Method of manufacturing a circuit assembly
First Claim
1. A method of manufacturing a circuit assembly including a circuit board having first and second sides with at least one electronic component mounted on each of said sides, and a heat sink attached to said circuit board, said heat sink having first and second sides, said first side having a recessed portion, said second side of said circuit board and said first side of said heat sink each having corresponding mating surfaces, comprising the steps of:
- dispensing a thermally conductive, heat curable adhesive onto at least one of said mating surfaces;
aligning said mating surfaces such that said at least one component on said second side of said circuit board fits within said recessed portion of said heat sink; and
urging said mating surfaces towards one another and applying heat through said heat sink to cure said adhesive, such that said components are exposed to a lesser amount of heat than said adhesive.
2 Assignments
0 Petitions
Accused Products
Abstract
A method of manufacturing a circuit assembly is provided. The circuit assembly (10) manufactured according to the present invention includes a circuit board (12) and a heat sink (22). The circuit board (12) has a first side (16) and a second side (20), and each of these sides (16, 20) has one or more electronic components (14, 18) mounted thereon. The heat sink (22) also includes a first side (34) and a second side (43), the first side (34) having a recessed portion (24) therein. The method of manufacturing the circuit assembly (10) includes the step of dispensing a heat curable adhesive (26) between the mating surfaces (30, 32) of the second side (20) of the circuit board (12) and the first side (34) of the heat sink (22). The method also includes the step of positioning the circuit board (12) such that the component (18) on its second side (20) is aligned with the recessed portion (24) of the heat sink (22). The method further includes the step of urging the mating surfaces (30, 32) towards one another and applying heat through the heat sink (22) to cure the adhesive (26).
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Citations
16 Claims
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1. A method of manufacturing a circuit assembly including a circuit board having first and second sides with at least one electronic component mounted on each of said sides, and a heat sink attached to said circuit board, said heat sink having first and second sides, said first side having a recessed portion, said second side of said circuit board and said first side of said heat sink each having corresponding mating surfaces, comprising the steps of:
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dispensing a thermally conductive, heat curable adhesive onto at least one of said mating surfaces; aligning said mating surfaces such that said at least one component on said second side of said circuit board fits within said recessed portion of said heat sink; and urging said mating surfaces towards one another and applying heat through said heat sink to cure said adhesive, such that said components are exposed to a lesser amount of heat than said adhesive. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of manufacturing a circuit assembly including a circuit board having first and second sides with at least one electronic component mounted on each of said sides, and a heat sink attached to said circuit board, said heat sink having first and second sides, said first side having a recessed portion, said second side of said circuit board and said first side of said heat sink each having corresponding mating surfaces, comprising the steps of:
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dispensing a thermally conductive, heat curable adhesive onto at least one of said mating surfaces; aligning said mating surfaces such that said at least one component on said second side of said circuit board fits within said recessed portion of said heat sink; placing said heat sink in a tool having a platen and a heated base, said tool being operable between an open and a closed position; placing one or more projections between said platen and said circuit board; moving said tool from said open position to said closed position and causing said one or more projections to urge said mating surfaces together to distribute said adhesive between said mating surfaces; and applying heat through said heat sink to cure said adhesive such that said components are exposed to a lesser amount of heat than said adhesive. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification