Thin IC card and method for producing the same

• US 5,612,532 A
• Filed: 11/09/1995
• Issued: 03/18/1997
• Est. Priority Date: 09/01/1993
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation), Toshiba Corporation
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Iwasaki, Hiroshi
• Primary Examiner(s): Hajec, Donald T.
• Assistant Examiner(s): LEE, MICHAEL GUNYOUNG
• Application Number:
  US08/554,927
• Time in Patent Office: 495 Days
• Field of Search: 235/492, 235/486, 235/487, 235/491, 343/741, 257/679
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07769 the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01079 Gold [Au]

Abstract

A thin IC card which is highly reliable, simple in construction and structure, to which a function section relating to main information processing can be easily attached, and which has improved portability, and a method for producing it are disclosed. This thin IC card is characterized by including a plate type IC module in which a semiconductor device having at least memory function and CPU function has its one side sealed or molded with a resin, and flat type externally connecting terminals have their one end connected to the input/output terminals of the semiconductor device and the other end led and exposed to a non-resin sealed or molded side, and a card-like support which has a fitting section for fitting the plate type IC module with the surface of the externally connecting terminals of the plate type IC module exposed to be substantially flush with the surface of the card, a required circuit wiring, an antenna for sending and receiving a signal without contacting, and if necessary an oscillator for specifying a frequency and a power supply battery.

Claims

1. A thin IC card comprising:

a plate type IC module having a semiconductor chip sealed or molded with a resin on a lower portion of the IC module, the IC module having a connecting portion on the lower portion of the IC module and said module having means for direct communication with an external terminal, and the semiconductor chip having a memory and a CPU; and

a card-like support having a first area and a second area formed outside of the first area, a fitting section formed inside the first area and an antenna formed inside the second area, the fitting section freely fitting the IC module detachably, and the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module.

2. A thin IC card according to claim 1 wherein said semiconductor chip has a function to oscillate a required frequency.

3. A thin IC card according to claim 1 or 2 wherein the card-like support is a resin based wiring board.

4. A thin IC card according to claim 1 or 2 wherein said card has a thickness of 0.76 mm.

5. A thin IC card as set forth in claim 1, wherein the plate type IC module further has an input/output terminal on the surface of the IC module, and the input/output terminal is exposed to be substantially flush with the surface of the card.

6. A thin IC card comprising:

a plate type IC module having a semiconductor chip sealed or molded with a resin on a lower portion on the IC module, the IC module having a connecting portion on the lower portion of the IC module and said module having means for direct communication with an external terminal, and the semiconductor chip having a memory and a CPU;

a card-like support having a first area and a second area formed outside of the first area, a fitting section formed inside the first area and an antenna formed inside the second area, the antenna sending and receiving a signal without contacting, the fitting section freely fitting the IC module detachably, and the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module; and

a means which applies to said antenna an electric wave having a different wavelength at timing different from the signal to generate electric power for operating by electromagnetic induction.

7. A thin IC card according to claim 6 wherein said semiconductor chip has a function to oscillate a required frequency.

8. A thin IC card according to claim 6 or 7 wheein the card-like support is a resin based wiring board.

9. A thin IC card according to claim 6 or 7 wherein said card has a thickness of 0.76 mm.

10. A thin IC card as set forth in claim 6, wherein the plate type IC module further has an input/output terminal on the surface of the IC module, and the input/output terminal is exposed to be substantially flush with the surface of the card.

11. A thin IC card comprising:

a plate type IC module having a semiconductor chip sealed or molded with a resin on a lower portion of the IC module, the IC module having a connecting portion on the lower portion of the IC module and said module having means for direct communication with an external terminal, and the semiconductor chip having a memory and a CPU; and

a card-like support having a first area and a second area formed outside of the first area, a power supply battery and a fitting section formed inside the first area and an antenna formed inside he second area, the fitting section freely fitting the IC module detachably, and the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module.

12. A thin IC card according to claim 11 wherein said semiconductor chip has a function to oscillate a required frequency.

13. A thin IC card according to claim 11 or 12 wherein the card-like support is a resin based wiring board.

14. A thin IC card according to claim 11 or 12, wherein said card has a thickness of 0.76 mm.

15. A thin IC card according to claim 12 wherein the card-like support is a resin based wiring board and said card has a thickness of 0.76 mm.

16. A thin IC card according to claim 11 wherein the card-like support is a resin based wiring board and said card has a thickness of 0.76 mm.

17. A thin IC card as set forth in claim 11, wherein the plate type IC module further has an input/output terminal on the surface of the IC module, and the input/output terminal is exposed to be substantially flush with the surface of the card.

18. A thin IC card comprising:

a plate type IC module having a semiconductor chip sealed or molded with a resin on a lower portion of the IC module, the IC module having a connecting portion on the lower portion of the IC module and said module having means for direct communication with an external terminal, and the semiconductor chip having a memory and a CPU; and

a card-like support having a first area and a second area formed outside of the first area, a power supply battery, an oscillator and a fitting section formed inside the first area and antenna formed inside the second area, the fitting section freely fitting the IC module detachably, the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module, and the oscillator specifying a frequency.

19. A thin IC card according to claim 18 wherein the card-like support is a resin based wiring board.

20. A thin IC card as set forth in claim 18, wherein the plate type IC module further has an input/output terminal on the surface of the IC module, and the input/output terminal is exposed to be substantially flush with the surface of the card.

21. A thin IC card comprising:

a plate type IC module having a semiconductor chip sealed or molded with a resin on a lower portion of the IC module, the IC module having a connecting portion on the lower portion of the IC module and said module having means for direct communication with an external terminal, and the semiconductor chip having a memory and a CPU; and

a card-like support having a first area and a second area formed outside the first area, a rechargeable secondary battery, an oscillator and a fitting section formed inside the first area and an antenna formed inside the second area, the fitting section freely fitting the IC module detachably, the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module, and the oscillator specifying a frequency.

22. A thin IC card as set forth in claim 21, wherein the plate type IC module further has an input/output terminal on the surface of the IC module, and the input/output terminal is exposed to be substantially flush with the surface of the card.

23. A thin IC card having a laminated structure comprising:

a first insulating thin plate having a window to expose and free detachably fit the side of flat type externally connecting terminals of a plate type IC module and a recessed fitting section for a power supply battery,

a circuit board body having open fitting sections for said IC module and said power supply battery, being applied to said first insulating thin plate, and including a built-in antenna electrically connected to a circuit wiring, and

a second insulating thin plate which is applied to the other side of said circuit board body.

24. A thin IC card according to claim 23 wherein said first insulating thin plate, said circuit board and said second insulating thin plate have a thickness of about 0.3 mm, about 0.3 mm and about 0.16 mm, respectively.

25. A method for producing a thin IC card comprising:

a step of forming a card-like wiring board including a required circuit wiring and an antenna for sending and receiving a signal without contacting,

a step of forming a card-like support by providing a structure to fit or include a plate type IC module, which has on its one side a semiconductor chip having at least memory function and CPU function sealed or molded with a resin, and has flat type externally connecting terminals electrically connected to the input/output terminals of the semiconductor chip and led and exposed to a non-resin sealed or molded side, into a predetermined area of the card-like wiring board, and

a step of fitting or arranging the plate type IC module in a predetermined area of the card-like support with the side of externally connecting terminals of the plate type IC module exposed to be substantially flush with the surface of the card-like support, and electrically connecting the plate type IC module to the prescribed circuit wiring in said card-like support.

26. A method for producing a thin IC card comprising:

a step of forming a card-like wiring board including a required circuit wiring and an antenna for sending and receiving a signal without contacting,

a step of forming a card-like support by providing a structure to fit or include a plate type IC module, which has on its one side a semiconductor chip having at least memory function and CPU function sealed or molded with a resin, and has flat type externally connecting terminals electrically connected to the input/output terminals of the semiconductor chip and led and exposed to a non-resin sealed or molded side, an oscillator for specifying a frequency and a power supply battery, into predetermined areas of the card-like wiring board,

a step of fitting or arranging the plate type IC module in a predetermined area of the card-like support with the surface of the externally connecting terminals of the plate type IC module exposed to be substantially flush with the surface of the card-like support, and

a step of including and arranging said plate type IC module, said oscillator and said power supply battery in the predetermined areas of said card-like support, and electrically connecting by the predetermined circuit wiring within said card-like support.

27. A thin IC card comprising:

a plate type IC module having a semiconductor chip sealed molded with a resin on a lower portion of the IC module, the IC module having a connecting portion on the lower portion of the IC module, and the semiconductor chip having memory and a CPU, wherein the plate type IC module further has an input/output terminal on the surface of the IC module, and the input/output terminal is exposed to be substantially flush with the surface of the card; and

a card-like support having an antenna and a fitting section, the fitting section freely fitting the IC module detachably, and the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module.

28. A thin IC card comprising:

a plate type IC module having a semiconductor chip sealed or molded with a resin on a lower portion of the IC module, the IC module having a connecting portion on the lower portion of the IC module, and the semiconductor chip having a memory and CPU, wherein the plate type IC module further has an input/output terminal on the surface of the IC module, and the input/output terminal is exposed to be substantially flush with the surface of the card;

a card-like support having an antenna and a fitting section, the antenna and receiving a signal without contacting, the fitting section freely fitting the IC module detachably, and the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module; and

a means which applies to said antenna an electric wave having a different wavelength at timing different from the signal to generate electric power for operating by electromagnetic induction.

29. A thin IC card comprising:

a plate type IC module having a semiconductor chip sealed or molded with a resin on a lower portion of the IC module the IC module also having a connecting portion on the lower portion of the IC module, and the semiconductor chip having a memory and a CPU, wherein the plate type IC module further has an input/output terminal on the surface of the IC module, and the input/output terminal is exposed to be substantially flush with the surface of the card;

an

a card-like support having an antenna, a power supply battery and a fitting section, the fitting section freely fitting the IC module detachably, and the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module.

30. A thin IC card comprising:

a plate type IC module having a semiconductor chip sealed or molded with a resin on a lower portion of the IC module, the IC module having a connecting portion on the lower portion Of the IC module,and the semiconductor chip having a memory and a CPU, wherein the plate type IC module further has an input/output terminal on the surface of the IC module, and the input/output terminal is exposed to be substantially flush with the surface of the card; and

a card-like support having an antenna, a power supply battery, an oscillator and a fitting section, the fitting section freely fitting the IC module detachably, the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module, and the oscillator specifying a frequency.

31. A thin IC card comprising:

a plate type IC module having a semiconductor chip sealed or molded with a resin on a lower portion of the IC module, the IC module having a connecting portion on the lower portion of the IC module, and the semiconductor chip having a memory and a CPU, wherein the plate type IC module further has an input/output terminal on the surface of the IC module, and the input/output terminal is exposed to be substantially flush with the surface of the card; and

a card-like support having an antenna, a rechargeable secondary battery, an oscillator and a fitting section, the fitting section freely fitting the IC module detachably, the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module, and the oscillator specifying a frequency.

32. A thin IC card comprising:

a plate type IC module having a semiconductor chip sealed or molded with a resin on a lower portion of the IC module, the IC module having a connecting portion on the lower portion of the IC module and said module having means for direct communication with an external terminal, and the semiconductor chip having a memory and a CPU; and

a card-like support having a first area and a second area formed outside of the first area, a fitting section formed inside the first area and an antenna formed inside the second area, the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module.

33. A thin IC card according to claim 32, wherein said semiconductor chip has a function to oscillate a required frequency.

34. A thin IC card according to claim 33, wherein the card-like support is a resin based wiring board.

35. A thin IC card according to claim 33, wherein said card has a thickness of 0.76 mm.

36. A thin IC card according to claim 32, wherein the card-like support is a resin based wiring board.

37. A thin IC card according to claim 32, wherein said card has a thickness of 0.76 mm.

38. A thin IC card comprising:

a plate type IC module having a semiconductor chip sealed or molded with a resin on a lower portion of the IC module, the IC module having a connecting portion on the lower portion of the IC module and said module having means for direct communication with an external terminal, and the semiconductor chip having a memory and a CPU;

a card-like support having a first area and a second area formed outside of the first area, a fitting section formed inside of the first area and an antenna formed inside of the second area, the antenna sending and receiving a signal without contacting, the fitting section fitting the IC module, and the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module; and

a means which applies to said antenna an electric wave having a different wavelength at timing different from the signal to generate electric power for operating by electromagnetic induction.

39. A thin IC card according to claim 38, wherein said semiconductor chip has a function to oscillate a required frequency.

40. A thin IC card according to claim 39, wherein the card-like support is a resin based wiring board.

41. A thin IC card according to claim 39, wherein said card has a thickness of 0.76 mm.

42. A thin IC card according to claim 38, wherein the card-like support is a resin based wiring board.

43. A thin IC card according to claim 38, wherein said card has a thickness of 0.76 mm.

44. A thin IC card comprising:

a plate type module having a semiconductor chip sealed or molded with a resin on a lower portion of the IC module, the IC module also having a connecting portion on the lower portion of the IC module and said module having means for direct communication with an external terminal, and the semiconductor chip having a memory and a CPU; and

a card-like support having a first area and a second area formed outside of the first area, a power supply battery and a fitting section formed inside the first area and an antenna formed inside the second area, the fitting section fitting the IC module, and the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module.

45. A thin IC card according to claim 44, wherein said semiconductor chip has a function to oscillate a required frequency.

46. A thin IC card according to claim 45, wherein the card-like support is a resin based wiring board.

47. A thin IC card according to claim 45, wherein said card has a thickness of 0.76 mm.

48. A thin IC card according to claim 44, wherein the card-like support is a resin based wiring board.

49. A thin IC card according to claim 44, wherein said card has a thickness of 0.76 mm.

50. A thin IC card comprising:

a plate type IC module having a semiconductor chip sealed or molded with a resin on a lower portion of the IC module, the IC module having a connecting portion on the lower portion of the IC module and said module having means for direct communication with an external terminal, and the semiconductor chip having a memory and a CPU; and

a card-like support having a first area and a second area formed outside of the first area, a power supply battery, an oscillator and a fitting section formed inside the first area and an antenna formed inside the second area, the fitting section fitting the IC module, the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module, and the oscillator specifying a frequency.

51. A thin IC card according to claim 50, wherein the card-like support is a resin based wiring board.

52. A thin IC card comprising:

a plate type IC module having a semiconductor chip sealed or molded with a resin on a lower portion of the IC module, the IC module having a connecting portion on the lower portion of the IC module and said module having means for direct communication with an external terminal, and the semiconductor chip having a memory and a CPU; and

a card-like support having a first area and a second area formed outside of the first area, a rechargeable secondary battery, an oscillator and a fitting section formed inside the first area and an antenna formed inside the second area, the fitting section fitting the IC module, the fitting section having a connection terminal electrically connected to the connecting portion of the fitted IC module, and the oscillator specifying a frequency.

53. A thin IC card according to claim 52, wherein the card-like support is a resin based wiring board and said card has a thickness of 0.76 mm.