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Endcap reservoir to reduce electromigration

  • US 5,614,764 A
  • Filed: 01/13/1995
  • Issued: 03/25/1997
  • Est. Priority Date: 01/13/1995
  • Status: Expired due to Term
First Claim
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1. An interconnect structure in a semiconductor device comprising:

  • an interconnect line having a first end and a second end,at least one via coupled to said interconnect line, andan endcap reservoir coupled to said first end of said interconnect line.

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