Capacitive pressure sensor and method for making the same

• US 5,600,072 A
• Filed: 06/23/1995
• Issued: 02/04/1997
• Est. Priority Date: 06/23/1995
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Chen, Shiuh-Hui S., Ross, Carl
• Primary Examiner(s): Chilcot, Richard
• Assistant Examiner(s): Oen, William L.
• Application Number:
  US08/494,127
• Time in Patent Office: 592 Days
• Field of Search: 73/718, 73/724, 73/754, 361/25.41, 361/283.3
• US Class Current: 73/724
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm

Abstract

A sensor (44) having all electrical connection formed on one of the sensor'"'"'s sides. A first substrate (10) operably attached to a second substrate (32) where the second substrate includes at least one feedthrough hole (22). A first electrical connection (36) is formed on the first substrate (10) through the feedthrough hole (22). A second electrical connection (38) is formed on the second substrate (32) such that the first and second electrical connections (36, 38) are formed on the same side of the sensor (44). An electrical insulator (26) is disposed between the second substrate (32) and the first electrical connection (36) to electrically isolate the first electrical connection (36) from the second substrate (32).

Claims

1. A pressure sensor comprising:

a first substrate presenting a top and a bottom surface;

a second substrate presenting a top and a bottom surface and having structure defining a feedthrough hole therein;

a first dielectric layer disposed on at least a portion of one of the first substrate'"'"'s bottom surface and the second substrate'"'"'s top surface and wherein the second substrate'"'"'s top surface is attached to the first substrate'"'"'s bottom surface such that a hermetically sealed cavity is defined between the first and second substrates by the first dielectric layer such that the first substrate functions as a diaphragm;

a first electrical connection disposed on the first substrate'"'"'s bottom surface through the feedthrough hole;

a second electrical connection disposed on the second substrate'"'"'s bottom surface;

an electrical insulator disposed on a side wall of the feedthrough hole for electrically isolating the first electrical connection from the second substrate; and

wherein the sensor defined herein allows the first and second electrical connections to be formed approximate the second substrate'"'"'s bottom surface.

2. The sensor of claim 1 wherein the first substrate includes a passivation layer for reducing leakage current between the first and second substrates.

3. The sensor of claim 1 wherein the first and second substrates are formed of silicon.

4. The sensor of claim 1 wherein the first and second substrates present first and second cross sectional areas, respectively, and wherein the first cross sectional area is adjusted relative to the second cross sectional area for controlling parasitic capacitance.

5. The sensor of claim 1 wherein the first substrate further includes a boss.

6. The sensor of claim 1 wherein the sensor is constructed in touch mode.

7. The sensor of claim 1 wherein the dielectric layer is formed of silicon oxide.

8. The sensor of claim 1 further including a second dielectric layer disposed on the second substrate for electrically isolating the second substrate from the first substrate.

9. The sensor of claim 1 wherein the first electrical connection is formed essentially only on the first substrate.

10. The sensor of claim 1 wherein the first electrical connection is formed from the first substrate, along a side wall of the feedthrough hole, to the second substrate'"'"'s bottom surface.