Process for fabricating integrating circuits

• US 5,616,518 A
• Filed: 11/03/1994
• Issued: 04/01/1997
• Est. Priority Date: 09/27/1990
• Status: Expired due to Term

• Current Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Pai, Chien-Shing, Foo, Pang-Dow
• Primary Examiner(s): TRINH, MICHAEL MANH
• Application Number:
  US08/333,900
• Time in Patent Office: 880 Days
• Field of Search: 437/192, 437/200, 437/195, 437/187, 437/190, 148/DIG. 147
• US Class Current: 438/680
• CPC Class Codes: H01L 21/76843 formed in openings in a dielectric

Abstract

Integrated circuits employing titanium nitride are significantly improved by using a specific method for formation of the titanium nitride in the device fabrication. In particular, a plasma such as one formed in an electron cyclotron resonance apparatus is employed to dissociate a source of nitrogen and a source of hydrogen and the dissociation products are combined at the integrated circuit deposition substrate with titanium tetrachloride. The resulting deposition is essentially devoid of chlorine and has advantageous step-coverage properties.

Claims

1. A process of fabricating a device comprising the steps of forming an opening in a material layer overlying a substrate and forming titanium nitride in said opening characterized in that said forming of said titanium nitride comprises introducing titanium tetrachloride within the vicinity of said substrate and reacting said titanium tetrachloride at a temperature between 23°

and 500°

C. with a mole excess of atomic nitrogen produced in a plasma formed by an electron cyclotron resonator or a helical resonator, and with hydrogen whereby said titanium nitride is essentially devoid of chlorine.

2. The process of claim 1 wherein said atomic nitrogen is formed by introducing a source of nitrogen into a discharge formed in an apparatus chosen from the group consisting of electron cyclotron resonance and a helical resonator.

3. The process of claim 2 wherein said source of nitrogen comprises molecular nitrogen.

4. The process of claim 2 wherein said source of nitrogen comprises ammonia.

5. The process of claim 1 wherein said atomic nitrogen and said hydrogen is produced from the same source.

6. The process of claim 5 wherein said source comprises ammonia.

7. The process of claim 1 wherein said opening allows electrical contact to a region underlying said layer.

8. The process of claim 7 wherein said region comprises a source or drain of a field effect transistor.

9. The process of claim 1 wherein said material comprises silicon dioxide.