Stabilized power supply device using a flip chip as an active component

• US 5,604,383 A
• Filed: 05/11/1995
• Issued: 02/18/1997
• Est. Priority Date: 05/11/1994
• Status: Expired due to Term

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Matsuzaki, Kazuo
• Primary Examiner(s): WHITEHEAD JR, CARL W
• Application Number:
  US08/439,579
• Time in Patent Office: 649 Days
• Field of Search: 257/688, 257/691, 257/697, 257/698, 257/712, 257/728, 257/734, 257/737, 257/738, 257/778, 257/904, 361/702, 361/729, 363/147
• US Class Current: 257/778
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: Y10S 257/904 with passive components,, e.g. polysilicon resistors

Abstract

A stabilized power supply device includes a substrate and a passive part laminate layered on the substrate. The passive part laminate, shaped as a single flat board, includes a thin charge storage film element. A thin magnetic inductive film element is laminated on the thin charge storage film element. The device also includes an active part incorporated in a flip chip. The flip chip, including semiconductors and bump electrodes, is mounted on an upper surface of the passive part laminate. The upper surface of the passive part laminate includes terminals for connecting the passive part laminate to the bump electrodes. This connection also fixes the active part to the passive part laminate.

Claims

1. A stabilized power supply device, comprising:

a substrate;

a passive part laminate layered on said substrate and having a single flat board shape;

said passive part laminate including a thin charge storage film element;

a thin magnetic inductive film element laminated on said thin charge storage film element;

an active part incorporated in a flip chip including semiconductors and bump electrodes;

a plurality of terminals disposed on an upper surface of said passive part laminate for connecting said passive part laminate to said bump electrodes; and

said plurality of terminals being effective for affixing said active part to said passive part laminate.

2. The stabilized power supply device according to claim 1, wherein said substrate is a semiconductor substrate.

3. The stabilized power supply device according to claim 1, wherein said charge storage film element comprises a ferroelectric dielectric film.

4. The stabilized power supply device according to claim 1, wherein said magnetic inductive film element comprises:

upper and lower magnetic films;

a conductor film; and

a shell type structure having a coil formed from said conductor film sandwiched between said upper and lower magnetic films.

5. The stabilized power supply device according to claim 1, wherein said magnetic inductive film element overlaps said charge storage film element.

6. The stabilized power supply device according to claim 4, further comprising:

a wiring layer including a wiring film disposed on said upper surface of said passive part laminate;

said wiring film being other than a conductor of said coil of said magnetic inductive film element, and

said terminals being formed from said wiring film.