Low temperature flexible die attach adhesive and articles using same

• US 5,612,403 A
• Filed: 10/16/1995
• Issued: 03/18/1997
• Est. Priority Date: 10/24/1990
• Status: Expired due to Term

• Current Assignee: Henkel Corporation (Henkel AG & Co KGaA)
• Original Assignee: Johnson Matthey Incorporated (Johnson Matthey PLC)
• Inventors: Nguyen, My N., Chien, Yuan Y.
• Primary Examiner(s): Cain, Edward J.
• Application Number:
  US08/543,321
• Time in Patent Office: 519 Days
• Field of Search: 524/377, 524/440
• US Class Current: 524/440
• CPC Class Codes: C07C 261/02 Cyanates
• CPC Class Codes: C08G 59/4007 Curing agents not provided for by the groups C08G59/42 - C08G59/66
• CPC Class Codes: C08K 5/0016 Plasticisers
• CPC Class Codes: C08L 79/04 Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C09J 179/04 Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01L 2224/29 of an individual layer connector
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/4828 Conductive organic material or pastes, e.g. conductive adhesives, inks
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01067 : Holmium [Ho]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.

Claims

1. A die attach adhesive composition capable of being cured in less than five minutes at 200°

C. comprising;

about 10 to about 40 weight percent resin vehicle comprising cyanate ester monomers and at least one flexibilizer;

about 60 to about 90 weight percent silver; and

wherein said composition is free of added metal containing catalysts or added alkylphenol.

2. A die attach adhesive composition capable of being cured in less than five minutes at 200°

C. comprising;

about 10 to about 40 weight percent resin vehicle comprising cyanate ester monomers and at least one flexibilizer;

about 60 to about 90 weight percent silver;

about 0.1 to about 0.6 weight percent metal containing curing catalyst; and

wherein said composition is free of added alkylphenol or added solvent.

3. A die attach adhesive composition capable of being cured in less than five minutes at 200°

C. comprising;

about 10 to about 40 weight percent resin vehicle comprising cyanate ester monomers and at least one flexibilizer;

about 60 to about 90 weight percent silver; and

about 0.5 to about 2 weight percent added alkylphenol; and

wherein said composition is free of added metal containing curing catalyst.