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Substrate mounting of circuit components with a low profile

  • US 5,610,800 A
  • Filed: 11/03/1995
  • Issued: 03/11/1997
  • Est. Priority Date: 08/31/1994
  • Status: Expired due to Term
First Claim
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1. A system for packaging circuit components, comprising:

  • a substrate comprising;

    a plurality of openings;

    first and second contacts extending inwardly from a first side of a first opening and third and fourth contacts extending inwardly from a second side of the first opening;

    a first auxiliary component positioned in a second opening in the substrate having first and second terminals mating with the first and second contacts, wherein a lower surface of the first auxiliary component is substantially planar with a lower surface of the substrate; and

    a second auxiliary component positioned in a third opening in the substrate having third and fourth terminals mating with the third and fourth contacts of the second side of the first opening, wherein a lower surface of the second auxiliary component is substantially planar with the lower surface of the substrate.

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