Solid state imaging device with low trap density
First Claim
1. A solid state image sensor comprising;
- a substrate having insulation surface,an active layer of non-single crystal silicon layer provided on said insulation surface, having at least a source region and a drain region,a gate electrode layer provided on light receiving region between said source region and said drain region on said active layer through a gate insulation layer,a source electrode layer and a drain electrode layer each provided on said source region and said drain region, respectively,trap density of said active layer being less than 5×
1011 /cm2,said gate electrode layer being provided a predetermined bias potential, andelectrical output of current between said source electrode layer and said drain electrode layer being provided depending upon input light which illuminates said light receiving region on said active layer.
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Abstract
A substrate (1) has a surface covered with an insulation layer (2), on which an active layer (3'"'"') made of non-single crystal silicon through thin film technique is provided. A gate electrode layer (5'"'"') is partially provided on said active layer through a gate insulation layer (4). Said active layer (3'"'"') is subject to injection of P-type or N-type impurities to provide an image sensor of MOS structure. Bias potential is applied to a gate electrode so that a circuit between a source and a drain is in an On state, so that input light through said substrate or said gate electrode is applied to said active layer, and electrical output depending upon said input light is obtained from said source electrode or said drain electrode. Other MOS transistors for switching element and/or shift registers for operating said image sensor are provided on said substrate (1). Said active layer (3'"'"') is obtained by crystallizing said amorphous silicon layer through a laser anneal process or a high temperature anneal process, and hydrogenation process, and the trap density of said active layer is less than 5×1011 /cm2. Optical response time is short, less than 500 μsec, so, high speed operation ten times as high as that of a prior image sensor is possible.
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Citations
11 Claims
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1. A solid state image sensor comprising;
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a substrate having insulation surface, an active layer of non-single crystal silicon layer provided on said insulation surface, having at least a source region and a drain region, a gate electrode layer provided on light receiving region between said source region and said drain region on said active layer through a gate insulation layer, a source electrode layer and a drain electrode layer each provided on said source region and said drain region, respectively, trap density of said active layer being less than 5×
1011 /cm2,said gate electrode layer being provided a predetermined bias potential, and electrical output of current between said source electrode layer and said drain electrode layer being provided depending upon input light which illuminates said light receiving region on said active layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification