Electronic apparatus

• US 5,592,363 A
• Filed: 09/29/1993
• Issued: 01/07/1997
• Est. Priority Date: 09/30/1992
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Kawasaki, Nobuo, Daikoku, Takahiro, Hayashi, Yoshito, Kobayashi, Fumiyuki, Kasai, Kenichi, Atarashi, Takayuki, Hatada, Toshio, Iino, Toshiki, Tsukaguchi, Tamotsu
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US08/128,227
• Time in Patent Office: 1,196 Days
• Field of Search: 165/80.2-80.4, 165/104.33, 165/185, 174/15.1, 174/16.1, 174/16.3, 257/707, 257/713-714, 361/687-699, 361/704, 361/724
• US Class Current: 361/689
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.

Claims

1. An electronic apparatus, comprising:

a plurality of heat-generating semiconductor devices mounted on a board;

a plurality of heat sinks attached to corresponding heat-generating semiconductor devices in a heat conducting relationship thereto, said heat sinks being arranged to determine a direction of flow and discharge of a cooling medium therethrough; and

a discharge chamber for passage of confluence flow of said cooling medium composed of fractions of heated cooling medium emitted from said heat sinks;

wherein said heat sinks are disposed such that the direction of flow and discharge of said cooling medium through said heat sinks are substantially the same, each of said heat sinks being respectively supplied with said fractions of the cooling medium through a nozzle provided on an end surface of the respective heat sinks opposite to a heat-generating semiconductor device associated with each of the heat sinks and wherein a flow space for the heated cooling medium to be discharged is formed between adjacent nozzles so as to extend in a direction substantially orthogonal to said direction of flow and discharge of said cooling medium in the respective heat sinks, along the end surface of the respective heat sinks opposite to said board.

4. An electronic apparatus according to one of claims 1 or 2, wherein a spacing between adjacent nozzles is greater in said direction of flow and discharge of the respective cooling medium through the respective heat sinks than in the direction perpendicular to said direction of flow and discharge of the respective cooling medium through the respective heat sinks.

5. An electronic apparatus according to one of claims 1 or 2, further comprising a partition wall surrounding said heat-generating semiconductor devices, said partition wall having an opening.

6. An electronic apparatus according to one of claims 1 or 2, wherein a distance between two adjacent nozzles in said direction of flow and discharge of said cooling medium through the respective heat sinks is greater than a distance between heat sinks associated with said adjacent nozzles.

2. An electronic apparatus, comprising:

a plurality of heat-generating semiconductor devices mounted on a board;

a plurality of heat sinks attached to corresponding heat-generating semiconductor devices in a heat conducting relationship thereto, said heat sinks being arranged to determine a direction of flow and discharge of a cooling medium therethrough; and

a discharge chamber for passage of confluence flow of said cooling medium composed of fractions of heated cooling medium emitted from said heat sinks;

wherein said heat sinks are disposed such that directions of flow and discharge of said cooling medium through said heat sinks are substantially the same, each of said heat sinks being respectively supplied with said fractions of the cooling medium through a nozzle provided on an end surface of the respective heat sinks opposite to a heat-generating semiconductor device, and wherein a breadth of each nozzle, as measured in said direction of flow and discharge of said cooling medium through said heat sinks, is less than a breadth of the heat sink associated with the respective nozzles.

3. An electronic apparatus comprising:

a plurality of heat-generating semiconductor devices mounted on a board;

a plurality of heat sinks attached to corresponding heat-generating semiconductor devices in a heat conducting relationship thereto, said heat sinks being arranged to determine a direction of flow and discharge of a cooling medium therethrough; and

a discharge chamber for passage of confluence flow of said cooling medium composed of fractions of heated cooling medium emitted from said heat sinks;

wherein said heat sinks are disposed such that directions of flow and discharge of said cooling medium through said heat sinks are substantially the same, each of said heat sinks being respectively supplied with said fractions of the cooling medium through a nozzle provided on an end surface of the respective heat sinks opposite to a heat-generating semiconductor device, and wherein each nozzle has a substantially rectangular cross-section when taken along a plane parallel to said board, with shorter sides of the rectangle of each nozzle extending in said direction of flow and discharge of said cooling medium through the respective heat sinks.

7. An electronic apparatus, comprising:

a plurality of heat-generating semiconductor devices mounted on a board;

a plurality of heat sinks attached to respective heat-generating semiconductor devices in a heat conducting relationship thereto, each of said heat sinks being arranged to determine a direction of flow and discharge of a cooling medium therethrough; and

a discharge chamber for passage of confluence flow of said cooling medium composed of fractions of heated cooling medium emitted from the respective heat sinks;

wherein said heat sinks are disposed such that the direction of flow and discharge of said cooling medium through said heat sinks are substantially the same, each of said heat sinks being respectively supplied with said fractions of the cooling medium through a nozzle provided on an end surface of the respective heat sinks opposite to a respective heat-generating semiconductor device, and wherein a width of each said nozzle, as measured in a direction perpendicular to said direction of flow and discharge of said cooling medium through said heat sink, is greater than a width of the heat sink associated with the nozzle.

8. A heat sink assembly comprising:

a heat sink receiving heat from a heat-generating semiconductor device and dissipating heat through a heat exchange between the heat sink and a cooling medium, said heat sink assembly determining a direction of flow and discharge of said cooling medium therethrough; and

a nozzle provided on one end of said heat sink opposite to said heat-generating semiconductor device, a width of said nozzle, as measured in the direction perpendicular to the direction of flow and discharge of said cooling medium determined by said heat sink, is greater than a width of said heat sink and a breadth of said nozzle, as measured in said direction of flow and discharge of said cooling medium determined by said heat sink, is less than a breadth of said heat sink.

9. A computer comprising:

an electronic apparatus including a plurality of heat-generating semiconductor devices mounted on a board, a plurality of heat sinks respectively attached to corresponding heat-generating semiconductor devices in a heat conducting relationship thereto, said heat sinks being arranged to determine a direction of flow and discharge of a cooling medium therethrough; and

a discharge chamber for passage of confluence flow of said cooling medium composed of fractions of heated cooling medium emitted from the respective heat sinks, wherein said heat sinks are disposed such that the direction of flow and discharge of said cooling medium through said heat sinks are substantially the same, each of said heat sinks being respectively supplied with said fractions of the cooling medium through a nozzle provided on an end surface of the respective heat sinks opposite to a heat-generating semiconductor device associated with each of the heat sinks, and wherein a flow space for the heated cooling medium to be discharged is formed between adjacent nozzles so as to extend in a direction substantially orthogonal to said direction of flow and discharge of said cooling medium in the respective heat sinks, along the end surface of the respective heat sinks opposite to said board;

cooling medium supplying means for supplying said cooling medium to said heat sinks;

a chamber for guiding said cooling medium from said cooling medium supplying means to the respective heat sinks; and

a housing for housing said electronic apparatus and said cooling medium supplying means;

wherein said electronic apparatus is disposed in an upper part of said housing in a side-by-side relationship with respect to said chamber, said cooling medium supplying means being disposed beneath said chamber, and said discharge chamber being provided on an upper side of said electronic apparatus and between nozzles through which said cooling medium is supplied to the respective heat sinks, and wherein said housing is provided with a cooling medium outlet formed in an upper wall thereof.

10. A computer according to claim 9, wherein a breadth of each of said nozzles, as measured in said direction of the flow and discharge of said cooling medium determined by said heat sink is less than a breadth of a heat sink associated with the respective nozzles.