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Common aperture isolated dual frequency band antenna

  • US 5,619,218 A
  • Filed: 06/06/1995
  • Issued: 04/08/1997
  • Est. Priority Date: 06/06/1995
  • Status: Expired due to Term
First Claim
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1. A common aperture isolated dual frequency band antenna comprising:

  • a substrate having first and second surfaces;

    a low band spiral antenna formed on the substrate that comprises;

    a first termination disposed adjacent the periphery of the substrate;

    first conductive metallization disposed on the first surface of the substrate and coupled to the first termination that spirals in a first direction from the first termination a predetermined distance towards the center of the substrate;

    a first via disposed through the substrate for coupling the first conductive metallization to the second surface of the substrate;

    a second vias disposed through the substrate;

    second surface metallization disposed on the second surface of the substrate connected between the first and second vias;

    second conductive metallization disposed on the first surface of the substrate and coupled to the second via that spirals in a second direction increasing in diameter as it progresses toward the periphery of the substrate; and

    a first feed that is coupled to the second conductive metallization; and

    a high band spiral antenna formed on the substrate that comprises;

    a second termination disposed adjacent an innermost spiral of metallization of the low band antenna;

    third conductive metallization disposed on the first surface of the substrate that spirals in the second direction from the second termination toward the center of the substrate;

    fourth conductive metallization disposed on the first surface of the substrate that spirals in the first direction from the center of the substrate toward the innermost spiral of metallization of the low band antenna;

    a conductive jumper coupled between the third and fourth conductive metallizations; and

    a second feed coupled to the fourth conductive metallization.

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