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Multi-dimensional ultrasonic array interconnect

  • US 5,617,865 A
  • Filed: 03/31/1995
  • Issued: 04/08/1997
  • Est. Priority Date: 03/31/1995
  • Status: Expired due to Term
First Claim
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1. An ultrasonic transducer array comprising:

  • A. a piezoelectric ceramic layer separated in a longitudinal direction into n transducer groups, with each group separated in a transverse direction into m transducer elements;

    B. a flex circuit that includes;

    1) a flexible, electrically non-conductive base layer;

    2) for each transducer element, an electrically conductive via through the base layer in electrical contact with the respective transducer element;

    3) an electrically conductive layer, on a bottom side of the flex circuit, that is divided into a plurality of flex circuit electrodes, with each flex circuit electrode being in electrical contact with a respective one of the transducer elements; and

    4) for each group, electrically conductive traces that are electrically connected by vias to predetermined ones of the flex circuit electrodes and to external driving circuitry, and are located on a top side of the flex circuitin which the electrically conductive layer, and thus the flex circuit electrodes, as well as the electrically conductive traces and vias are pre-patterned onto the flexible base layer, the flex circuit thereby forming a pre-patterned, pre-aligned unit.

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