Iridium oxide film for electrochromic device

• US 5,618,390 A
• Filed: 02/16/1996
• Issued: 04/08/1997
• Est. Priority Date: 11/12/1993
• Status: Expired due to Fees

• Current Assignee: PPG Industries Incorporated (Nouryon BV)
• Original Assignee: PPG Industries Incorporated (Nouryon BV)
• Inventors: O'Brien, Nada A., Yu, Phillip C., Hichwa, Bryant P., Backfisch, David L.
• Primary Examiner(s): Lieberman, Paul
• Assistant Examiner(s): KOPEC, MARK T
• Application Number:
  US08/602,392
• Time in Patent Office: 417 Days
• Field of Search: 252/518, 428/357, 204/151.46, 204/192.21, 204/192.26, 204/901, 204/298.02, 204/298.07, 204/298.13, 204/192.1, 423/22, 420/461
• US Class Current: 204/192.26
• CPC Class Codes: C23C 14/08 Oxides C23C14/10 takes precedence
• CPC Class Codes: G02F 1/15245 based on iridium oxide or hydroxide
• CPC Class Codes: Y10T 428/29 Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof

Abstract

A method of depositing a nitrogen-containing electrochromic iridium oxide film by sputtering iridium in an atmosphere comprising oxygen and nitrogen is disclosed for use in producing a transparent electrochromic article. The article includes electroconductive films, e.g., ITO, on two substrates, one of which has a superimposed electrochromic film, e.g., tungsten oxide, and the other of which has superimposed the iridium oxide film of the invention. An ion conductive layer between the electrochromic films completes the article.

Claims

1. A method of producing a nitrogen-containing iridium oxide film on a surface of a substrate, comprising:

a. providing a substrate and iridium metal target in close association within a vacuum chamber;

b. sputtering the iridium metal target; and

c. contacting said sputtered iridium with a gas mixture comprising oxygen and a nitrogen-containing gas, thereby to deposit a nitrogen-containing iridium oxide film on the surface of the substrate facing the target.

2. The method of claim 1 wherein the substrate and iridium metal target are spaced apart a distance of from about 3 to 6 inches.

3. The method of claim 1 wherein the gas mixture includes an inert gas.

4. The method of claim 3 wherein the nitrogen-containing gas is nitrogen, air or ammonia.

5. The method of claim 1 wherein the iridium metal target is sputtered using DC magnetron sputtering.

6. The method of claim 5 wherein the gas mixture includes argon.

7. The method of claim 6 wherein oxygen and nitrogen are introduced separately into the vacuum chamber and wherein the flow rate of oxygen gas to nitrogen gas is from about 2-8:

1, and wherein the partial pressure of nitrogen in the chamber is at least equal to the argon partial pressure therein.

8. The method of claim 7 wherein the nitrogen-containing iridium oxide film contains from about 2 to 20 atomic percent nitrogen.

9. The method of claim 7 wherein the substrate and iridium metal target are spaced apart a distance of from about 3 to 6 inches.

10. The method of claim 7 wherein the total gas pressure in the chamber during sputtering is in the range of about 5 to 100 milliTorr.

11. The method of claim 10 wherein the chamber pressure is in the range of 40-75 milliTorr.

12. The method of claim 10 wherein the substrate is selected from the group consisting of glass and organic polymers.

13. The method of claim 10 wherein the surface of the substrate provided in step (a) has a coating of an electroconductive metal oxide film.

14. The method of claim 13 wherein the electroconductive metal oxide is selected from the group consisting of tin oxide and indium/tin oxide.