Method for forming thermal-ink heater array using rectifying material

• US 5,609,910 A
• Filed: 01/10/1995
• Issued: 03/11/1997
• Est. Priority Date: 08/03/1992
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Hackleman, David E.
• Primary Examiner(s): PADGETT, MARIANNE L
• Application Number:
  US08/370,947
• Time in Patent Office: 791 Days
• Field of Search: 427/592, 427/593, 427/594, 427/101, 427/102, 427/103, 427/265, 427/266, 427/269, 437/904, 437/917
• US Class Current: 427/102
• CPC Class Codes: B41J 2/1603 of the front shooter type
• CPC Class Codes: B41J 2/164 thin film formation
• CPC Class Codes: B41J 2/34 comprising semiconductors
• CPC Class Codes: B41J 2202/03 Specific materials used

Abstract

A heater array for an ink jet printhead includes an insulating substrate, which can be a layer of ceramic, flexible plastic, insulated flexible metal, polysilicon, or single crystalline silicon. A first material layer is deposited atop the insulating substrate and patterned in parallel stripes. A first insulating layer is deposited atop the first material layer and patterned with contact windows above the first material layer in corresponding desired heating locations, usually in a symmetrical grid. A second material layer is deposited atop the first insulating layer and pattern in parallel stripes orthogonal to those in the first material layer. The first and second material layers are in physical and electrical contact with each other through the contact windows in the first insulating layer to form a resistive diode junction at each desired heating location. The entire surface of the heating array is covered with a second insulating layer, with contacts provided to the first and second material layers.

Claims

1. A fabrication method for a heater array in an ink jet printer, the method comprising the steps of:

forming an insulating substrate;

depositing a first material layer atop the insulating substrate;

patterning the first material layer;

depositing a first insulating layer atop the patterned first material layer;

patterning a plurality of contact windows in the first insulating layer at desired heating locations;

depositing a second material layer atop the patterned first insulating layer such that the first and second material layers are in physical contact with each other through the contact windows in the first insulating layer;

forming contacts on the first material layer; and

forming contacts on the second material layer,

wherein each physical contact region between the first and second material layers forms a vertically extending resistive diode junction within the contact window at the desired heating locations, the resistive diode junction in a forward biased condition transferring conductive heat directly to ink in the ink jet print head while simultaneously limiting forward current in said resistive diode junction.

2. The method of claim 1 in which the step of patterning the first material layer comprises the step of patterning the first material layer into a plurality of stripes.

3. The method of claim 2 in which the step of patterning the second material layer comprises the step of patterning the second material layer into a plurality of stripes orthogonal to the stripes of the first material layer.

4. The method of claim 1 further comprising the step of doping at least one of the first and second material layers.

5. The method of claim 1 wherein the steps of forming contacts on the first material layer and forming contacts on the second material layer comprises forming individual contacts each associated with a selected resistive diode junction, the individual contacts on the first material layer formed in electrical isolation from each other and individual contacts on the second material layer formed in electrical isolation from each other providing selectable energization of each one of the contacts.

6. The method of claim 1 further comprising the step of depositing a second insulating layer atop the patterned second material layer.

7. A method according to claim 5 wherein the resistive diode junction is formed in the physical contact region to generate heat when the associated individual contacts are energized.

8. A method for fabricating a heater array in an ink jet printhead, comprising:

forming an insulating substrate;

depositing a first material layer atop the insulating substrate;

patterning the first material layer;

depositing a first insulating layer atop the patterned first material layer;

patterning a plurality of contact windows in the first insulating layer at desired heating locations; and

depositing a second material layer atop the patterned first insulating layer such that the first and second material layers form an interface in physical contact within a region in the contact windows;

wherein each said physical contact region interface between the first and second material layers forms a vertically extending resistive diode junction having a resistive portion formed vertically by a space charge region extending into each of the first and second material layers at the desired heating locations, the physical contact region of the resistive diode junction transferring conductive heat directly to ink in the ink jet printhead while simultaneously limiting forward current in said diode junction.

9. A method according to claim 8 including the step of forming multiple apertures immediately above each resistive diode junction, the apertures directing dispersion of the ink onto a print medium after being heated by the corresponding resistive diode junction.

10. A method according to claim 8 wherein the step of forming the physical contact region includes selecting material for the first and second material layers that form a resistive diode junction for heating the ink when said diode junction is in a forward biased condition.