Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor

• US 5,605,547 A
• Filed: 03/27/1995
• Issued: 02/25/1997
• Est. Priority Date: 03/27/1995
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Lake, Rickie C.
• Primary Examiner(s): Graybill, David E.
• Application Number:
  US08/410,889
• Time in Patent Office: 701 Days
• Field of Search: 437/216, 437/209, 437/926, 437/183, 437/212, 437/222, 156/583.5, 156/552, 156/555, 29/743, 29/25.01
• US Class Current: 29/25.01
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/75315 Elastomer inlay
• CPC Class Codes: H01L 2224/75317 Removable auxiliary member
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 24/27 Manufacturing methods
• CPC Class Codes: H01L 24/28 Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor

Abstract

A method and apparatus for mounting a component, such as a semiconductor die, to a substrate are provided. A z-axis anisotropic adhesive is applied to the substrate and the component is placed on the anisotropic adhesive. During a curing process a cover film is drawn over the component and substrate to maintain the anisotropic adhesive in compression. A conveyorized curing apparatus includes a conveyor belt for moving the substrate through a heated process chamber. The cover film is mounted on an endless belt and is adapted to move at a same speed as the conveyor belt. As the die and substrate are moved through the process chamber, a vacuum plenum draws the cover film over the die and substrate to exert a uniform force on the component.

Claims

1. A method for mounting a component to a substrate comprising:

placing the component on the substrate with an anisotropic adhesive therebetween;

moving the component and substrate on a conveyor through a chamber;

drawing a cover film moving at a same speed as the conveyor over the component and substrate to compress the anisotropic adhesive;

curing the anisotropic adhesive while under compression; and

withdrawing the cover film from the component and substrate.

2. The method as claimed in claim 1 and wherein the anisotropic adhesive is an adhesive selected from the class consisting of thermoplastic z-axis anisotropic adhesives and thermoset z-axis anisotropic adhesives.

3. The method as claimed in claim 1 and wherein the cover film comprises an endless belt adapted to cover the component and substrate at an entrance of the chamber and withdraw from the component and substrate at an exit of the chamber.

4. The method as claimed in claim 1 and wherein the cover film is formed of a material selected from the group consisting of polymeric and elastomeric materials.

5. The method as claimed in claim 1 and wherein drawing the cover film over the component and substrate is with a vacuum directed through the conveyor.

6. A method for mounting a semiconductor die to a substrate comprising:

applying a z-axis anisotropic adhesive to the substrate or to the die;

placing the die on the substrate;

moving the die and substrate on a conveyor belt through a chamber while drawing a cover film moving at a same speed as the conveyor over the die and substrate to exert a force on the die and compress the anisotropic adhesive between the die and substrate;

curing the anisotropic adhesive while under compression; and

withdrawing the cover film from the die and substrate.

7. The method as claimed in claim 6 and wherein the z-axis anisotropic adhesive is an adhesive selected from the class consisting of thermoset anisotropic adhesives and thermoplastic anisotropic adhesives.

8. The method as claimed in claim 6 and wherein the z-axis anisotropic adhesive is applied to the die or to the substrate as a paste.

9. The method as claimed in claim 6 and wherein the z-axis anisotropic adhesive is applied to the die or to the substrate as a film.

10. The method as claimed in claim 6 and wherein the cover film is adapted to exert a force on the die of between 1 lb/in² to 20 lbs/in².

11. The method as claimed in claim 6 and wherein the die and substrate are moved by the conveyor belt through the chamber at a speed selected to provide a curing time of from 20-30 minutes.

12. The method as claimed in claim 6 and wherein the cover film is drawn over the die and substrate by a vacuum provided by a vacuum plenum located subjacent to the conveyor belt and in flow communication with a vacuum source.

13. The method as claimed in claim 6 and wherein the cover film comprises an endless belt adapted to cover the die and substrate at an entrance of the chamber and withdraw from the die and substrate at an exit of the chamber.

14. The method as claimed in claim 6 and wherein the cover film comprises a material selected from the group consisting of polymeric and elastomeric materials.

15. The method as claimed in claim 6 and wherein the chamber is heated to a temperature of between 100°

C. to 300°

C.

16. A method for flip chip mounting a semiconductor die to a substrate comprising:

providing the substrate with a contact pad;

applying a z-axis anisotropic adhesive to the contact pad;

placing the die on the anisotropic adhesive;

placing the die and substrate on a conveyor belt adapted to move through a heated process chamber;

drawing a cover film over the die and substrate using a vacuum directed through the conveyor belt, said cover film adapted to apply a force to the die and compress the anisotropic adhesive for establishing an electrical connection between a contact location on the die and the contact pad on the substrate;

curing the anisotropic adhesive while under compression; and

withdrawing the cover film from the die and substrate.

17. The method as claimed in claim 16 and wherein the cover film comprises an endless belt driven by drive rollers.

18. The method as claimed in claim 16 and wherein the cover film moves at a same speed as the conveyor belt.

19. The method as claimed in claim 16 and wherein the vacuum is directed through the conveyor belt by a vacuum plenum located subjacent to the conveyor belt.

20. An apparatus for curing an anisotropic adhesive placed between a component and substrate, said apparatus comprising:

a process chamber;

a heat source for heating the process chamber;

a conveyor for moving the substrate through the process chamber;

an endless belt of cover film configured to move through the process chamber at a same speed as the substrate and die; and

a vacuum plenum in fluid communication with a vacuum source, said vacuum plenum adapted to draw the cover film over the substrate and component to exert a force on the component and compress the anisotropic adhesive during curing.

21. The apparatus as claimed in claim 20 and wherein the anisotropic adhesive is an adhesive selected from the class consisting of thermoplastic and thermosetting z-axis anisotropic adhesives.

22. The apparatus as claimed in claim 20 and wherein the cover film is mounted on a pair of rollers.

23. The apparatus as claimed in claim 20 and wherein the cover film is formed of a material selected from the group consisting of polymeric and elastomeric materials.