Electrostatic chuck
First Claim
Patent Images
1. An electrostatic chuck comprising:
- a. first and second members;
b. an electrode comprising a metal interposed between and bonding portions of the first and second members by chemically reacting with them; and
c. a non-conductive material, selected from the group consisting of inorganic dielectric filler and organic dielectric filler, interposed between portions of the first and second members not bonded by the metal.
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Abstract
Electrostatic chucks and methods of forming the chucks are disclosed. The chucks include ceramic materials directly bonded with a layer of active braze alloy. The active alloy operates as both a conductive layer of the electrostatic chuck and a mechanism for bonding the dielectric layer to the base of the chuck. Electrical feedthroughs to the electrode may also be formed using the active alloy.
112 Citations
9 Claims
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1. An electrostatic chuck comprising:
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a. first and second members; b. an electrode comprising a metal interposed between and bonding portions of the first and second members by chemically reacting with them; and c. a non-conductive material, selected from the group consisting of inorganic dielectric filler and organic dielectric filler, interposed between portions of the first and second members not bonded by the metal. - View Dependent Claims (2, 3, 4)
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5. An apparatus for securing a semiconductor wafer for processing, comprising:
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a. first and second ceramic members, the first ceramic member defining a conductive feedthrough and a pork; b. an active braze alloy interposed between and bonding portions of the first and second ceramic members, the active braze alloy having a coefficient of thermal expansion greater than that of the first and second ceramic members; c. dielectric filler injected through the port and interposed between the portions of the first and second members not bonded by the active braze alloy; and d. means, electrically connected to the conductive feedthrough, for applying an electrical potential difference between the semiconductor wafer and active braze alloy and immobilizing the semiconductor wafer by electrostatic force. - View Dependent Claims (6)
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7. An electrostatic chuck comprising:
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a. first and second ceramic members, the first ceramic member defining a port; b. an electrode comprising a metal interposed between and bonding at least portions of the first and second ceramic members by chemically reacting with them; and c. dielectric filler injected through the port and interposed between the portions of the first and second ceramic members not bonded by the metal. - View Dependent Claims (8, 9)
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Specification