Monolithic spatial light modulator and memory package

• US 5,610,625 A
• Filed: 06/07/1995
• Issued: 03/11/1997
• Est. Priority Date: 05/20/1992
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Sampsell, Jeffrey B.
• Primary Examiner(s): SARAS, STEVEN J
• Application Number:
  US08/481,789
• Time in Patent Office: 643 Days
• Field of Search: 359/81, 359/82, 359/83, 359/84, 359/85, 359/80, 359/62, 345/84, 345/85, 345/87, 345/98, 345/100, 345/109, 345/905, 345/1, 345/54, 437/183, 437/209, 437/213, 437/243, 437/18, 437/19, 361/793, 257/778, 371/22.1
• US Class Current: 345/84
• CPC Class Codes: G02B 26/0816 by means of one or more reflecting elements
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A modulator package with memory mounted adjacent the modulator allowing operation at two different data rates. The first rate is a steady-state data rate that requires a minimal number of wires from processor to array. The second rate is made possible by a memory buffer with different input and output rates and the ability to have a relatively high pin count. The second rate is the burst data rate which is the time it takes the modulator to update for new data.

Claims

1. A digital micromirror device package comprising:

a. a superstrate;

b. at least one data bus on said superstrate;

c. at least one connector on said superstrate electrically connected to said bus;

d. at least one buffer memory on said superstrate connected to said bus operable to receive data at a first rate from said bus, said buffer memory selected from the group consisting of first-in-first-out memories and video random access memories;

e. a digital micromirror device on said superstrate with addressing circuitry electrically connected to receive data at a second rate from said buffer memories;

f. a ring on said superstrate around said digital micromirror device; and

g. a window on said ring to allow light to pass through from said digital micromirror device, said window spaced apart from said digital micromirror device by said ring, wherein said ring completely surrounds said digital micromirror device and protects said digital micromirror device from contaminants.

2. The package of claim 1 wherein said superstrate is ceramic.

3. The package of claim 1 wherein said ring separates said buffer memory from said digital micromirror device.

4. A method of packaging a digital micromirror device comprising:

a. providing a superstrate;

b. producing bus lines and bond pads on said superstrate;

c. attaching buffer memories to said superstrate, said buffer memories selected from the group consisting of first-in-first-out memories and video random access memories;

d. electrically connecting said butter memories to said bond pads;

e. attaching a digital micromirror device to said superstrate;

f. attaching a ring to said superstrate, said ring surrounding said digital micromirror device;

g. electrically connecting said digital micromirror device to said bond pads; and

h. covering at least a portion of the superstrate with a window, said window being spaced from said digital micromirror device by said ring, wherein said superstate, said ring, and said window prevent contaminants from reaching said digital micromirror device.

5. The method of claim 4 wherein said attaching buffer memories step comprises gluing down said buffer memories.

6. The method of claim 4 wherein said step of electrically connecting said buffer memories comprises connecting wires from said buffer memory to said bond pad.

7. The method of claim 4 wherein said attaching a digital micromirror device step comprises gluing down said digital micromirror device.

8. The method of claim 4 wherein said electrically connecting said digital micromirror device comprises connecting wires from said digital micromirror device to said bond pads.

9. The method of claim 4 wherein said attaching a ring step is comprised of attaching a ring to said superstrate between said digital micromirror device and said buffer memories.

10. A digital micromirror device package comprising:

a superstrate;

at least one bond pad formed on said superstrate, said bond pad having a first end, a second end, and a middle portion between said first and second ends;

a ring supported by said superstrate and defining an enclosing a portion of said superstrate, wherein said first portion of said at least one bond pad is on said enclosed portion, and said second portion of said at least one bond pad is not on said enclosed portion;

a digital micromirror device supported by said enclosed portion of said superstrate; and

a window supported over and apart from said digital micromirror device by said ring, wherein said window, said ring, and said superstrate enclose said digital micromirror device.

11. The package of claim 10 further comprising bond wires attached to said digital micromirror device and said first portion of said at least one bond pad.

12. The package of claim 10 further comprising bond wires attached to said second portion of said at least one bond pad.

13. The package of claim 10 further comprising a buffer memory supported by said superstrate, said buffer memory selected from the group consisting of first-in-first-out memories and video random access memories.

14. The package of claim 10 wherein said ring separates said digital micromirror device from said buffer memories.