Processed substrate obtained by a process for effecting suppression of electrification

• US 5,589,270 A
• Filed: 06/01/1995
• Issued: 12/31/1996
• Est. Priority Date: 05/30/1990
• Status: Expired due to Term

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Hitachi, Ltd., Showa Denko KK (Resonac Holdings Corp.)
• Inventors: Suzuki, Yasunori, Tomozawa, Hideki, Takashi, Ryuma, Saida, Yoshihiro, Murai, Fumio, Ikenoue, Yoshiaki
• Primary Examiner(s): PIANALTO, BERNARD D
• Application Number:
  US08/456,313
• Time in Patent Office: 579 Days
• Field of Search: 427/496, 427/504, 427/510, 427/508, 427/525, 427/526, 427/533, 427/558, 427/102, 427/103, 427/259, 427/264, 427/282, 427/272, 427/385.5, 427/407.1, 428/411.1
• US Class Current: 428/411.1
• CPC Class Codes: G03F 7/093 characterised by antistatic means, e.g. for charge depletion
• CPC Class Codes: G03F 7/2059 using a scanning corpuscular radiation beam, e.g. an electron beam
• CPC Class Codes: Y10T 428/31504 Composite [nonstructural laminate]

Abstract

Electrification is suppressed with a water-soluble electrification-suppressing film having an electron conductivity and comprising a polymer resin. A high electrification-suppressing effect which is also high in vacuum can be easily obtained by using the electrification-suppressing film with less contamination.

Claims

1. A method for suppression of electrification which comprises a step of forming on a substrate a water-soluble electrification-suppressing film having an electron conductivity and comprising a polymer resin and a step of irradiating a charged particle beam onto the substrate.

2. A processed substrate produced by a process comprising a step of forming on a substrate a water-soluble electrification-suppressing film having an electron conductivity and comprising an electron conducting polymer having a π

-electron conjugated system, and a step of irradiating a charged particle beam onto the thus coated substrate;

said charged particle beam being an electron or ion beam.

10. A processed substrate according to any of claims 2 to 6, wherein the substrate is an insulating substrate.

14. A processed substrate according to any of claims 2 to 13, wherein the conducting polymer is an electron conducting polymer having a unit structure in which anionic groups are covalently bonded to the main chain.

3. A processed substrate produced by a process comprising a step of forming on a substrate a water-soluble electrification-suppressing film having an electron conductivity and comprising an electron conducting polymer having a π

-electron conjugated system, and a step of irradiating a charged particle beam onto the thus coated substrate, said charged particle beam being an electron or ion beam, and further comprising a step of forming a first layer on the substrate prior to or after the step of forming said water-soluble electrification-suppressing film.

7. A processed substrate according to any of claims 3 to 6, wherein the first layer is an insulating film.

8. A processed substrate according to claim 7, wherein the processed substrate is a semiconductor device.

9. A processed substrate according to claim 7, wherein the processed substrate is a MOS type transistor.

4. A processed substrate produced by a process comprising a step of forming on a substrate a water-soluble electrification-suppressing film having an electron conductivity and comprising an electron conducting polymer having a π

-electron conjugated system, and a step of irradiating a charged particle beam onto the thus coated substrate, said charged particle beam being an electron or ion beam, and further comprising a step of forming a resist layer on the substrate prior to or after the step of forming said water-soluble electrification-suppressing film.

5. A processed substrate produced by a process comprising a step of forming on a substrate a water-soluble electrification-suppressing film having an electron conductivity and comprising an electron conducting polymer having a π

-electron conjugated system, and a step of irradiating a charged particle beam onto the thus coated substrate, said charged particle beam being an electron or ion beam, and further comprising a step of forming a first layer on the substrate and a step of forming a resist layer wherein any of the latter two steps is carried out prior to or after the step of forming said water-soluble electrification-suppressing film.

6. A processed substrate produced by a process comprising a step of forming on a substrate a water-soluble electrification-suppressing film having an electron conductivity and comprising conducting polymer having a π

-electron conjugated system, and a step of irradiating a charged particle beam onto the thus coated substrate, said charged particle beam being an electron or ion beam, and further comprising a step of forming a first layer on the substrate and a step of forming on the first layer a second layer different from the first layer in etching characteristics and a step of forming a resist layer wherein any of the latter three steps is carried out prior to or after the step of forming said water-soluble electrification-suppressing film.

11. A processed substrate according to claim 6, wherein the second layer is a phase shift layer.

12. A processed substrate according to claim 6, wherein the substrate is an insulating substrate and the second layer is a phase shift layer.

13. A processed substrate produced by a process comprising steps of providing gate electrodes on a gate insulating film which is formed on a substrate, coating a photoresist thereon, exposing ultraviolet rays thereto through a photomask, and developing thereof while leaving a photoresist pattern covering parts of the substrate on one hand and exposing other regions on the other, and steps of thereafter forming thereon a water-soluble electrification-suppressing film comprising an electron conducting polymer having a π

-electron conjugated system, irradiating a charged particle beam on the thus coated substrate, said charged particle beam being an electron or ion beam, removing the water-soluble electrification-suppressing film and the photoresist pattern, optionally followed by heat treatment, and wiring of electrodes.