Die bond touch down detector

• US 5,608,172 A
• Filed: 03/16/1995
• Issued: 03/04/1997
• Est. Priority Date: 03/16/1995
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: de Magalhaes Machado, Ricardo J. S., Cardoso, Andre G. M.
• Primary Examiner(s): Dougherty, Elizabeth L.
• Application Number:
  US08/405,332
• Time in Patent Office: 719 Days
• Field of Search: 73/862.541, 73/862.542, 73/862.627, 73/862.632, 73/862.634, 228/8, 228/103, 228/104
• US Class Current: 73/862.541
• CPC Class Codes: G01L 5/0076 Force sensors associated with manufacturing machines G01L5/0066, G01L5/0071 and B23Q17/09 take precedence; for the specific machine or operation involved see relevant class, e.g. B21 - B42

Abstract

A die bond touch down detector (20) includes a strain gauge circuit (22) having a plurality of strain gauges (12) formed into a wheatstone bridge configuration. The strain gauges (12) are mounted on a die bond head (10) and measure and detect deformations of the die bond head (10). The strain gauge circuit (22) generates a differential output signal in response to deformations detected by the strain gauges (12). The differential output signal is amplified, filtered, and converted to digital format for processing by a microcontroller (36). The microcontroller (36) performs calibration, display formatting, and touch down signal generation. The die bond touch down detector (20) provides real time monitorization, automatic calibration, and real force applied information for the die bond head (10).

Claims

1. A die bond touch down detector circuit, comprising:

a plurality of strain gauges operable to detect deformations of a die bond head;

an amplifier operable to amplify an output signal from said plurality of strain gauges;

a filter operable to eliminate noise from said output signal; and

a microprocessor operable to process said output signal in order to generate a touch down signal indicating that said die bond head has come in contact with an obstacle, wherein said microprocessor performs calibration of positioning equipment that positions said die bond head.

2. The die bond touch down detector circuit of claim 1, wherein said plurality of strain gauges are formed into a wheatstone bridge.

3. The die bond touch down detector circuit of claim 2, wherein said wheatstone bridge includes two half bridges, each half bridge having first and second strain gauges, said first and second strain gauges having opposite resistance variations.

4. The die bond touch down detector circuit of claim 2, wherein said wheatstone bridge includes a first and a second half bridge, said first and second half bridges having opposite equivalent resistance variations.

5. The die bond touch down detector circuit of claim 1, wherein said microprocessor generates display values from said output signal.

6. The die bond touch down detector circuit of claim 1, wherein said microprocessor calibrates said positioning equipment that positions said die bond head by establishing two reference points through a linear regression method.

7. The die bond touch down detector circuit of claim 6, further comprising:

a non-volatile memory operable to store calibration parameters for said microprocessor.

8. The die bond touch down detector circuit of claim 1, further comprising a gain circuit coupled to said amplifier, said gain circuit operable to adjust a gain of said amplifier according to said calibration performed by said microprocessor.

9. The die bond touch down detector of claim 1, further comprising:

a comparator operable to generate a trigger signal in response to said output signal and said touch down signal.

10. The method of detecting deformations in a die bond head, comprising the steps of:

measuring deformations in a plurality of strain gauges in contact with the die bond head;

processing measured deformations in the plurality of strain gauges to determine deformations of the die bond head; and

determining a touch down position of the die bond head in response to the measured deformations.

11. The method of claim 10, further comprising the steps of:

performing real time monitoring of the die bond head.

12. The method of claim 10, further comprising the step of:

determining a real force applied by the die bond head in response to the measured deformations.