Vacuum process apparaus

• US 5,609,689 A
• Filed: 06/03/1996
• Issued: 03/11/1997
• Est. Priority Date: 06/09/1995
• Status: Expired due to Fees

• Current Assignee: Varian Japan K.K. (Applied Materials Incorporated), Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Kato, Susumu, Yamaguchi, Hirofumi
• Primary Examiner(s): BUEKER, RICHARD R
• Application Number:
  US08/660,215
• Time in Patent Office: 281 Days
• Field of Search: 118/719, 118/724, 118/725, 118/729, 156/345, 414/939, 414/217
• US Class Current: 118/719
• CPC Class Codes: C23C 14/50 Substrate holders
• CPC Class Codes: C23C 14/568 Transferring the substrates through a series of coating stations C23C14/562 takes precedence
• CPC Class Codes: H01L 21/67167 surrounding a central transfer chamber
• CPC Class Codes: H01L 21/67201 characterized by the construction of the load-lock chamber
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber

Abstract

A cooling table for cooling a processed object of process in a vacuum reserve chamber is provided with support members, which support the object with predetermined gaps between the object and the table, so that the processed object can be cooled without directly touching the cooling table. Accordingly, no chemical reactions attributable to the plane contact between the object of process and the cooling table can be caused, so that the object cannot be contaminated. Even if the object is somewhat warped and subjected to fine vibrations by rapid cooling, moreover, it never rubs against the cooling table, so that no particles can be produced. Further, a preheating device for preheating the unprocessed object is provided overlying the cooling table. Thus, the vacuum reserve chamber can be used for preheating the unprocessed object as well as for cooling the processed object, so that the throughput can be improved.

Claims

1. A vacuum process apparatus, which is provided with a plurality of vacuum process chambers for subjecting an object of process to predetermined processes, comprising:

a vacuum reserve chamber for delivering the object in a substantially vacuum state to the vacuum process chambers and receiving the processed object substantially at the atmospheric pressure from the vacuum process chambers;

a cooling table for cooling the processed object in the vacuum reserve chamber; and

support members arranged so as to support the object over the cooling table with predetermined gaps between the object and the table.

2. The vacuum process apparatus according to claim 1, wherein each said support member includes a projection formed on the cooling table so as to support the object.

3. The vacuum process apparatus according to claim 1, wherein each said support member includes a regulating portion for restraining diametrical movement of the object.

4. The vacuum process apparatus according to claim 1, wherein said support members are formed of quartz.

5. A vacuum process apparatus, which is provided with a plurality of vacuum process chambers for subjecting an object of process to predetermined processes, comprising:

a vacuum reserve chamber for delivering the object in a substantially vacuum state to the vacuum process chambers and receiving the processed object substantially at the atmospheric pressure from the vacuum process chambers;

a cooling table for cooling the processed object in the vacuum reserve chamber; and

preheating means arranged over the cooling table so as to preheat the unprocessed object.

6. The vacuum process apparatus according to claim 5, further comprising a first ring-shaped support portion for supporting the unprocessed object in the vacuum reserve chamber and a second ring-shaped support portion for supporting the processed object in the vacuum reserve chamber.

7. The vacuum process apparatus according to claim 6, wherein each of said first and second ring-shaped support portions includes projections arranged so as to support the object with predetermined gaps between the object and the support portion.