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06572 Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/06579 TAB carriers; beam leads
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/1532 the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/0317 : Thin film conductor layer; Thin film passive component
• CPC Class Codes: H05K 2201/1031 : Surface mounted metallic connector elements
• CPC Class Codes: H05K 2201/10318 : Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10477 : Inverted
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: H05K 3/3426 : characterised by the leads
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/368 : parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/467 : Adding a circuit layer by thin film methods H05K3/4647 takes precedence
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.

Claims

1. A multi-chip module, comprising:

a base board;

a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, wherein said thin-film multi-layer circuit board includes at least one of said wiring conductors which extends to a main external surface thereof;

circuit elements mounted on said main external surface of the thin-film multi-layer circuit board; and

terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted, wherein the terminals are attached and supported between said at least one of said wiring conductors of the thin-film multi-layer circuit board and said circuits on said wiring board, wherein said wiring conductors are located at different layer levels, and have longitudinally extending portions and laterally extending portions, and wherein said wiring conductors are electrically connected to each other by way of said longitudinally extending portions passing through via holes formed in the insulating layers.

2. The multi-chip module as claimed in claim 1, wherein said terminals comprise lead members.

3. The multi-chip module as claimed in claim 1, wherein said terminals comprise leadless members.

4. The multi-chip module as claimed in claim 1, wherein said terminals are soldered to wiring conductors of the thin-film multi-layer circuit board facing the wiring board, so that the terminals are supported by the thin-film multi-layer circuit board.

5. The multi-chip module as claimed in claim 2, wherein said terminals are soldered to wiring conductors of the thin-film multi-layer circuit board facing the wiring board, so that the terminals are supported by the thin-film multi-layer circuit board.

6. The multi-chip module as claimed in claim 3, wherein said terminals are soldered to wiring conductors of the thin-film multi-layer circuit board facing the wiring board.

7. The multi-chip module as claimed in claim 1, wherein wiring conductors of the thin-film multi-layer circuit board facing the wiring board comprise pad areas to which said terminals are connected.

8. The multi-chip module as claimed in claim 2, wherein wiring conductors of the thin-film multi-layer circuit board facing the wiring board comprise pad areas to which said terminals are connected.

9. The multi-chip module as claimed in claim 3, wherein wiring conductors of the thin-film multi-layer circuit board facing the wiring board comprise pad areas to which said terminals are connected.

10. The multi-chip module as claimed in claim 4, wherein wiring conductors of the thin-film multi-layer circuit board facing the wiring board comprise pad areas to which said terminals are connected.

11. The multi-chip module as claimed in claim 2, wherein said lead members comprise lead pins vertically extending from the main surface of the thin-film multi-layer circuit board.

12. The multi-chip module as claimed in claim 2, wherein said lead members comprise flat-type lead pins.

13. The multi-chip module as claimed in claim 2, wherein said lead members comprise wire leads.

14. The multi-chip module as claimed in claim 2, wherein said lead members comprise tape-automated bonding leads.

15. The multi-chip module as claimed in claim 1, wherein said terminals are located in peripheral areas on the main surface of the thin-film multi-layer circuit board so that said terminals surround the circuit elements.

16. The multi-chip module as claimed in claim 2, wherein said terminals are located in peripheral areas on the main surface of the thin-film multi-layer circuit board so that said terminals surround the circuit elements.

17. The multi-chip module as claimed in claim 3, wherein said terminals are located in peripheral areas on the main surface of the thin-film multi-layer circuit board so that said terminals surround the circuit elements.

18. The multi-chip module as claimed in claim 4, wherein said terminals are located in peripheral areas on the main surface of the thin-film multi-layer circuit board so that said terminals surround the circuit elements.

19. The multi-chip module as claimed in claim 7, wherein said terminals are located in peripheral areas on the main surface of the thin-film multi-layer circuit board so that said terminals surround the circuit elements.

20. The multi-chip module as claimed in claim 1, further comprising a cover which is formed on the main surface of the thin-film multi-layer circuit board and covers the circuit elements.

21. The multi-chip module as claimed in claim 2, further comprising a cover which is formed on the main surface of the thin-film multi-layer circuit board and covers the circuit elements.

22. The multi-chip module as claimed in claim 3, further comprising a cover which is formed on the main surface of the thin-film multi-layer circuit board and covers the circuit elements.

23. The multi-chip module as claimed in claim 4, further comprising a cover which is formed on the main surface of the thin-film multi-layer circuit board and covers the circuit elements.

24. The multi-chip module as claimed in claim 7, further comprising a cover which is formed on the main surface of the thin-film multi-layer circuit board and covers the circuit elements.

25. The multi-chip module as claimed in claim 15, further comprising a cover which is formed on the main surface of the thin-film multi-layer circuit board and covers the circuit elements.

26. The multi-chip module as claimed in claim 1, further comprising a cooling structure which is formed on a second surface of the base board opposite to the first surface thereof and which cools the multi-chip module.

27. The multi-chip module as claimed in claim 2, further comprising a cooling structure which is formed on a second surface of the base board opposite to the first surface thereof and which cools the multi-chip module.

28. The multi-chip module as claimed in claim 3, further comprising a cooling structure which is formed on a second surface of the base board opposite to the first surface thereof and which cools the multi-chip module.

29. The multi-chip module as claimed in claim 4, further comprising a cooling structure which is formed on a second surface of the base board opposite to the first surface thereof and which cools the multi-chip module.

30. The multi-chip module as claimed in claim 7, further comprising a cooling structure which is formed on a second surface of the base board opposite to the first surface thereof and which cools the multi-chip module.

31. The multi-chip module as claimed in claim 15, further comprising a cooling structure which is formed on a second surface of the base board opposite to the first surface thereof and which cools the multi-chip module.

32. The multi-chip module as claimed in claim 20, further comprising a cooling structure which is formed on a second surface of the base board opposite to the first surface thereof and which cools the multi-chip module.