Low temperature co-fired ceramic substrates for power converters
First Claim
1. An electronic power converter circuit formed within a low temperature co-fired ceramic substrate comprising:
- (1) a low temperature co-fired ceramic substrate comprising multiple layers; and
(2) an electronic power converter circuit wherein a selected plurality of the passive components thereof are chosen from the group consisting of capacitors, resistors, inductors, and transformers and are formed as an integral part of one or more of said multiple layers of said low-temperature co-fired ceramic substrate.
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Accused Products
Abstract
Electronic power conversion circuitry, for frequencies not exceeding 30 MHz, is manufactured using the benefits of low temperature co-fired ceramic substrates to provide interconnection between the discrete components of the power conversion circuit, and integrate various non-semiconductor devices into the body of the low temperature co-fired ceramic structure, such as resistors, capacitors, inductors and transformers. Use of a low temperature co-fired ceramic structure as a substrate on and within which power conversion circuitry is formed allows selection of various conductive and resistive inks to precisely form interconnection circuitry and selected non-semiconductor components which improves the stability and reduces the cost of power conversion circuits.
111 Citations
16 Claims
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1. An electronic power converter circuit formed within a low temperature co-fired ceramic substrate comprising:
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(1) a low temperature co-fired ceramic substrate comprising multiple layers; and (2) an electronic power converter circuit wherein a selected plurality of the passive components thereof are chosen from the group consisting of capacitors, resistors, inductors, and transformers and are formed as an integral part of one or more of said multiple layers of said low-temperature co-fired ceramic substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. In a power conversion system incorporating a low temperature co-fired ceramic structure containing first and second filter networks,
a low temperature co-fired ceramic structure containing a plurality of buried capacitor, buried inductor and buried resistor elements comprising: -
a plurality of capacitors, inductors and resistors configured to form a first filter network and a plurality of capacitors, inductors and resistors configured to form a second filter network; and an active circuit amplifier means mounted on the external surface of said co-fired ceramic structure, the input to said amplifier means being supplied by the output of said first filter network, the input of said first filter network being supplied by external means, said output of said amplifier means driving the input of said second filter network. - View Dependent Claims (11, 12, 13, 14)
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15. A circuit for use in an electronic power converter formed on and within a low temperature co-fired ceramic substrate and comprising;
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a low temperature co-fired ceramic substrate comprising multiple layers; a plurality of circuit components formed as an integral part of one or more of said multiple layers of said low temperature co-fired ceramic substrate; and a plurality of circuit components mounted on or within said low temperature co-fired ceramic substrate.
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16. A low temperature co-fired ceramic structure containing buried passive circuitry comprising:
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a low temperature co-fired ceramic substrate comprising multiple layers; and passive circuitry formed as an integral part of one or more of said multiple layers of said substrate to provide said buried passive circuitry, wherein; said passive circuitry includes at least one component selected from the class consisting of resistors, capacitors, inductors, and transformers; said buried passive components being surrounded on all sides by non-conductive ceramic material; said buried passive components being interconnected with other buried passive components by way of at least one interconnection means selected from the class consisting of vias and conductive structures; said buried passive components being connected to other components which are not buried through interconnection contact pads which are located on a surface of said low temperature co-fired ceramic structure.
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Specification