Method of patterned metallization of substrate surfaces
First Claim
1. A method for patterned metallization of a substrate surface comprising the steps of:
- applying a layer of primer to entirely cover a substrate surface in an area where a metallized pattern is to be formed;
selectively ablating portions of the primer layer from the substrate by exposing said portions to the action of electromagnetic ultraviolet radiation to completely remove the primer from the exposed portions so that a patterned primer layer with primer-free insulating channels formed therein remains on the substrate surface; and
thereafter depositing a metal layer on the remaining patterned primer layer to form conducting paths.
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Accused Products
Abstract
A method for patterned metallization of substrate surfaces, especially circuit boards, even three-dimensional ones, by using electromagnetic UV radiation, particularly from an excimer laser. In the method a primer layer is applied to the full substrate surface in the area of a metal layer that is subsequently applied; insulating channels then are made in the primer layer by complete removal of the primer in certain areas by the action of electromagnetic radiation in the UV range; and afterward the remaining patterned primer layer is provided with the metal layer to form conductor strips. The method makes it possible to create insulating channels with extremely sharp contours in the primer layer on the surface of even three-dimensional, electronic circuit media.
87 Citations
15 Claims
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1. A method for patterned metallization of a substrate surface comprising the steps of:
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applying a layer of primer to entirely cover a substrate surface in an area where a metallized pattern is to be formed; selectively ablating portions of the primer layer from the substrate by exposing said portions to the action of electromagnetic ultraviolet radiation to completely remove the primer from the exposed portions so that a patterned primer layer with primer-free insulating channels formed therein remains on the substrate surface; and thereafter depositing a metal layer on the remaining patterned primer layer to form conducting paths. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification