Method of making a packaged piezoelectric oscillator

• US 5,611,129 A
• Filed: 06/06/1995
• Issued: 03/18/1997
• Est. Priority Date: 08/23/1993
• Status: Expired due to Fees

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Matsumoto, Ikuo, Yoshimoto, Hisaya, Kambara, Shigeru
• Primary Examiner(s): Hall, Carl E.
• Application Number:
  US08/470,038
• Time in Patent Office: 651 Days
• Field of Search: 29/25.35, 29/855, 310/320, 310/344, 310/348
• US Class Current: 29/25.35
• CPC Class Codes: H03H 3/02 for the manufacture of piezoelectric or electrostrictive resonators or networks H03H3/08 takes precedence
• CPC Class Codes: H03H 9/0514 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/0547 consisting of a vertical arrangement H03H9/0566 takes precedence
• CPC Class Codes: H03H 9/1014 the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49171 with encapsulating

Abstract

A packaged piezoelectric oscillator is provided which comprises an insulating package body, a piezoelectric element, and a lid member. The package body has an upwardly open housing groove which has a bottom surface formed with oscillator electrodes at both ends of the housing groove. The piezoelectric element is fixedly received in the housing groove of the insulating package body and held in electrical conduction with the respective oscillator electrodes. The lid member is attached to the package body to close the housing groove. The housing groove has an intermediate wider width portion, and each end of the housing groove is provided with a pair of end positioning walls projecting toward each other for providing a narrower width portion between the pair of end positioning walls.

Claims

1. A method of making packaged piezoelectric oscillators comprising the steps of:

preparing a resinous master package plate formed with a plurality of upwardly open housing grooves, each of the housing grooves being flanked by at least first and second pairs of through-holes penetrating the master package plate, the first and second pairs of through-holes being located at positons corresponding to both ends of said each housing groove, said each housing groove having an intermediate wider width portion, each end of the housing groove being provided with a pair of end positioning walls projecting toward each other for providing a narrower width portion between the pair of end positioning walls;

forming first and second lead electrodes extending on upper and lower surfaces of the master package plate transversely of said each housing groove respectively at the first and second pairs of through-holes, the first and second lead electrodes further extending respectively within the first and second pairs of through-holes, the first and second lead electrodes further extending into said each housing groove;

forming oscillator electrodes on a bottom surface of said each housing groove respectively at both ends thereof in electrical conduction with the first and second lead electrodes;

mounting a piezoelectric element in said each housing groove in electrical conduction with the respective oscillator electrodes;

attaching a master lid plate to the master package plate to close said each housing groove; and

cutting the master package plate together with the attached master lid plate to provide a plurality of packaged piezoelectric oscillators.

2. The method according to claim 1, wherein the preparation of the master package plate comprises a primary molding step of forming a plurality of electrode forming portions made of a metal-platable resin and spaced from each other, and a secondary molding step of forming a plurality of non-electrode forming portions made of a non-platable resin and arranged alternately with the electrode forming portions, the respective lead electrodes and the oscillator electrodes being formed by plating the electrode forming portions with a metal.

3. The method according to claim 1, wherein the preparation of the master package plate comprises a primary molding step of forming a plurality of non-electrode forming portions made of a non-platable resin and spaced from each other, and a secondary molding step of forming a plurality of electrode forming portions made of a metal-platable resin and arranged alternately with the electrode forming portions, the respective lead electrodes and the oscillator electrodes being formed by plating the electrode forming portions with a metal.

4. A method of making packaged piezoelectric oscillators comprising the steps of:

preparing a resinous master package plate formed with a plurality of upwardly open housing grooves, each of the housing grooves being flanked by first to third pairs of through-holes penetrating the master package plate, the first and second pairs of through-holes being located at positions corresponding to both ends of said each housing groove, the housing groove having an intermediate wider width portion, the third pair of through-holes being located between the first and second pairs of through-holes;

forming first to third lead electrodes extending on upper and lower surfaces of the master package plate transversely of said each housing groove respectively at the first to third pairs of through-holes, the first to third lead electrodes further extending respectively within the first to third pairs of through-holes, the first and second lead electrodes further extending into said each housing groove;

forming oscillator electrodes on a bottom surface of said each housing groove respectively at both ends thereof in electrical conduction with the first and second lead electrodes;

mounting a piezoelectric element in said each housing groove in electrical conduction with the respective oscillator electrodes;

preparing a master lid plate having a lower surface formed with first to third capacitor electrodes in corresponding relation to the first to third lead electrodes for said each housing groove;

attaching the master lid plate to the master package plate to bring the first to third capacitor electrodes into electrical conduction with the first to third lead electrodes; and

cutting the master package plate together with the attached master lid plate to provide a plurality of packaged piezoelectric oscillators.

5. The method according to claim 4, wherein the preparation of the master package plate comprises a primary molding step of forming a plurality of electrode forming portions made of a metal-platable resin and spaced from each other, and a secondary molding step of forming a plurality of non-electrode forming portions made of a non-platable resin and arranged alternately with the electrode forming portions, the respective lead electrodes and the oscillator electrodes being formed by plating the electrode forming portions with a metal.

6. The method according to claim 4, wherein the preparation of the master package plate comprises a primary molding step of forming a plurality of non-electrode forming portions made of a non-platable resin and spaced from each other, and a secondary molding step of forming a plurality of electrode forming portions made of a metal-platable resin and arranged alternately with the electrode forming portions, the respective lead electrodes and the oscillator electrodes being formed by plating the electrode forming portions with a metal.

7. A method of making packaged electronic components comprising the steps of:

preparing a resinous master package plate formed with a plurality of upwardly open housing grooves, each of the housing grooves being flanked by at least first and second pairs of through-holes penetrating the master package plate, the first and second pairs of through-holes being located at positions corresponding to both ends of said each housing groove;

forming first and second lead electrodes extending on upper and lower surfaces of the master package plate transversely of said each housing groove respectively at the first and second pairs of through-holes, the first and second lead electrodes further extending respectively within the first and second pairs of through-holes, the first and second lead electrodes further extending into said each housing groove;

forming element electrodes on a bottom surface of said each housing groove respectively at both ends thereof in electrical conduction with the first and second lead electrodes;

mounting an electronic element in said each housing groove in electrical conduction with the respective element electrodes;

attaching a master lid plate to the master package plate to close said each housing groove; and

cutting the master package plate together with the attached master lid plate to provide a plurality of packaged electronic components.