Methods for making metal particle spherical and removing oxide film solder paste and soldering method

• US 5,616,164 A
• Filed: 01/03/1995
• Issued: 04/01/1997
• Est. Priority Date: 03/19/1992
• Status: Expired due to Fees

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Ochiai, Masayuki, Hashimoto, Kaoru, Kawahara, Toshimi, Osumi, Mayumi
• Primary Examiner(s): WYSZOMIERSKI, GEORGE P
• Application Number:
  US08/367,775
• Time in Patent Office: 819 Days
• Field of Search: 75/342, 75/370, 264/15, 134/2
• US Class Current: 75/342
• CPC Class Codes: B22F 1/065 Spherical particles
• CPC Class Codes: B23K 1/20 Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating preparation of surfaces in particular ways, see the relevant classes for the treatments or the materials treated, e.g. C04B, C23C
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/025 Pastes, creams, slurries
• CPC Class Codes: B23K 35/26 with the principal constituent melting at less than 400 degrees C
• CPC Class Codes: B23K 35/262 Sn as the principal constituent
• CPC Class Codes: B23K 35/268 Pb as the principal constituent
• CPC Class Codes: B23K 35/3006 Ag as the principal constituent
• CPC Class Codes: B23K 35/36 Selection of non-metallic compositions, e.g. coatings, fluxes B23K35/34 takes precedence; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest selection of soldering or welding materials proper B23K35/24
• CPC Class Codes: C23G 5/032 containing oxygen-containing compounds
• CPC Class Codes: H05K 3/3431 Leadless components
• CPC Class Codes: H05K 3/3485 Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12
• CPC Class Codes: H05K 3/3494 Heating methods for reflowing of solder using integral heating means H05K1/0212

Abstract

Metal such as solder is immersed in a heating medium containing a rosin or derivative thereof and an organic solvent and heated to a temperature above the melting point of the metal, to remove the oxide film of the metal and make the metal spherical. If a hardened caster oil or high softening point rosin or derivative thereof is further added as a thickener to the heating medium, the size increase of the metal particle can be prevented. By heating at a temperature lower than the melting point of the metal, the oxide film can be removed without making the particles spherical. Using thus obtained solder particles, fluxless soldering can be done. Also, a fluxless soldering method is provided.

Claims

1. A method for making a solder metal particle spherical, comprising immersing a solder metal particle having an oxide film on a surface thereof in a heating medium consisting essentially of a rosin and an organic solvent without any activator, the solder metal particle having a melting point and the organic solvent having a boiling point higher than the melting point of the solder metal particle, and then heating the solder metal particle in the heating medium to a temperature above the melting point of the solder metal particle, thereby removing the oxide film.

2. A method according to claim 1, wherein the solder is one selected from the group consisting of InSn, SnPb, InPb and In.

3. A method according to claim 1, wherein the metal particle is a solder produced by an atomization method.

4. A method for making a solder metal particle spherical, comprising immersing a solder metal particle having an oxide film on a surface thereof in a heating medium consisting essentially of a rosin, hardened castor oil and an organic solvent without any activator, the solder metal particle having a melting point and the organic solvent having a boiling point higher than the melting point of the solder metal particle, and then heating the solder metal particle in the heating medium to a temperature above the melting point of the solder metal particle, thereby removing the oxide film while substantially preventing melting together or unifying a plurality of said solder metal particles resting on the bottom of a tank containing the heating medium.

5. A method according to claim 4, wherein the solder is one selected from the group consisting of InSn, SnPb, and In.

6. A method according to claim 4, wherein the metal particle is a solder produced by an atomization method.

7. A method according to claim 4, wherein the rosin has a softening point of about 80°

C.

8. A method for making a solder metal particle spherical, comprising immersing a solder metal particle having an oxide film on a surface thereof in a heating medium consisting essentially of at least two rosins having substantially different softening points and an organic solvent without any activator, the solder metal particle having a melting point and the organic solvent having a boiling point higher than the melting point of the solder metal particle, and then heating the solder metal particle in the heating medium to a temperature above the melting point of the solder metal particle, thereby removing the oxide film while substantially preventing melting together or unifying a plurality of said solder metal particles resting on the bottom of a tank containing the heating medium.

9. A method according to claim 8, wherein the solder is one selected from the group consisting of InSn, SnPb and In.

10. A method according to claim 8, wherein the solder metal particle is a solder produced by an atomization method.

11. A method according to claim 8, wherein one of said at least two rosins has a softening point of about 80°

C., and the other of said at least two rosins has a softening point of at least 100°

C.

12. A method for removing an oxide film of a solder metal, comprising immersing a solder metal having an oxide film on a surface thereof and having a melting point higher than 280°

C. in a heating medium consisting essentially of a rosin in an alcohol, the heating medium not containing an activator, and then heating the solder metal in the heating medium to a temperature below the melting point of the solder metal in a range of 250°

to 280°

C.

13. A method according to claim 12, wherein the solder is one selected from the group consisting of Au-20Sn, Pb-3.5Ag-1.5Sn, and Pb-5Sn.

14. A method according to claim 12, wherein the solder metal is a solder produced by an atomization method.