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Methods for making metal particle spherical and removing oxide film solder paste and soldering method

  • US 5,616,164 A
  • Filed: 01/03/1995
  • Issued: 04/01/1997
  • Est. Priority Date: 03/19/1992
  • Status: Expired due to Fees
First Claim
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1. A method for making a solder metal particle spherical, comprising immersing a solder metal particle having an oxide film on a surface thereof in a heating medium consisting essentially of a rosin and an organic solvent without any activator, the solder metal particle having a melting point and the organic solvent having a boiling point higher than the melting point of the solder metal particle, and then heating the solder metal particle in the heating medium to a temperature above the melting point of the solder metal particle, thereby removing the oxide film.

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