Implantable medical device having shielded and filtered feedthrough assembly and methods for making such assembly

• US 5,620,476 A
• Filed: 11/13/1995
• Issued: 04/15/1997
• Est. Priority Date: 11/13/1995
• Status: Expired due to Term

• Current Assignee: Pacesetter Incorporated (Abbott Laboratories Incorporated)
• Original Assignee: Pacesetter Incorporated (Abbott Laboratories Incorporated)
• Inventors: Gibson, Scott R., Truex, Buehl E., Weinberg, Alvin H.
• Primary Examiner(s): Kamm, William E.
• Assistant Examiner(s): EVANISKO, GEORGE ROBERT
• Application Number:
  US08/565,204
• Time in Patent Office: 519 Days
• Field of Search: 607/36, 607/37, 174/50.5, 174/50.51, 174/50.52, 174/50.53, 174/68.1, 174/151, 174/250, 174/260, 174/261, 174/262, 174/265, 174/35 R, 361/792, 361/794, 361/816, 361/800, 361/728, 361/736, 361/733, 361/752
• US Class Current: 607/36
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01R 13/5202 Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings

Abstract

A wireless feedthrough assembly, for coupling leads received in the receptacles of a connector assembly to the electronic circuit within a cardiac pacemaker, includes a weld ring mounted in hermetically sealed fashion within a housing wall of the pacemaker and itself hermetically sealed to an intermediate portion of an elongated, multilayered structure. The multilayered structure includes layers of electrically insulating ceramic material on opposite sides of a planar array of printed conductors extending between a first portion of the structure within the connector assembly and an opposite second portion of the structure within the pacemaker. Connector pads at the ends of the printed conductors within the first portion are coupled to the receptacles of the connector assembly, while contact pads at the exterior of the second portion and coupled by vias to connector pads at the ends of the printed conductors are coupled to the electronic circuits within the pacemaker. Printed ground planes on the multilayered structure form a conductive envelope which shields the printed conductors from electric fields. The contact pads include positive and ground contacts to which are coupled discrete filtering capacitors for limiting the spectrum of frequencies receivable by the connector assembly. A method for making the aforedescribed feedthrough assembly is also disclosed.

Claims

1. In an implantable medical device having a hermetically sealed housing, said housing including a wall and enclosing electronic circuits for producing electrical stimulating pulses, an improved system for electrically connecting the electronic circuits with an implantable lead, the improved system comprising:

a plurality of connector blocks for making electrical contact with the implantable lead;

a hollow weld ring mounted in the wall of the hermetically sealed housing;

a multilayered structure disposed within and extending from opposite sides of the hollow weld ring so as to have a first portion outside the hermetically sealed housing and an opposite second portion within the hermetically sealed housing, the multilayered structure including a laminate of insulating layers with printed conductors therebetween, the printed conductors extending between the first and second portions and terminating in a first plurality of connector pads at the first portion for connection to respective ones of the plurality of connector blocks and in a second plurality of connector pads at the second portion for connection to the electronic circuits;

conductive means for electrically connecting the plurality of connector blocks with respective ones of the first plurality of connector pads at the first portion of the multilayered structure; and

a connector assembly attached to the hermetically sealed housing enclosing the plurality of connector blocks, the first portion of the multilayer structure and the conductive means therein, the connector assembly further having at least one receptacle for receiving the implantable lead therein.

2. The improved system, as defined in claim 1, wherein:

the printed conductors are disposed in a generally planar array and include positive traces terminating, at opposite ends thereof, in the first plurality of connector pads at the first portion and in the second plurality of connector pads at the second portion; and

the second plurality of connector pads at the second portion are coupled by vias to a plurality of contact pads at an exterior of the second portion, the plurality of contact pads being coupled to the electronic circuits.

3. The improved system, as defined in claim 2, wherein:

the printed conductors include a ground trace disposed outside of the positive traces within the generally planar array; and

the laminate of insulating layers includes first and second ground planes disposed on opposite sides of the generally planar array of printed conductors and electrically coupled to the ground trace to provide magnetic field shielding of the feedthrough assembly.

4. The improved system, as defined in claim 3, wherein:

the laminate of insulating layers includes first and second ceramic layers respectively disposed between the first and second ground planes and the generally planar array of printed conductors.

5. The improved system, as defined in claim 4, wherein:

the first ceramic layer has a plurality of apertures therein in an end portion thereof providing access to the first plurality of connector pads at the first portion of the multilayered structure.

6. The improved system, as defined in claim 4, wherein:

the laminate of insulating layers includes a third ceramic layer disposed on the opposite side of the first ground plane from the first ceramic layer and mounting the plurality of contact pads at the exterior of the second portion; and

the plurality of contact pads includes a plurality of positive contacts coupled by vias extending through apertures in the third ceramic layer, the first ground plane and the first ceramic layer to the positive traces of the generally planar array of printed conductors.

7. The improved system, as defined in claim 6, further comprising:

a plurality of ground contacts mounted on the third ceramic layer and coupled by vias extending through the third ceramic layer to the first ground plane; and

a plurality of filtering capacitors coupled between the positive contacts and the ground contacts.

8. The improved system, as defined in claim 2, wherein:

the printed conductors include positive traces and a ground trace;

the plurality of contact pads at the exterior of the second portion include positive contacts coupled to the positive traces of the printed conductors and ground contacts coupled to the ground trace of the printed conductors; and

further including a plurality of filtering capacitors coupled between the positive contacts and the ground contacts.

9. In an implantable medical device having a hermetically sealed housing, said housing including a wall and enclosing electronic circuits for producing electrical stimulating pulses, an improved system for electrically connecting the electronic circuits with an implantable lead, the improved system comprising:

at least one connector block for making electrical contact with the implantable lead;

an elongated multilayered structure having a first portion for disposition outside the hermetically sealed housing, an opposite second portion for disposition inside the hermetically sealed housing and an intermediate portion between the first and second portions adapted to be disposed, in hermetically sealed fashion, within the wall of the hermetically sealed housing, the multilayered structure including a generally planar array of printed conductors disposed between opposite layers of electrically insulating material and extending between the first and second portions, at least one connector pad coupled to the generally planar array of printed conductors at the first portion for coupling to the at least one connector block, and at least one contact coupled to the generally planar array of printed conductors at the second portion for coupling to the electronic circuits of the implantable medical device;

conductive means for electrically connecting the at least one connector block and the at least one connector pad at the first portion of the multilayered structure; and

a connector assembly attached to the hermetically sealed housing enclosing the at least one connector block, the first portion of the multilayer structure and the conductive means therein.

10. The improved system, as defined in claim 9, further comprising:

means disposed around the generally planar array of printed conductors for electrically shielding such printed conductors.

11. The improved system, as defined in claim 10, wherein the means for electrically shielding comprises:

a conductive envelope surrounding the generally planar array of printed conductors and electrically coupled to ground.

12. The improved system, as defined in claim 11, wherein:

the generally planar array of printed conductors includes positive traces and a ground trace disposed outside of the positive traces; and

the conductive envelope includes first and second ground planes disposed on opposite sides of the generally planar array of printed conductors and electrically coupled to the ground trace.

13. The improved system, as defined in claim 12, further comprising:

first and second ceramic layers disposed on opposite sides of the generally planar array of printed conductors between the generally planar array of printed conductors and the first and second ground planes respectively;

a third ceramic layer disposed opposite the first ground plane from the first ceramic layer; and

a fourth ceramic layer disposed opposite the second ground plane from the second ceramic layer.

14. The improved system, as defined in claim 13, wherein:

the first and second ground planes are coupled to the ground trace by vias extending through the first and second ceramic layers respectively; and

the at least one contact is mounted on the third ceramic layer and is coupled to the positive traces by at least one via extending through the third ceramic layer, the first ground plane, and the first ceramic layer.

15. The improved system, as defined in claim 13, wherein:

the generally planar array of printed conductors, the at least one connector pad, the at least one contact and the first and second ground planes are made of platinum alloy; and

the first, second, third and fourth ceramic layers are made of alumina.

16. The improved system, as defined in claim 9, further comprising:

filtering means coupled to the at least one contact for limiting a spectrum of frequencies receivable by the improved system.

17. The improved system, as defined in claim 16, wherein:

the at least one contact includes a plurality of positive contacts coupled to the generally planar array of printed conductors and a plurality of electrically grounded ground contacts; and

the filtering means includes a plurality of filtering capacitors coupled between the positive contacts and the ground contacts.

18. The improved system, as defined in claim 9, further comprising:

a weld ring disposed around and sealed to the intermediate portion of the elongated, multilayered structure, the weld ring being hermetically sealed within the housing.

19. The improved system, as defined in claim 18, wherein the weld ring is made of titanium alloy and is hermetically sealed within the housing by laser welding.