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Method and structure for polishing a wafer during manufacture of integrated circuits

  • US 5,607,341 A
  • Filed: 08/08/1994
  • Issued: 03/04/1997
  • Est. Priority Date: 08/08/1994
  • Status: Expired due to Fees
First Claim
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1. An apparatus for removing a portion of a wafer, said apparatus comprising:

  • a plurality of blocks reciprocally mounted such that an eroding surface of each block of said plurality of blocks is parallel to a surface of said wafer in contact with said plurality of blocks;

    means for forcing each of said blocks against said wafer, wherein said means for forcing exerts a first force on a first block of said plurality of blocks and said means for forcing exerts a second force on a second block of said plurality of blocks such that said first force and said second force are independent of each other; and

    means for causing relative motion between said plurality of blocks and said wafer, said apparatus removing a portion of said wafer during said relative motion;

    wherein the eroding surface of each of said blocks has an area sufficient for said block to be supported by three regions on said wafer, each region having the slowest rate of material removal in said wafer.

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