Micromechanical component part and method for the manufacture thereof

• US 5,600,190 A
• Filed: 05/13/1994
• Issued: 02/04/1997
• Est. Priority Date: 05/19/1993
• Status: Expired due to Term

• Current Assignee: Infineon Technologies AG
• Original Assignee: Siemens AG
• Inventors: Zettler, Thomas
• Primary Examiner(s): Dougherty, Thomas M.
• Assistant Examiner(s): JONES, JUDSON
• Application Number:
  US08/242,336
• Time in Patent Office: 998 Days
• Field of Search: 310/40 MM, 310/42, 310/309, 156/633.1, 156/634.1, 156/657.1, 156/662.1, 156/631.1, 428/209, 428/210, 428/704
• US Class Current: 310/40.0MM
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H02N 1/002 Electrostatic motors

Abstract

A micromechanical component, for example a motor, wherein micromechanical structures such as a rotor, rotational axle, and stator, are manufactured of the same layer or multiple layer of, for example, CVD tungsten deposited in corresponding trenches. As a result thereof, no alignment problems arise. The static micromechanical structures are connected to the underlying substrate with electrical and/or mechanical connecting means, whereby retaining the movable micromechanical structure to a substrate can be simultaneously achieved. The manufacturing process is compatible with the production of integrated circuits on silicon and requires only three photolevels.

Claims

1. A micromechanical arrangement, comprising:

a substrate;

a static micromechanical structure;

a movable micromechanical structure, said static and movable micromechanical structures formed from a layer applied on a top side of the substrate;

means for connecting the static structure to the substrate, said means for connecting formed of a fixing layer deposited into a hole of said static structure and connecting said static structure to said substrate and extending up vertically into said hole of the static structure.

2. The micromechanical arrangement according to claim 1, wherein the movable micromechanical structure is retained onto the substrate by the connecting means.

4. The micromechanical arrangement according to claim 1, wherein the movable micromechanical structure comprises bushings for seating on the substrate or an insulating layer on the substrate and having a small seating area.

3. A micromechanical arrangement, comprising:

a substrate;

a static micromechanical structure;

a movable micromechanical structure, said static and movable micromechanical structures formed from a layer applied on a top side of the substrate;

means for connecting the static structure to the substrate, said means for connecting formed of a fixing layer extending up vertically into said hole of the static structure;

wherein the substrate is covered with at least one insulating layer having an essentially planar surface and wherein said means for connecting includes electrically connecting said static structure to said substrate wherein said substrate comprises a contact region for the means for connecting.

5. A micromechanical arrangement, comprising:

a substrate;

a static micromechanical structure;

a movable micromechanical structure, said static and movable micromechanical structures formed from a layer applied on a top side of the substrate;

means for connecting the static structure to the substrate, said means for connecting formed of a fixing layer extending up vertically from the substrate into the static structure;

wherein the static and movable micromechanical structures and the means for connecting are essentially composed of tungsten.

6. A micromechanical arrangement, comprising:

a substrate;

a static micromechanical structure;

a movable micromechanical structure, said static and movable micromechanical structures formed from a layer applied on a top side of the substrate;

means for connecting the static structure to the substrate, said means for connecting formed of a fixing layer extending up vertically from the substrate into the static structure;

further comprising a rotational axle fashioned as a hollow member, and said static micromechanical structure comprises a stator, and said movable micromechanical structure comprises a rotor, and said means for connecting is formed by a further conductive layer that at least partially covers the surface of the rotational axle and is connected to the substrate through the hollow member and that at least partially covers the surface of the stator and is connected to a contact region in the substrate.

7. A micromechanical arrangement comprising:

a substrate;

a static micromechanical structure;

a movable micromechanical structure, said static and movable micromechanical structures formed from a layer applied on a top side of the substrate;

means for connecting the static structure to the substrate, said means for connecting formed of a fixing layer extending up vertically from the substrate into the static structure;

comprising a gearing, said static structure having a rotational axle fashioned as a hollow member, and said movable structure comprising a rotor; and

comprising a layer as fixing layer that at least partially covers the surface of the rotational axle and is connected to the substrate through the hollow member.