Inductance element

• US 5,612,660 A
• Filed: 07/20/1995
• Issued: 03/18/1997
• Est. Priority Date: 07/27/1994
• Status: Expired due to Fees

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Takimoto, Hiroyuki
• Primary Examiner(s): Kozma, Thomas J.
• Application Number:
  US08/504,417
• Time in Patent Office: 607 Days
• Field of Search: 336/200, 336/223, 336/225, 336/232
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/004 with the coil helically wound around an axis without a core
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/09627 Special connections between adjacent vias, not for grounding vias redundant conductors or connections H05K2201/0979
• CPC Class Codes: H05K 2201/097 Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

In an inductance element which is built in a printed circuit board by forming at least two upper and lower layers of conductive patterns in such a way as to sandwich an insulator layer of the printed circuit board in between them and by interconnecting them by means of through holes (via holes), the inductance element is formed, within a plane orthogonally intersecting the surface of the printed circuit board, in a shape of a rectangularly spiral conductor having at its center an axis parallel to the surface of the printed circuit board. This arrangement enables the inductance element to be formed at the same time as when other conductive patterns of the printed circuit board are formed.

Claims

1. An inductance element formed in a multilayer printed circuit board, comprising:

one outer conductive circuit formed on an outer layer on one side of the multilayer printed circuit board, said one outer conductive circuit having a conductive pattern connected to a terminal provided for external connection;

another outer conductive circuit formed on another outer layer on another side of the multilayer printed circuit board, said another outer conductive circuit having a conductive pattern;

a plurality of inner conductive circuits formed respectively on inner layers in the multilayer printed circuit board, said plurality of inner conductive circuits respectively having conductive patterns, and one of said conductive patterns of said plurality of inner conductive circuits being connected to a terminal provided for external connection; and

a plurality of insulator layers respectively sandwiched in between adjacent conductive layers between said one outer conductive circuit and said another outer conductive circuit, said plurality of insulator layers provided with a plurality of conductive through holes arranged to interconnect said conductive patterns of said conductive circuits,

wherein said plurality of through holes formed in said plurality of insulator layers are arranged in conjunction with said conductive patterns to form a rectangularly spiral conductor within a plane which orthogonally intersects a plane surface of the printed circuit board.

2. An inductance element according to claim 1, wherein said rectangularly spiral conductor is formed to have at a center thereof an axis extending in parallel to the plane surface of the printed circuit board.

3. An inductance element according to claim 1, wherein a terminal for external connection which is connected to a conductive pattern serving as an outer conductor part of said rectangularly spiral conductor is connected directly to a connection lead wire of a surface-mount type part mounted on the printed circuit board.

4. An inductance element formed at a multilayer printed circuit board, comprising:

conductive circuits formed in a plurality of layers on the printed circuit board, said conductive circuits of plural layers respectively having conductive patterns, and two of said conductive circuits having conductive patterns connected to terminals provided for external connection;

a plurality of insulator layers formed at the printed circuit board, each of said plurality of insulator layers being disposed between adjacent conductive circuits; and

a plurality of conductive through holes provided in said plurality of insulator layers interconnecting said conductive patterns of said conductive circuits, said plurality of through holes being arranged in conjunction with said conductive patterns to form a rectangularly spiral conductor within a plane orthogonally intersecting a plane surface of the printed circuit board.

5. An inductance element formed at a multilayer printed circuit board, comprising:

a first conductive circuit formed on an outer layer on one side of the printed circuit board, said first conductive circuit having a conductive pattern connected to a terminal for external connection;

a second conductive circuit formed on another outer layer on another side of the printed circuit board, said second conductive circuit having a conductive pattern;

a third conductive circuit formed inside said first conductive circuit, said third conductive circuit having a conductive pattern;

a fourth conductive circuit formed inside said second conductive circuit, said fourth conductive circuit having a conductive pattern;

a fifth conductive circuit formed inside said third conductive circuit, said fifth conductive circuit having a conductive pattern;

a sixth conductive circuit formed between said fourth conductive circuit and said fifth conductive circuit, said sixth conductive circuit having a conductive pattern connected to a terminal provided for external connection;

a plurality of insulator layers each of which is interposed in between said conductive circuits; and

a plurality of, conductive through holes provided in said plurality of insulator layers interconnecting said conductive patterns, said plurality of through holes being arranged in conjunction with said conductive patterns to form a rectangularly spiral conductor within a plane which orthogonally intersects a plane surface of the printed circuit board.

6. An inductance element according to claim 5, wherein said plurality of through holes include a first through hole which interconnects the conductive patterns of said first and second conductive circuits, a second through hole which interconnects the conductive patterns of said second and third conductive circuits, a third through hole which interconnects the conductive patterns of said third and fourth conductive circuits, a fourth through hole which interconnects the conductive patterns of said fourth and fifth conductive circuits, and a fifth through hole which interconnects the conductive patterns of said fifth and sixth conductive circuits.