Probe apparatus having reduced misalignment of conductive needles

• US 5,600,137 A
• Filed: 10/20/1995
• Issued: 02/04/1997
• Est. Priority Date: 10/28/1994
• Status: Expired due to Term

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Yi, You-Wen, Saito, Mitsuchika
• Primary Examiner(s): Berman, Jack I.
• Application Number:
  US08/546,046
• Time in Patent Office: 473 Days
• Field of Search: 250/306, 369/126
• US Class Current: 850/56
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: G11B 9/14 using microscopic probe means , i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information marking using electrical current B41M5/20; measuring roughness or irregularity of surfaces G01B7/34; details of scanning-probe microscopes G01Q
• CPC Class Codes: G11B 9/1418 Disposition or mounting of heads or record carriers G11B17/00 and G11B19/00 take precedence
• CPC Class Codes: Y10S 977/874 Probe tip array

Abstract

A probe apparatus includes a probe group supporting member having a substrate on which probes having conductive needles are formed. The main bodies of the probes are constructed from composite beams, e.g. L-shaped beams, formed by joining a plurality of arms, e.g. first and second arms, which extend from the substrate of the probe group supporting member, and which overhang the substrate in a direction parallel to the surface of the substrate. The conductive needles are attached perpendicular to the substrate surface at a selected point on each of the composite beams.

Claims

1. A probe apparatus, comprising:

a probe group supporting member having a substrate surface on which probes having conductive needles are formed;

wherein main bodies of said probes are constructed from composite beams formed of silicon, said composite beams being formed by joining a plurality of arms which extend from the substrate of the probe group supporting member, and which overhang said substrate in a direction parallel to the surface of said substrate, said composite beams further comprising a first arm which functions as a first wiring arrangement and a second arm which functions as a second wiring arrangement;

wherein said first arm further comprises an electrode that generates an electrostatic force between said arm and said substrate, said electrode being connected either to said first wiring arrangement or between said arm and a member other than said substrate;

wherein said first arm and said second arm are insulated from each other by either a PNP junction or an NPN junction; and

wherein said conductive needles are attached perpendicular to the substrate surface at a point on each of said composite beams.

2. The probe apparatus of claim 1, wherein at least one of the arms making up each composite beam further comprises:

a first wiring arrangement which is connected to a probe driving device; and

wherein at least one of the other arms of each composite beam further comprises;

a second wiring arrangement which is connected to an electrical circuit that is used to apply a prescribed voltage to said conductive needles;

wherein said first wiring arrangement and said second wiring arrangement are insulated from each other.

3. The probe apparatus of claim 1, wherein said composite beams are constructed from roughly L-shaped beams, each beams consisting of a first arm and a second arm which project in an overhanging manner parallel to the surface of the substrate of the probe group supporting member;

wherein end parts of the first and second arms located at the opposite ends of said arms from a corner part of the L-shaped beam are fastened to the substrate of the probe group supporting member; and

wherein said conductive needles are attached to said corner parts of the L-shaped beams, so that said needles are perpendicular to the surface of the substrate.

4. A probe apparatus having reduced misalignment of conductive needles, comprising:

a probe group supporting member in which probes having conductive needles are formed on a substrate surface;

wherein main bodies of said probes are constructed from folded-back beams which overhang the substrate of the probe group supporting member in a direction parallel to the surface of said substrate;

wherein a member, other than the substrate, and said probes interact through electrostatic force;

wherein initial end parts of said folded-back beams are fastened to the surface of the substrate of the probe group supporting member; and

wherein said conductive needles are attached to final end parts of the folded-back beams.

5. The probe apparatus of claim 4, wherein said folded-back arms further comprise:

a first wiring arrangement which is connected to a probe driving device; and

a second wiring arrangement which is connected to an electrical circuit that is used to apply a prescribed voltage to the conductive needles; and

wherein said first wiring arrangement is insulated from said second wiring arrangement of a second arm.

6. The probe apparatus of claim 5, wherein both an arm on a side which has an initial end and an arm on a side which has a final end further comprise:

electrodes which are used to generate an electrostatic force between said arms and either the surface of the substrate or a member other than said substrate, or by the fact that only the arm on the side which has the final end has such an electrode.

7. The probe apparatus of claim 5, wherein an arm on a side which has a final end further comprises:

an electrode which is used to generate an electrostatic force between said arm and either the surface of the substrate or a member other than said substrate.

8. The probe apparatus of claim 4, further comprising:

electrodes having electrode plates with vanes parallel to the substrate, and wherein said electrode plates interact electrostatically with a member other than said substrate.

9. The probe apparatus of claim 4, wherein portions of said probes that are fastened to said substrate are formed with a narrow width.

10. The probe apparatus of claim 4, wherein portions of said probes on which said conductive needles are formed have a broad width.

11. The probe apparatus of claim 4, wherein said substrate is manufactured from a wafer that consists of a semiconductor surface layer, an insulating intermediate layer, and a semiconductor undersurface layer, and wherin said probe includes main bodies that are formed from said semiconductor surface layer of said wafer.