Method of forming contact pads for wafer level testing and burn-in of semiconductor dice
First Claim
1. A method for forming contact pads for wafer level testing of integrated circuit die comprising the steps of:
- providing a semiconductor substrate having a plurality of integrated circuit die formed thereon, wherein each integrated circuit die has a plurality of bonding pads;
forming a conductive etch-barrier layer overlying and electrically coupled to the plurality of bonding pads; and
forming a conductive layer overlying the conductive etch-barrier layer, wherein the conductive layer is electrically coupled to the plurality of bonding pads, and whereby the conductive etch-barrier layer protects the plurality of bonding pads when the conductive layer is patterned and etched to form a contact pad overlying at least one of the plurality of bonding pads.
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Accused Products
Abstract
A method of forming contact pads (140) that allows for wafer level testing and burn-in of semiconductor die (22). A plurality of semiconductor die (22) are formed upon a semiconductor wafer (20), each semiconductor die (22) having a plurality of bonding pads (78). A contact pad (140) is formed overlying each bonding pad (78) and is electrically coupled to the bonding pad (78) and to wafer test pads (38) through vertical and/or horizontal wafer conductors (42-47 and 52-53 respectively) so that each semiconductor die (22) is uniquely identified. Contact pads (140) protect underlying bonding pads (78) during the formation and removal of vertical and/or horizontal wafer conductors (42-47 and 52-53 respectively). Thus, wafer level electrical testing and/or burn-in can be performed prior to designating a final packaging method for the semiconductor die (22).
124 Citations
22 Claims
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1. A method for forming contact pads for wafer level testing of integrated circuit die comprising the steps of:
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providing a semiconductor substrate having a plurality of integrated circuit die formed thereon, wherein each integrated circuit die has a plurality of bonding pads; forming a conductive etch-barrier layer overlying and electrically coupled to the plurality of bonding pads; and forming a conductive layer overlying the conductive etch-barrier layer, wherein the conductive layer is electrically coupled to the plurality of bonding pads, and whereby the conductive etch-barrier layer protects the plurality of bonding pads when the conductive layer is patterned and etched to form a contact pad overlying at least one of the plurality of bonding pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of manufacturing integrated circuit die that have been tested at the wafer level comprising the steps of:
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providing a semiconductor substrate having a plurality of integrated circuit die formed thereon, wherein each integrated circuit die has a plurality of bonding pads extending to an upper surface of the semiconductor substrate; forming a etch-barrier layer overlying the upper surface, wherein the etch-barrier layer is electrically coupled to the plurality of bonding pads; forming a conductive layer overlying the etch-barrier layer, wherein the conductive layer is electrically coupled to the plurality of bonding pads; patterning the conductive layer and the etch-barrier layer such that each integrated circuit die is uniquely electrically coupled; electrically testing the plurality of integrated circuit die; removing at least a portion of the conductive layer; and removing at least a portion of the etch-barrier layer. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification