UV light sensitive die-pac for securing semiconductor dies during transport

• US 5,590,787 A
• Filed: 01/04/1995
• Issued: 01/07/1997
• Est. Priority Date: 01/04/1995
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Hodges, Joe
• Primary Examiner(s): Gehman, Bryon P.
• Application Number:
  US08/368,516
• Time in Patent Office: 734 Days
• Field of Search: 206/722-724, 206/717-720, 206/713, 206/701, 206/460, 206/707, 206/711, 206/725, 220/324
• US Class Current: 206/724
• CPC Class Codes: H01L 21/67346 characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
• CPC Class Codes: H01L 21/67353 specially adapted for a single substrate
• CPC Class Codes: H01L 21/67356 specially adapted for containing chips, dies or ICs
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68313 Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Abstract

A structure for protecting semiconductor integrated microcircuit dice during shipping. The structure secures the position of the die atop an ultra-violet (UV) light penetratable plate using a UV light sensitive adhesive layer. Once the structure reaches its destination, prior to removal of the die, the adhesive layer is exposed to ultraviolet light. This exposure reduces the adhesiveness or coefficient of friction of the layer, thereby facilitating die removal from the structure. The UV sensitive adhesive does not leave contaminating silicon residue on the removed die. The invention may be realized using currently commercially available UV tape and a modified die-pac having a UV light penetratable window.

Claims

1. A structure for releasably holding a microcircuit die which comprises:

a plate having an upper face and formed from a material which is penetrable to light; and

a layer of adhesive over a section of said upper face, said layer of adhesive having a coefficient of friction sensitive to light, whereby a die held in a fixed position with respect to said upper face by said layer of adhesive may be released by exposing said layer of adhesive to light through said section.

2. The structure of claim 1, further comprising:

a cover extending from said plate for enclosing the die.

3. The structure of claim 1, wherein the light is ultraviolet light having a wavelength of between 250 and 350 nanometers.

4. The structure of claim 1, further including a length of tape having an undersurface secured above said upper face and a top surface carrying said adhesive.

5. The structure of claim 4, further including a layer of resilient webbing interposed between said undersurface and said upper face, said webbing being penetrable by the light.

6. The structure of claim 5, wherein said layer of resilient webbing consists of nylon.

7. The structure of claim 1, which further comprises:

a first bed having a portion consisting of said plate;

a vessel which comprises;

top, bottom and side walls defining an inner cavity;

said inner cavity sized and dimensioned to accept said first bed therein; and

means for releasably holding said first bed in a fixed position within said cavity.

8. The structure of claim 7, wherein said means for releasably holding said first bed comprise:

said first bed having opposite ends;

said vessel having a pair of said side walls having opposite facing inner surfaces;

a first groove set into each of said inner surfaces; and

said first grooves being sized and dimensioned to releasably engage said opposite ends.

9. The structure of claim 8, which further comprises:

a second bed identical to said first bed; and

means for releasably holding said second bed in a fixed position within said cavity.

10. The structure of claim 9, wherein said means for releasably holding said second bed comprise a second groove set into each of said inner surfaces below said first groove.

11. A package for shipping at least one die, said package comprising:

a bed including at least a portion formed of a material penetrable by ultraviolet light;

a cover releasably mated to said bed and defining an inner chamber therewith, said inner chamber sized and dimensioned to accept at least one die therein; and

a layer of adhesive secured over a surface of said portion of said bed for releasably holding at least one die in a fixed position within said inner chamber, said adhesive having a

first adhesiveness alterable to a second adhesiveness by exposure of said adhesive to ultraviolet light.

12. The structure of claim 11, wherein the ultraviolet light has a wavelength of between 250 and 350 nanometers.