Electronic apparatus
First Claim
1. An electronic apparatus, comprising:
- a plurality of heat-generating semiconductor devices mounted on a board;
a plurality of heat sinks attached to corresponding heat-generating semiconductor devices in a heat conducting relationship thereto, said heat sinks being arranged to determine a direction of flow and discharge of a cooling medium therethrough; and
a discharge chamber for passage of confluence flow of said cooling medium composed of fractions of heated cooling medium emitted from said heat sinks;
wherein said heat sinks are disposed such that the direction of flow and discharge of said cooling medium through said heat sinks are substantially the same, each of said heat sinks being respectively supplied with said fractions of the cooling medium through a nozzle provided on an end surface of the respective heat sinks opposite to a heat-generating semiconductor device associated with each of the heat sinks and wherein a flow space for the heated cooling medium to be discharged is formed between adjacent nozzles so as to extend in a direction substantially orthogonal to said direction of flow and discharge of said cooling medium in the respective heat sinks, along the end surface of the respective heat sinks opposite to said board.
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Accused Products
Abstract
An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.
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Citations
10 Claims
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1. An electronic apparatus, comprising:
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a plurality of heat-generating semiconductor devices mounted on a board; a plurality of heat sinks attached to corresponding heat-generating semiconductor devices in a heat conducting relationship thereto, said heat sinks being arranged to determine a direction of flow and discharge of a cooling medium therethrough; and a discharge chamber for passage of confluence flow of said cooling medium composed of fractions of heated cooling medium emitted from said heat sinks; wherein said heat sinks are disposed such that the direction of flow and discharge of said cooling medium through said heat sinks are substantially the same, each of said heat sinks being respectively supplied with said fractions of the cooling medium through a nozzle provided on an end surface of the respective heat sinks opposite to a heat-generating semiconductor device associated with each of the heat sinks and wherein a flow space for the heated cooling medium to be discharged is formed between adjacent nozzles so as to extend in a direction substantially orthogonal to said direction of flow and discharge of said cooling medium in the respective heat sinks, along the end surface of the respective heat sinks opposite to said board. - View Dependent Claims (4, 5, 6)
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2. An electronic apparatus, comprising:
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a plurality of heat-generating semiconductor devices mounted on a board; a plurality of heat sinks attached to corresponding heat-generating semiconductor devices in a heat conducting relationship thereto, said heat sinks being arranged to determine a direction of flow and discharge of a cooling medium therethrough; and a discharge chamber for passage of confluence flow of said cooling medium composed of fractions of heated cooling medium emitted from said heat sinks; wherein said heat sinks are disposed such that directions of flow and discharge of said cooling medium through said heat sinks are substantially the same, each of said heat sinks being respectively supplied with said fractions of the cooling medium through a nozzle provided on an end surface of the respective heat sinks opposite to a heat-generating semiconductor device, and wherein a breadth of each nozzle, as measured in said direction of flow and discharge of said cooling medium through said heat sinks, is less than a breadth of the heat sink associated with the respective nozzles.
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3. An electronic apparatus comprising:
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a plurality of heat-generating semiconductor devices mounted on a board; a plurality of heat sinks attached to corresponding heat-generating semiconductor devices in a heat conducting relationship thereto, said heat sinks being arranged to determine a direction of flow and discharge of a cooling medium therethrough; and a discharge chamber for passage of confluence flow of said cooling medium composed of fractions of heated cooling medium emitted from said heat sinks; wherein said heat sinks are disposed such that directions of flow and discharge of said cooling medium through said heat sinks are substantially the same, each of said heat sinks being respectively supplied with said fractions of the cooling medium through a nozzle provided on an end surface of the respective heat sinks opposite to a heat-generating semiconductor device, and wherein each nozzle has a substantially rectangular cross-section when taken along a plane parallel to said board, with shorter sides of the rectangle of each nozzle extending in said direction of flow and discharge of said cooling medium through the respective heat sinks.
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7. An electronic apparatus, comprising:
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a plurality of heat-generating semiconductor devices mounted on a board; a plurality of heat sinks attached to respective heat-generating semiconductor devices in a heat conducting relationship thereto, each of said heat sinks being arranged to determine a direction of flow and discharge of a cooling medium therethrough; and a discharge chamber for passage of confluence flow of said cooling medium composed of fractions of heated cooling medium emitted from the respective heat sinks; wherein said heat sinks are disposed such that the direction of flow and discharge of said cooling medium through said heat sinks are substantially the same, each of said heat sinks being respectively supplied with said fractions of the cooling medium through a nozzle provided on an end surface of the respective heat sinks opposite to a respective heat-generating semiconductor device, and wherein a width of each said nozzle, as measured in a direction perpendicular to said direction of flow and discharge of said cooling medium through said heat sink, is greater than a width of the heat sink associated with the nozzle.
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8. A heat sink assembly comprising:
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a heat sink receiving heat from a heat-generating semiconductor device and dissipating heat through a heat exchange between the heat sink and a cooling medium, said heat sink assembly determining a direction of flow and discharge of said cooling medium therethrough; and a nozzle provided on one end of said heat sink opposite to said heat-generating semiconductor device, a width of said nozzle, as measured in the direction perpendicular to the direction of flow and discharge of said cooling medium determined by said heat sink, is greater than a width of said heat sink and a breadth of said nozzle, as measured in said direction of flow and discharge of said cooling medium determined by said heat sink, is less than a breadth of said heat sink.
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9. A computer comprising:
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an electronic apparatus including a plurality of heat-generating semiconductor devices mounted on a board, a plurality of heat sinks respectively attached to corresponding heat-generating semiconductor devices in a heat conducting relationship thereto, said heat sinks being arranged to determine a direction of flow and discharge of a cooling medium therethrough; and
a discharge chamber for passage of confluence flow of said cooling medium composed of fractions of heated cooling medium emitted from the respective heat sinks, wherein said heat sinks are disposed such that the direction of flow and discharge of said cooling medium through said heat sinks are substantially the same, each of said heat sinks being respectively supplied with said fractions of the cooling medium through a nozzle provided on an end surface of the respective heat sinks opposite to a heat-generating semiconductor device associated with each of the heat sinks, and wherein a flow space for the heated cooling medium to be discharged is formed between adjacent nozzles so as to extend in a direction substantially orthogonal to said direction of flow and discharge of said cooling medium in the respective heat sinks, along the end surface of the respective heat sinks opposite to said board;cooling medium supplying means for supplying said cooling medium to said heat sinks; a chamber for guiding said cooling medium from said cooling medium supplying means to the respective heat sinks; and a housing for housing said electronic apparatus and said cooling medium supplying means; wherein said electronic apparatus is disposed in an upper part of said housing in a side-by-side relationship with respect to said chamber, said cooling medium supplying means being disposed beneath said chamber, and said discharge chamber being provided on an upper side of said electronic apparatus and between nozzles through which said cooling medium is supplied to the respective heat sinks, and wherein said housing is provided with a cooling medium outlet formed in an upper wall thereof. - View Dependent Claims (10)
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Specification