Low power infrared scene projector array and method of manufacture
First Claim
1. An apparatus for emitting a wide-band infrared image, comprising:
- a semiconductor substrate having a plurality of cavities therein;
address means disposed on the substrate proximate the plurality of cavities for routing electrical signals to various portions of the substrate, wherein the electrical signals include a pixel addressing signal, a voltage signal, and drive voltage;
at least two emitter pixel members coupled to the address means and each disposed above one of the plurality of cavities in the substrate wherein each emitter pixel member comprises a two-level microstructure;
a first level bearing a transistor means, and a second level, set apart and disposed above the first level, and comprising the emitter pixel member, wherein the first level is made of silicon nitride and wherein the second level has an absorber layer and the first level has a reflector layer opposite of and facing the absorber layer;
means for connecting, supporting, and thermally isolating each pixel member from the substrate;
a trace of electrically resistive material coupled to each pixel member and at least one leg physically and electrically coupled to the substrate;
electronic control means for electrically coupling the pixel addressing signal, the voltage signal, and the drive voltage to each emitter pixel member; and
,transistor means for driving a controlled amount of electrical current through the trace of electrically resistive material and for maintaining the temperature of the trace.
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Accused Products
Abstract
An array for projecting thermal images and a method of making same. The array of the present invention combines a two-tier architecture created with special processing whereby each pixel member resides on an elevated platform directly over discrete pixel control electronics and electrically conducting traces couple a plurality of pixels so that they can be controlled to project thermal images at equal to or faster than video frame rates. Microlens assemblies coupled to each discrete pixel improves the thermal efficiency of the array for certain applications. In the method of fabrication, a semiconductor microbridge-type structure obtains with the use of sacrificial layers under deposited pixel members in a compact array so that the pixel electronics reside beneath their associated pixel and the array electronics inhabit the same chip as the array thereby improving fill factor and time constant of the resulting array.
141 Citations
13 Claims
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1. An apparatus for emitting a wide-band infrared image, comprising:
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a semiconductor substrate having a plurality of cavities therein; address means disposed on the substrate proximate the plurality of cavities for routing electrical signals to various portions of the substrate, wherein the electrical signals include a pixel addressing signal, a voltage signal, and drive voltage; at least two emitter pixel members coupled to the address means and each disposed above one of the plurality of cavities in the substrate wherein each emitter pixel member comprises a two-level microstructure;
a first level bearing a transistor means, and a second level, set apart and disposed above the first level, and comprising the emitter pixel member, wherein the first level is made of silicon nitride and wherein the second level has an absorber layer and the first level has a reflector layer opposite of and facing the absorber layer;means for connecting, supporting, and thermally isolating each pixel member from the substrate; a trace of electrically resistive material coupled to each pixel member and at least one leg physically and electrically coupled to the substrate; electronic control means for electrically coupling the pixel addressing signal, the voltage signal, and the drive voltage to each emitter pixel member; and
,transistor means for driving a controlled amount of electrical current through the trace of electrically resistive material and for maintaining the temperature of the trace. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification