Substrate system for optoelectronic/microwave circuits

• US 5,611,008 A
• Filed: 01/26/1996
• Issued: 03/11/1997
• Est. Priority Date: 01/26/1996
• Status: Expired due to Term

• Current Assignee: Hughes Electronics Corporation (Rtx Corporation)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Yap, Daniel
• Primary Examiner(s): GENSLER, PAUL L
• Application Number:
  US08/591,854
• Time in Patent Office: 410 Days
• Field of Search: 333/246, 333/247, 385/14, 385/49, 257/432, 359/173, 359/188, 359/195
• US Class Current: 385/14
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures

Abstract

A low-loss substrate system is provided for carrying and interconnecting optoelectronic/microwave circuits. The system includes a high-resistivity substrate, e.g., silicon of resistivity >1×10³ ohm-centimeter. A dielectric layer, e.g., silicon dioxide, is preferably deposited over at least a portion of the substrate. Low-loss microwave transmission members and passive microwave components, e.g., capacitors and spiral inductors, can be fabricated directly on the dielectric layer with thin-film techniques. Optoelectronic and microwave integrated circuits are preferably mounted on the substrate system with solder bumps and bonding pads. Other portions of the substrate can define grooves for receiving optical fibers. To enhance optical alignment, the grooves and bonding pads are preferably located with photolithographic techniques. The substrate system is especially suited for optoelectronic/microwave circuits that are realized with hybrid integration structures.

Claims

1. A substrate system for carrying and interconnecting an optoelectronic/microwave circuit with the aid of a plurality of solder bumps, said optoelectronic/microwave circuit including an optical fiber, an optoelectronic integrated circuit which has an optical port and a plurality of bonding pads, and a microwave integrated circuit which has a plurality of bonding pads, said microwave integrated circuit adapted for communication with said optoelectronic integrated circuit through a first microwave signal and adapted for communication externally from said optoelectronic/microwave circuit through a second microwave signal, said substrate system comprising:

a substrate;

a groove formed in said substrate;

a dielectric layer positioned over at least a portion of said substrate;

a plurality of microwave transmission members carried on said dielectric layer and configured to carry microwave signals;

a plurality of first bonding pads formed on said dielectric layer; and

a plurality of second bonding pads formed on said dielectric layer;

wherein;

said groove is configured to receive said fiber;

said first bonding pads are positioned to align with said bonding pads of said optoelectronic integrated circuit and configured to be connected to said bonding pads of said optoelectronic integrated circuit with a plurality of said solder bumps;

said second bonding pads are positioned to align with said bonding pads of said microwave integrated circuit and configured to be connected to said bonding pads of said microwave integrated circuit with a plurality of said solder bumps;

said groove and said first bonding pads are arranged to optically align said optical fiber and said optical port; and

one of said microwave transmission members is arranged to couple said first microwave signal between said optoelectronic integrated circuit and said microwave integrated circuit.

2. The substrate system of claim 1, wherein one of said microwave transmission members is arranged to couple said second microwave signal away from said microwave integrated circuit.

3. The substrate system of claim 1, wherein said microwave transmission members include coplanar transmission lines.

4. The substrate system of claim 1, wherein said microwave transmission members include microstrip transmission lines.

5. The substrate system of claim 1, wherein said substrate comprises silicon.

6. The substrate system of claim 5, wherein said substrate has a resistivity greater than 1×

10³ ohm-centimeter.

7. The substrate system of claim 1, wherein said dielectric layer comprises silicon dioxide.

8. The substrate system of claim 1, wherein one of said microwave transmission members is arranged to join one of said first bonding pads and one of said second bonding pads.

9. The substrate system of claim 1, wherein one of said microwave transmission members is arranged to join one of said first bonding pads with another of said first bonding pads.

10. The substrate system of claim 1, wherein one of said microwave transmission members is arranged to join one of said second bonding pads with another of said second bonding pads.

11. The substrate system of claim 1, further including a channel formed in said substrate and positioned across said groove to permit said optical fiber to abut said optical port.

12. The substrate system of claim 1, wherein:

said optical fiber and said optical port are aligned along an optical path; and

said groove includes a mirrored plane which is positioned across said optical path.

13. The substrate system of claim 1, wherein one of said microwave transmission members forms a spiral inductor to enhance said communication.

14. The substrate system of claim 1, wherein first and second ones of said microwave transmission members are spaced apart and further including a dielectric member positioned between said first and second microwave transmission members to form a capacitor to enhance said communication.

15. The substrate system of claim 1, wherein first and second ones of said microwave transmission members have interdigitated fingers forming a capacitor to enhance said communication.

16. A substrate system for carrying and interconnecting an optoelectronic/microwave circuit with the aid of a plurality of solder bumps, said optoelectronic/microwave circuit including an optical fiber, an optoelectronic integrated circuit which has an optical port and a plurality of bonding pads, and a microwave integrated circuit which has a plurality of bonding pads, said microwave integrated circuit adapted for communication with said optoelectronic integrated circuit through a first microwave signal and adapted for communication externally from said optoelectronic/microwave circuit through a second microwave signal, said substrate system comprising:

a substrate having an impedance greater than 1×

10³ ohm-centimeter;

a groove formed in said substrate;

a plurality of microwave transmission members carried on said substrate and configured to carry microwave signals;

a plurality of first bonding pads formed on said substrate; and

a plurality of second bonding pads formed on said substrate;

wherein;

said groove is configured to receive said fiber;

said first bonding pads are positioned to align with said bonding pads of said optoelectronic integrated circuit and configured to be connected to said bonding pads of said optoelectronic integrated circuit with a plurality of said solder bumps;

said second bonding pads are positioned to align with said bonding pads of said microwave integrated circuit and configured to be connected to said bonding pads of said microwave integrated circuit with a plurality of said solder bumps;

said groove and said first bonding pads are arranged to optically align said optical fiber and said optical port; and

one of said microwave transmission members is arranged to couple said first microwave signal between said optoelectronic integrated circuit and said microwave integrated circuit.

17. The substrate system of claim 16, wherein one of said microwave transmission members is arranged to couple said second microwave signal away from said microwave integrated circuit.

18. The substrate system of claim 16, wherein said microwave transmission members include coplanar transmission lines.

19. The substrate system of claim 16, wherein said microwave transmission members include microstrip transmission lines.

20. The substrate system of claim 16, wherein said substrate comprises silicon.

21. The substrate system of claim 16, wherein said substrate comprises a ceramic.

22. The substrate system of claim 16, further including a dielectric layer positioned between said substrate and said microwave transmission members.

23. The substrate system of claim 22, wherein said dielectric layer is silicon dioxide.

24. The substrate system of claim 16, wherein one of said microwave transmission members is arranged to join one of said first bonding pads and one of said second bonding pads.

25. The substrate system of claim 16, wherein one of said microwave transmission members is arranged to join one of said first bonding pads with another of said first bonding pads.

26. The substrate system of claim 16, wherein one of said microwave transmission members is arranged to join one of said second bonding pads with another of said second bonding pads.

27. The substrate system of claim 16, further including a channel formed in said substrate and positioned across said groove to permit said optical fiber to abut said optical port.

28. The substrate system of claim 16, wherein:

said optical fiber and said optical port are aligned along an optical path; and

said groove includes a mirrored plane which is positioned across said optical path.

29. The substrate system of claim 16, wherein one of said microwave transmission members forms a spiral inductor to enhance said communication.

30. The substrate system of claim 16, wherein first and second ones of said microwave transmission members are spaced apart and further including a dielectric member positioned between said first and second microwave transmission members to form a capacitor to enhance said communication.

31. The substrate system of claim 16, wherein first and second ones of said microwave transmission members have interdigitated fingers forming a capacitor to enhance said communication.