Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module

• US 5,598,032 A
• Filed: 02/13/1995
• Issued: 01/28/1997
• Est. Priority Date: 02/14/1994
• Status: Expired due to Term

• Current Assignee: Gemplus International SA (Thales SA)
• Original Assignee: Gemplus International SA (Thales SA)
• Inventors: Fidalgo, Jean-Christophe
• Primary Examiner(s): BROWN, PETER T
• Application Number:
  US08/388,102
• Time in Patent Office: 715 Days
• Field of Search: 340/572, 343/741-744, 343/787, 343/788, 343/702, 343/872, 343/873, 343/866, 257/679, 257/531, 257/728, 235/492, 235/493
• US Class Current: 257/679
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07769 the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H05K 1/183 : Components mounted in and supported by recessed areas of the printed circuit board

Abstract

A contact-free card and a method for the manufacture of such a card. The card comprises a card body, an electronic module having an integrated chip card and two contact zones, and an antenna connected to the contact zones of said module by two contact terminals, wherein said module furthermore has contact pads connected to said chip for a contact-using operation of said card. Said method has a step according to which a layer of the card body is negative-molded on the antenna and a cavity is made in the card body, revealing said contact terminals of the antenna, followed by a step according to which the electronic module is mounted in the cavity of the card body. The invention can be applied to the manufacture of contact-free cards, which may or may not be combined and designed, for example, for remote cash type of operations.

Claims

1. A hybrid chip card comprising

an electronic module having

an integrated circuit chip,

contact pads connected to said integrated circuit chip for a contact-using operation of said card, and

first and second contact zones;

a card body, the card body having a cavity formed therein for holding the electronic module, and the cavity opening out on a face of the card body for receiving the electronic module; and

an antenna, the antenna having first and second contacts situated in the cavity, and the antenna being connected to said first and second contact zones of said electronic module via the first and second contacts.

2. A card according to claim 1, wherein the first and second contact zones of the electronic module are located on lower faces of respective contact pads connected to the integrated circuit chip.

3. A hybrid chip card according to claim 2, wherein the first and second contact zones are connected to the integrated circuit chip.

4. A card according to claim 1, wherein the contact pads are flush with the surface of the card.

5. A card according to claim 1, wherein the first and second contact zones are connected to the first and second contacts of the antenna via first and second intermediary conductors.

6. A hybrid chip card according to claim 5, wherein the first and second intermediary conductors are both one of metal tongues and metal springs.

7. A hybrid chip card according to claim 5, wherein the first and second intermediary conductors are both formed of a conductive resin.

8. A hybrid chip card according to claim 5, wherein the cavity has a flat shoulder, wherein first and second apertures extend through the flat shoulder and open into contacts, and wherein the first and second intermediary conductors are located in the apertures.

9. A hybrid chip card according to claim 1, wherein the first and second contacts are terminal contacts.

10. A hybrid chip card according to claim 1, wherein the antenna is in the shape of a spiral, the first contact being on the inside of the spiral, and the second contact being on the outside of the spiral.

11. A hybrid chip card according to claim 1, wherein the antenna is entirely coated and embedded in a bonder except at the location of the first and second contacts.

12. A hybrid chip card according to claim 1, wherein the cavity has a bottom and wherein the first and second contacts appear at the bottom of the cavity.

13. A hybrid chip card according to claim 1, wherein the cavity has dimensions which substantially match those of the electronic module.

14. A hybrid chip card according to claim 1, wherein the cavity has a flat-bottomed parallelepiped recess.

15. A hybrid chip card according to claim 1, wherein the cavity has a flat shoulder, and wherein the first and second apertures extend through the flat shoulder and open into contacts.

16. A hybrid chip card according to claim 1, wherein the first and second contact zones are connected to the integrated circuit chip.

17. A hybrid chip card for communicating with first and second chip card readers, the hybrid chip card comprising:

an electronic module, the electronic module further including

an integrated circuit chip,

a plurality of contact pads connected to the integrated circuit chip, the contact pads defining a first means for communicating with the first chip card reader;

first and second contact zones, the first contact zone being located on a lower face of a first one of the plurality of contact pads, and the second contact zone being located on a lower face of a second one of the plurality of contact pads,

a card body, the card body having a cavity formed therein for holding the electronic module, and the cavity opening out on a face of the card body for receiving the electronic module; and

an antenna, the antenna being connected to the first and second contact zones of the electronic module, and the antenna defining a second means for communicating with the second chip card reader.

18. A hybrid chip card according to claim 17, wherein the contact pads are flush with the surface of the hybrid chip card.

19. A hybrid chip card according to claim 17, wherein the card body further comprises a thermoplastic sheet, and wherein the antenna is disposed on an outer surface of the thermoplastic sheet.

20. A hybrid chip card according to claim 19, wherein the antenna is in the shape of a spiral, wherein the antenna further comprises first and second contacts, wherein the first contact is on the inside of the spiral, wherein the second contact is on the outside of the spiral, and wherein the first and second contact terminals connect the antenna to the first and second contact zones of the electronic module.

21. A hybrid chip card according to claim 20, wherein the first and second contacts are disposed directly below the electronic module.

22. A hybrid chip card according to claim 17, further comprising a thermoactivable bonder, the thermoactivable bonder forming a coating of the antenna.

23. A hybrid chip card according to claim 20, wherein the antenna comprises first and second contacts, and wherein the first and second contact zones are connected to the first and second contacts of the antenna via first and second intermediary conductors.

24. A hybrid chip card according to claim 23, wherein the first and second intermediary conductors are both one of metal tongues and metal springs.

25. A hybrid chip card according to claim 23, wherein the first and second intermediary conductors are both formed of a conductive resin.

26. A hybrid chip card according to claim 23, wherein the cavity has a flat shoulder, wherein first and second apertures extend through the flat shoulder and open into contacts and wherein the first and second intermediary conductors are located in the apertures.

27. A hybrid chip card according to claim 17, wherein the antenna comprises first and second contacts, and wherein the first and second contacts are terminal contacts.

28. A hybrid chip card according to claim 17, wherein the antenna is in the shape of a spiral, wherein the antenna further comprises first and second contacts, wherein the first contact is on the inside of the spiral, and wherein the second contact is on the outside of the spiral.

29. A hybrid chip card according to claim 17, wherein the antenna comprises first and second contacts, and wherein the antenna is entirely coated and embedded in a bonder except at the location of the first and second contacts.

30. A hybrid chip card according to claim 17, wherein the antenna comprises first and second contacts, wherein the cavity has a bottom, and wherein the first and second contacts appear at the bottom of the cavity.

31. A hybrid chip card according to claim 17, wherein the cavity has dimensions which substantially match those of the electronic module.

32. A hybrid chip card according to claim 17, wherein the cavity has a flat-bottomed parallelepiped recess.

33. A hybrid chip card according to claim 17, wherein the cavity has a flat shoulder, and wherein first and second apertures extend through the flat shoulder and open into contacts.

34. A hybrid chip card according to claim 17, wherein the first and second contact zones are connected to the integrated circuit chip.

35. A hybrid chip card according to claim 17, wherein the antenna comprises first and second contacts, wherein the antenna is connected to the first and second contact zones via the first and second contacts, and wherein the first and second contacts are situated in the cavity.