Chemically grafted electrical devices

• US 5,600,099 A
• Filed: 12/02/1994
• Issued: 02/04/1997
• Est. Priority Date: 12/02/1994
• Status: Expired due to Term

• Current Assignee: Thomas & Betts International Incorporated (ABB Limited)
• Original Assignee: Augat, Inc. (TE Connectivity Ltd. (United Kingdom))
• Inventors: Hanrahan, Mark G., Pickles, Charles S., Crotzer, David R.
• Primary Examiner(s): TSO, LAURA K
• Application Number:
  US08/348,574
• Time in Patent Office: 795 Days
• Field of Search: 174/261, 174/254, 174/257, 174/256, 174/262, 174/266, 361/749, 361/751, 439/67, 439/77, 439/59, 439/75, 439/82, 439/81, 439/45
• US Class Current: 174/257
• CPC Class Codes: H01R 13/035 Plated dielectric material
• CPC Class Codes: H01R 13/6599 Dielectric material made conductive, e.g. plastic material coated with metal
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer elastomeric conductor H05K2201/0314
• CPC Class Codes: H05K 2201/0329 Intrinsically conductive polymer [ICP]; Semiconductive polymer
• CPC Class Codes: H05K 2203/1168 Graft-polymerization
• CPC Class Codes: H05K 3/102 by bonding of conductive powder, i.e. metallic powder H05K3/12 takes precedence
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: H05K 3/38 Improvement of the adhesion between the insulating substrate and the metal

Abstract

An electrical device is provided having a conductive coating or layer chemically grafted to a support substrate to produce a durable, conductive surface permanently attached to the underlying substrate material. The grafted layer can be embodied in an electrical contact, and can also be embodied as electrical traces and contact areas of circuit boards and electrical and electronic devices and components. In another embodiment, the grafted layer can be provided in an RFI/EMI shield or ground plane.

Claims

1. An electrical device comprising:

a substrate having a surface;

a conductive layer composed of a plurality of conductive particles each having a conductive coating;

the conductive coatings of the particles being chemically bonded together and to the substrate surface.

2. The electrical device of claim 1 wherein the conductive layer is composed of a plurality of conductive particles each having a conductive polymer coating.

3. An electrical material comprising:

a substrate having a surface;

a conductive coating chemically bonded to the substrate surface, the conductive coating composed of a chemically bonded conductive polymer matrix containing conductive particles.

4. The electrical material of claim 3 wherein the substrate is non-conductive.

5. The electrical material of claim 4 wherein the substrate is rigid.

6. The electrical material of claim 4 wherein the substrate is flexible.

7. The electrical material of claim 4 wherein the conductive coating is applied to selected areas of the substrate surface.

8. The electrical material of claim 3 wherein the substrate is conductive.

9. The electrical material of claim 3 further including an additional conductive layer disposed over the conductive layer.

10. The electrical material of claim 3 wherein the conductive particles are metal.

11. The electrical material of claim 3 wherein the substrate is flexible and wherein the conductive coating is flexible.

12. An electrical interconnect comprising:

an elongated body of thermosetting material shaped to mate with a corresponding electrical contact element;

a conductive layer chemically grafted to at least a portion of the surface of the thermosetting material;

the thermosetting material being sized to be insertable into the mating electrical contact element and operative to expand in response to applied heat to form a permanent gas tight seal between the grafted conductive surface and a mating conductive surface of the electrical contact element.

13. An electrical interconnect comprising:

at least one annular ring having a resilient core and a chemically grafted conductive layer thereon;

the annular ring being disposed around and in alignment with an opening in a substrate, the conductive layer of the annular ring being in electrical contact with a conductive element on the substrate;

the opening through the annular ring being smaller than the dimension of an electrical terminal inserted therethrough such that a compressive force is provided between the inserted electrical terminal and the surrounding ring.

14. An electrical interconnect comprising:

a substrate of rigid material having on at least a portion of one surface thereof a resilient material; and

a conductive material chemically grafted to the exposed surface of the resilient material to provide a flexible conductive contact area, said conductive material composed of a chemically bonded polymer matrix containing conductive particles.