Inspecting method for semiconductor devices
First Claim
1. An inspecting method for a semiconductor device, comprising:
- a first step of fixing a semiconductor wafer on an expandable sheet, said semiconductor wafer being formed with a plurality of semiconductor chips each having a test electrode;
a second step of dividing said plural semiconductor chips from each other by dicing said semiconductor wafer fixed on said sheet without dividing said sheet;
a third step of aligning a contactor for supplying an electric signal to said test electrode of each semiconductor chip against said semiconductor wafer after performing said dicing operation, and fixing said semiconductor wafer to said contactor; and
a fourth step of heating said semiconductor wafer fixed to said contactor so as to expand a gap between adjacent semiconductor chips in response to thermal expansion of said contactor, and then performing a burn-in on all of said plural semiconductor chips.
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Accused Products
Abstract
A semiconductor wafer is affixed on a dicing sheet having an appropriate expansibility. Then, a dicing operation is performed on the semiconductor wafer without dividing the dicing sheet, thereby dividing a plurality of semiconductor chips from each other. After aligning a contactor against the semiconductor wafer, the semiconductor wafer is fixed to the contactor. In this case, protrusions provided on the contactor are inserted into the gap between semiconductor chips. The protrusions cause a shift movement toward the peripheral edge of the contactor in response to thermal expansion of the contactor, thereby expanding the gap between semiconductor chips. Then a burn-in is performed on all of the plural semiconductor chips of which gap is expanded.
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Citations
18 Claims
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1. An inspecting method for a semiconductor device, comprising:
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a first step of fixing a semiconductor wafer on an expandable sheet, said semiconductor wafer being formed with a plurality of semiconductor chips each having a test electrode; a second step of dividing said plural semiconductor chips from each other by dicing said semiconductor wafer fixed on said sheet without dividing said sheet; a third step of aligning a contactor for supplying an electric signal to said test electrode of each semiconductor chip against said semiconductor wafer after performing said dicing operation, and fixing said semiconductor wafer to said contactor; and a fourth step of heating said semiconductor wafer fixed to said contactor so as to expand a gap between adjacent semiconductor chips in response to thermal expansion of said contactor, and then performing a burn-in on all of said plural semiconductor chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An inspecting method for a semiconductor device, comprising:
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a first step of fixing a semiconductor wafer on a substrate, said semiconductor wafer being formed with a plurality of semiconductor chips each having a test electrode, said substrate having substantially the same thermal expansion coefficient as that of a contactor which has probe terminals each supplying an electric signal to said test electrode of each semiconductor chip; a second step of dividing said plural semiconductor chips by dicing said semiconductor wafer fixed on said substrate without dividing said substrate; a third step of aligning said contactor against said semiconductor wafer subjected to said dicing operation, and bringing said test electrode of each semiconductor chip into contact with a corresponding probe terminal of said contactor; and a fourth step of heating said semiconductor wafer fixed to said substrate so as to expand a gap between adjacent semiconductor chips in response to thermal expansion of said substrate, and then performing a burn-in on all of said plural semiconductor chips. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification