Power amplifier, and associated method, for a microwave repeater station

• US 5,617,059 A
• Filed: 07/07/1995
• Issued: 04/01/1997
• Est. Priority Date: 07/07/1995
• Status: Expired due to Fees

• Current Assignee: SSB Technology Company Limited
• Original Assignee: SSB Technology Company Limited
• Inventors: Eggleston, Brian E.
• Primary Examiner(s): Mullins, James B.
• Application Number:
  US08/499,635
• Time in Patent Office: 634 Days
• Field of Search: 330/65, 330/66, 330/68, 330/189, 257/706, 257/707, 257/112, 341/707, 341/709, 341/714, 341/719, 341/720, 341/722, 178/70 S, 178/70 TS, 375/211, 455/7, 455/14, 455/90
• US Class Current: 330/66
• CPC Class Codes: H03F 3/602 Combinations of several amplifiers

Abstract

A microwave amplifier for amplifying microwave signals, such as the microwave signals received by a microwave repeater station. The amplifier is formed of solid state amplifier-transistors to which the microwave signals are applied by way of transmission lines. The amplification circuitry and transmission lines are formed upon a circuit board which is housed within a heat-dissipative housing. The amplifier can be used in substitution for a conventional travelling wave tube, conventionally utilized to amplifier microwave signals received at a microwave repeater station.

Claims

1. In a microwave signal repeater station which receives and retransmits microwave signals, a solid state power amplifier for amplifying a microwave signal from a microwave receiver to a microwave transmitter, said solid state power amplifier comprising:

a supportive housing having a first side, a second side opposing said first side, a first end, and a second end opposing said first end;

a coupler, positioned at said first end of said housing, for applying power from the microwave repeater station to the solid state power amplifier;

an input element positioned at the first side of said supportive housing, said input element for receiving microwave signals from said microwave receiver;

an input transmission line coupled to said input element, said input transmission line for transmitting the microwave signals applied to the input element therealong;

at least one transistor-amplifier element coupled to receive the microwave signals transmitted upon said input transmission line, said at least one transistor-amplifier element for amplifying the microwave signals;

an output transmission line coupled to said transistor-amplifier element, said output transmission line for transmitting the microwave signals once amplified by said transistor-amplifier element therealong;

an output element positioned at the first side of said supportive housing, positioned in-line with said input element, and coupled to said output transmission line, said output element for receiving the microwave signals transmitted along said output transmission line and coupling said microwave signals to said microwave transmitter; and

a heat-dissipative element, positioned at said second end of said housing, for dissipating heat generated during transmission of the microwave signals along said input and output transmission lines by said at least one transistor-amplifier.

2. The solid state power amplifier of claim 1 wherein said input transmission line comprises a microstrip line.

3. The solid state power amplifier of claim 1 wherein said at least one transistor-amplifier element comprises a cascaded series of amplifier stages, wherein successive ones of said amplifier stages are interconnected by interconnecting transmission lines.

4. The solid state power amplifier of claim 3 wherein said interconnecting transmission lines comprise microstrip lines.

5. The solid state power amplifier of claim 3 wherein at least one of said interconnecting transmission lines comprises a signal splitter forming a first and a second signal path forming parallel transmission paths for transmitting the microwave signals therealong.

6. The solid state power amplifier of claim 5 wherein a first amplifier stage of said cascaded series of amplifier stages comprises a first amplifier coupled to said first signal path and a second amplifier coupled to a second signal path, said first and second amplifiers, respectively, for amplifying the microwave signals applied thereto, respectively, on said first and said second signal paths.

7. The solid state power amplifier of claim 6 wherein at least one of said interconnecting transmission lines comprises a signal recombiner having a third and a fourth signal path coupled to said first and second amplifiers, respectively, of the first amplifier stage of said cascaded series of amplifier stages, said third and fourth signal paths for recombining the microwave signals amplified by said first and second amplifiers, respectively.

8. The solid state power amplifier of claim 1 wherein said output transmission line comprises a microstrip line.

9. The solid state power amplifier of claim 1 wherein said housing and said heat dissipative element are integrally formed.

10. The solid state power amplifier of claim 9 wherein said heat dissipative element comprises a heat sink having a plurality of heat-dissipative fins.

11. The solid state power amplifier of claim 10 further comprising a circuit board, said input and output transmission lines, respectively, and said at least one transistor-amplifier element positioned upon said circuit board.

12. The solid state power amplifier of claim 1 wherein said input element is positioned adjacent to said first end of said supportive housing.

13. The solid state power amplifier of claim 1 wherein said output element is positioned adjacent to said second end of said supportive housing.

14. The solid state power amplifier of claim 1 wherein said input element is positioned adjacent to said first end of said supportive housing, and said output element is positioned adjacent to said second end of said supportive housing.

15. The solid state power amplifier of claim 1 wherein said coupler is positioned adjacent to said first input element.

16. In a microwave signal repeater station which receives and retransmits microwave signals, an improvement of a solid state power amplifier, said solid state power amplifier comprising:

a supportive housing;

an input element positioned at a first side of said supportive housing, said input element for receiving microwave signals;

an input transmission line coupled to said input element, said input transmission line for transmitting the microwave signals applied to the input element therealong;

at least one transistor-amplifier element coupled to receive the microwave signals transmitted upon said input transmission line, said at least one transistor-amplifier element for amplifying the microwave signals;

an output transmission line coupled to said transistor-amplifier element, said output transmission line for transmitting the microwave signals once amplified by said transistor-amplifier element therealong;

an output element positioned at the first side of said supportive housing, positioned in-line with said input element, and coupled to said output transmission line, said output element for receiving the microwave signals transmitted along said output transmission line;

a passive, heat-dissipative element positioned together with said supportive housing, said heat-dissipative element for dissipating heat generated during transmission of the microwave signals along said input and output transmission lines, respectively, and amplified by said at least one transistor-amplifier, wherein said heat dissipative element comprises a heat sink having a plurality of heat-dissipative fins; and

a circuit board having at least one via extending through said circuit board, said via forming a conductive path for conducting heat energy generated upon said circuit board to said housing and the heat-dissipative element, wherein said input and output transmission lines, respectively, and said at least one transistor-amplifier element are positioned upon said circuit board.

17. In a microwave repeater station for retransmitting microwave signals received at the station, a method for amplifying the microwave signals between a microwave receiver and a microwave transmitter, the method comprising the steps of:

forming a heat-dissipative housing to be adapted for positioning in the repeater station, said heat-dissipative housing having a first side, a second side opposing said first side, a first end, and a second end opposing said first end;

applying the microwave signals received at the microwave repeater station to an input element positioned at the first side of the heat-dissipative housing;

transmitting the microwave signals applied to the input element along an input microstrip transmission line positioned between the input element and at least one transistor-amplifier element;

amplifying the microwave signals with the at least one transistor-amplifier element;

transmitting the microwave signals amplified by the at least one transistor-amplifier along an output microstrip transmission line;

applying the microwave signals transmitted along the output microstrip transmission line to an output element positioned at the first side of the heat-dissipative housing, in-line with the input element; and

dissipating heat energy generated during said first and second steps of applying, said first and second steps of transmitting, and said step of amplifying, through the heat-dissipative housing.

18. The method of claim 17, wherein said first applying step further comprises positioning said input element adjacent to said first end of said heat-dissipative housing;

and

said second applying step further comprises positioning said output element adjacent to said second end of said heat-dissipative housing.

19. The method of claim 17, further comprising the steps of:

forming a circuit board having at least one via extending through said circuit board, said via forming a conductive path for conducting heat energy generated upon said circuit board to said housing and the heat-dissipative element; and

positioning said input and output microstrip transmission lines and said at least one transistor-amplifier element upon said circuit board.