Method and apparatus for compensation of micromachined sensors

• US 5,616,864 A
• Filed: 02/22/1995
• Issued: 04/01/1997
• Est. Priority Date: 02/22/1995
• Status: Expired due to Fees

• Current Assignee: Delco Electronics Corporation (Motors Liquidation Co. GUC Trust)
• Original Assignee: Delco Electronics Corporation (Motors Liquidation Co. GUC Trust)
• Inventors: Johnson, Jack D., Liem, Fie A.
• Primary Examiner(s): Williams, Hezron E.
• Assistant Examiner(s): MOLLER, RICHARD ALAN
• Application Number:
  US08/391,854
• Time in Patent Office: 769 Days
• Field of Search: 73/504.02, 73/504.03, 73/504.04, 73/504.12, 73/504.13
• US Class Current: 73/504.04
• CPC Class Codes: G01C 19/5684 the devices involving a micromechanical structure

Abstract

A yaw rate sensor having a vibrating ring microstructure surrounded by electrodes capacitively coupled to the ring has vibration responsive circuits with inputs connected to several of the sensors, the circuits having outputs connected to others of the electrodes for driving or influencing the vibration. The circuits produce a main drive voltage to excite the ring to resonance, a feedback drive voltage to provide force-to-rebalance correction, and a dc compensation voltage to tune the ring to a single resonance frequency. An economy of electrode space is achieved by using some electrodes for more than one function, e.g. feedback and compensation.

Claims

1. A micromachined sensor comprising:

a micromachined vibration element subject to resonant vibration at two closely spaced frequencies;

a plurality of electrodes capacitively coupled to the vibration element;

an excitation circuit for developing an excitation signal for exciting vibration of said vibration element and for sensing vibration of said vibration element;

a feedback circuit for developing a feedback signal for rebalancing said vibration element;

a compensation circuit for producing a compensation signal for substantially resolving the resonant vibration to one frequency; and

means for coupling said feedback signal and one of said excitation and compensation signals to at least one electrode of said plurality of electrodes for electrode sharing.

2. A micromachined sensor comprising:

a micromachined vibration element subject to resonant vibration at two closely spaced frequencies;

a compensation circuit for producing a compensation signal for balancing said vibration element to substantially resolve said resonant vibration to one frequency;

coupling means including a plurality of electrodes capacitively coupled to said vibration element;

an excitation circuit producing AC excitation signals for vibrating said vibration element;

a feedback circuit for producing AC feedback signals;

means for connecting at least a first electrode of said plurality of electrodes to more than one of said compensation, excitation and feedback signals; and

a vibration sensing circuit coupled to at least a second electrode of said plurality of electrodes for obtaining vibration inputs for said excitation circuit and said compensation circuit.

3. The invention as defined in claim 2 wherein said means for connecting at least a first electrode of said plurality of electrodes includes means for connecting said compensation signal and said feedback signal to said first electrode.

4. The invention as defined in claim 2 wherein said means for connecting at least a first electrode of said plurality of electrodes includes means for connecting said excitation signal and said feedback signal to said first electrode.

5. A microstructure sensor comprising:

a resonant microstructure comprising a ring having two closely spaced natural resonant frequencies;

a plurality of electrodes surrounding said ring and capacitively coupled to said ring;

excitation means having output AC signals coupled to a first set of electrodes for controllably driving said ring into vibration;

compensation means having output DC signals coupled to at least one electrode of the first set of electrodes, thereby imposing both AC and DC signals on said at least one electrode; and

vibration sensing means coupled to a second set of electrodes not including said first set of electrodes for obtaining vibration inputs for the excitation means and the compensation means.

6. The invention as defined in claim 5 wherein said excitation means comprises:

a driving circuit having a main excitation signal coupled to a first subset of said first set of electrodes for exciting said ring to a main mode of vibration; and

a feedback circuit having a rebalancing signal coupled to a second subset of said first set of electrodes for balancing said ring vibration.

7. The invention as defined in claim 6 wherein:

said output DC signals of said compensation means are coupled to at least one electrode of said second subset of electrodes, whereby said at least one electrode is shared by said feedback circuit and said compensation means.

8. The invention as defined in claim 6 wherein said first and second subsets of electrodes overlap so that said driving circuit and said feedback circuit share at least one common electrode.

9. In a sensor having a vibration microstructure surrounded by a plurality of electrodes capacitively coupled to the microstructure, the microstructure having natural resonance at two closely spaced frequencies, a method of sensor operation comprising the steps of:

producing an excitation voltage for developing a vibration driving force on said microstructure;

sensing vibration of said microstructure via a first set of said plurality of electrodes;

producing a force-to-rebalance voltage;

generating a DC compensation voltage; and

applying said force-to-rebalance voltage and one of said excitation and compensation voltages to a second set of said plurality of electrodes not including said first set of said plurality of electrodes for electrode sharing.