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Chemical vapor deposition apparatus activated by a microwave plasma

  • US 5,603,771 A
  • Filed: 03/23/1995
  • Issued: 02/18/1997
  • Est. Priority Date: 09/24/1992
  • Status: Expired due to Term
First Claim
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1. Apparatus for plasma activated chemical vapor deposition, the apparatus comprising:

  • a plurality of transformation means, each for transforming the state of a respective precursor of a deposition material to cause each of said respective precursors to pass from an initial state of matter to a gaseous state to provide a plurality of gaseous precursors;

    a plurality of charging means, each for charging respective vector gas with a respective one of said plurality of gaseous precursors to form a plurality of precursor-charged gaseous mixtures;

    a plurality of transfer means, each for transferring a respective one of said predetermined plurality of gaseous mixtures from a respective charging means to a plasma reactor having microwave excitation comprising a reaction enclosure, a microwave generator, and at least one waveguide interposed between said generator and the enclosure and providing non-resonant coupling; and

    injection means for injecting said plurality of gaseous mixtures into said reaction enclosure in the form of a jet of ionized gas;

    each of said plurality of transfer means for transferring a respective one of said plurality of gaseous mixtures being independent of other of said plurality of transfer means, said injection means including a nozzle of frustoconical external profile, said nozzle having an inlet for receiving said plurality of gaseous mixtures from said plurality of transfer means and having at least one injection orifice outlet for injecting said jet of ionized gas into said reaction enclosure, said nozzle being shaped as a function of a desired configuration of said jet of ionized gas, said nozzle being fitted with heating means and with thermal insulation means.

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