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Inspecting method for semiconductor devices

  • US 5,605,844 A
  • Filed: 03/27/1996
  • Issued: 02/25/1997
  • Est. Priority Date: 03/31/1995
  • Status: Expired due to Term
First Claim
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1. An inspecting method for a semiconductor device, comprising:

  • a first step of fixing a semiconductor wafer on an expandable sheet, said semiconductor wafer being formed with a plurality of semiconductor chips each having a test electrode;

    a second step of dividing said plural semiconductor chips from each other by dicing said semiconductor wafer fixed on said sheet without dividing said sheet;

    a third step of aligning a contactor for supplying an electric signal to said test electrode of each semiconductor chip against said semiconductor wafer after performing said dicing operation, and fixing said semiconductor wafer to said contactor; and

    a fourth step of heating said semiconductor wafer fixed to said contactor so as to expand a gap between adjacent semiconductor chips in response to thermal expansion of said contactor, and then performing a burn-in on all of said plural semiconductor chips.

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