Method and apparatus for projection exposure

• US 5,621,500 A
• Filed: 05/25/1995
• Issued: 04/15/1997
• Est. Priority Date: 05/25/1995
• Status: Expired due to Fees

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Shiraishi, Naomasa
• Primary Examiner(s): Grimley, Arthur T.
• Assistant Examiner(s): KERNER, HERBERT
• Application Number:
  US08/450,238
• Time in Patent Office: 691 Days
• Field of Search: 355/53, 355/77, 355/52, 355/55, 355/71
• US Class Current: 355/71
• CPC Class Codes: G03F 7/70308 Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
• CPC Class Codes: G03F 7/70333 Focus drilling, i.e. increase in depth of focus for exposure by modulating focus during exposure [FLEX]
• CPC Class Codes: G03F 7/70575 Wavelength control, e.g. control of bandwidth, multiple wavelength, selection of wavelength or matching of optical components to wavelength

Abstract

A projection exposure method wherein a mask (R) is illuminated with illuminating light (ILB) for exposure, and an image of the mask pattern is projected onto a photosensitive substrate (W) through a projection optical system (PL). A phase plate is disposed on a Fourier transform plane (FTP) of the projection optical system (PL) or on a plane near the Fourier transform plane. The circular region of the phase plate of radius r2 is divided into a central circular region (FA) and a peripheral annular region (FB) when the pattern image of the mask (R) is to be transferred onto the substrate (W) by successively carrying out three divided exposure operations such that the position of the substrate (W) relative to the position of the image-forming plane of the projection optical system (PL) is changed in the optical axis direction by a distance d at a time, the distance d is set at a value which is determined according to the numerical aperture of the projection optical system (PL) and the wavelength of the illuminating light. Moreover, the amounts of exposure for two of the three divided exposure operations which are carried out at two opposite extremity positions of the exposure range in the optical axis direction are set substantially equal to each other, and the amount of exposure for one of the three divided exposure operations which is carried out at an intermediate position in the optical axis direction is set according to the distance d.

Claims

1. A projection exposure method wherein a mask formed with a pattern for transfer is illuminated with illuminating light for exposure, and an image of said mask pattern is projected onto a photosensitive substrate through a projection optical system, said method comprising the steps of:

using a phase plate which is disposed on a Fourier transform plane of said projection optical system or on a plane near said Fourier transform plane, said phase plate including a circular region of radius r2 which is centered at an optical axis of said projection optical system and which allows said illuminating light to pass therethrough;

dividing said circular region into a central circular region of radius r1 (r1<

r2) which is centered at the optical axis of said projection optical system, and a peripheral annular region which lies between a circle of radius r1 and a circle of radius r2, which are centered at said optical axis;

setting not only a ratio t (=t1/t2) of an amplitude transmittance t1 of illuminating light passing through said central circular region to an amplitude transmittance t2 of illuminating light passing through said peripheral annular region, at a value which is not larger than zero, but also a ratio r1/r2 of said radius r1 to said radius r2, at a value which is determined according to said amplitude transmittance ratio t;

when the pattern image of said mask is to be transferred onto said substrate by successively carrying out three divided exposure operations such that a position of said substrate relative to a position of an image-forming plane of said projection optical system is successively changed in the optical axis direction of said projection optical system by a distance d at a time, setting said distance d at a value which is determined according to a numerical aperture NA of said projection optical system and a wavelength λ

of said illuminating light;

setting two amounts of exposure for two of said three divided exposure operations which are carried out at two opposite extremity positions of an exposure range in said optical axis direction such that said two amounts of exposure become substantially equal to each other; and

setting one amount of exposure for one of said three divided exposure operations which is carried out at an intermediate position in said optical axis direction, at a value which is determined according to said distance d.

2. A method according to claim 1, wherein the ratio r1/r2 of said radius r1 to said radius r2 is set in a range determined by making allowances of ±

15% for a value which is given by an expression of (0.34+0.12t) using said amplitude transmittance ratio t, and

said distance d for said three divided exposure operations is set in a range of from 1 to 2 times a standard distance U which is determined according to the following expression using the wavelength λ

of said illuminating light, and the substrate-side numerical aperture NA of said projection optical system;

space="preserve" listing-type="equation">U=λ

/[2{1-(1-NA.sup.2).sup.1/2 }]

and wherein, assuming that a scale factor of said distance d with respect to said standard distance U is α

(1<

α

<

2), a ratio β

1 of the amount of exposure at said intermediate exposure position to the amount of exposure at one of said two extremity exposure positions is set in a range determined by making allowances of ±

5% for a value given by an expression of (-2.14α

² +7.37α

-5.15).

3. A projection exposure apparatus wherein a mask formed with a pattern for transfer is illuminated with illuminating light for exposure, and an image of said mask pattern is projected onto a photosensitive substrate through a projection optical system, said apparatus comprising:

a phase plate which is disposed on a Fourier transform plane of said projection optical system or on a plane near said Fourier transform plane, said phase plate including a circular region of radius r2 which is centered at an optical axis of said projection optical system and which allows said illuminating light to pass therethrough, said circular region being divided into a central circular region of radius r1 (r1<

r2) which is centered at the optical axis of said projection optical system, and a peripheral annular region which lies between a circle of radius r1 and a circle of radius r2, which are centered at said optical axis, wherein a ratio t (=t1/t2) of an amplitude transmittance t1 of illuminating light passing through said central circular region to an amplitude transmittance t2 of illuminating light passing through said peripheral annular region is set at a value which is not larger than zero, and a ratio r1/r2 of said radius r1 to said radius r2 is set at a value which is determined according to said amplitude transmittance ratio t;

a relative height control mechanism for moving said substrate and an image-forming plane of said projection optical system relative to each other in said optical axis direction; and

an exposure control system for controlling an amount of exposure by which said substrate is exposed to said illuminating light;

wherein, when the pattern image of said mask is to be transferred onto said substrate by successively carrying out three divided exposure operations such that a position of said substrate relative to a position of the image-forming plane of said projection optical system is successively changed in said optical axis direction by a distance d at a time through said relative height control mechanism, said distance d is set at a value which is determined according to a numerical aperture NA of said projection optical system and a wavelength λ

of said illuminating light; and

two amounts of exposure for two of said three divided exposure operations which are carried out at two opposite extremity positions of an exposure range in said optical axis direction are set substantially equal to each other through said exposure control system, and an amount of exposure for one of said three divided exposure operations which is carried out at an intermediate position in said optical axis direction is set at a value which is determined according to said distance d through said exposure control system.

4. An apparatus according to claim 3, wherein the ratio r1/r2 of said radius r1 to said radius r2 is set in a range determined by making allowances of ±

15% for a value which is given by an expression of (0.34+0.12t) using said amplitude transmittance ratio t; and

said distance d for said three divided exposure operations is set in a range of from 1 to 2 times a standard distance U which is determined according to the following expression using the wavelength λ

of said illuminating light, and the substrate-side numerical aperture NA of said projection optical system;

space="preserve" listing-type="equation">U=λ

/[2{1-(1-NA.sup.2).sup.1/2 }]

and wherein, assuming that a scale factor of said distance d with respect to said standard distance U is α

(1<

α

<

2), a ratio β

1 of the amount of exposure at said intermediate exposure position to the amount of exposure at one of said two extremity exposure positions is set in a range determined by making allowances of ±

5% for a value given by an expression of (-2.14α

² +7.37α

-5.15).

5. An apparatus according to claim 3 or 4, wherein there are a plurality of said phase plates, said phase plates being different from each other in the radius r1 of said central circular region, and said phase plates being alternatively disposed on or near said Fourier transform plane.

6. A projection exposure method wherein a mask formed with a pattern is irradiated with illuminating light, and an image of said mask pattern is projected onto a photo-sensitive substrate through a projection optical system, said method comprising the steps of:

disposing an optical filter on a Fourier transform plane in said projection optical system or on a plane near said Fourier transform plane, said optical filter having a central circular region which is centered at an optical axis of said projection optical axis, and an outer region which is provided outwardly of said central circular region so that an amplitude transmittance t1 of light passing through said central circular region is different from an amplitude transmittance t2 of light passing through said outer region; and

projecting said pattern image onto said substrate by carrying out exposure when said substrate is successively rearranged at three different positions spaced in the optical axis direction of said projection optical system, such that amounts of exposure at two opposite extremity positions of said three positions in said optical axis direction are approximately equal to each other.

7. A method according to claim 6, wherein a distance d between each of the two extremity exposure positions and the exposure position intermediate between them is set in a range of from 1 to 2 times a standard distance U which is determined according to the following expression:

space="preserve" listing-type="equation">U=λ

/[2{1-(1-NA.sup.2).sup.1/2 }]

where λ

is a wavelength of said illuminating light, and NA is a substrate-side numerical aperture of said projection optical system.

8. A method according to claim 7, wherein, assuming that said distance d is α

times (1<

α

<

2) said standard distance U, a ratio β

1 of the amount of exposure at said intermediate exposure position to the amount of exposure at one of said two extremity exposure positions is set in a range determined by making allowances of ±

5% for a value given by an expression of (-2.14α

² +7.37α

-5.15).

9. A method according to claim 6, wherein said optical filter is set so that a ratio t of the amplitude transmittance t1 of said circular region to the amplitude transmittance t2 of said outer region is not larger than zero;

and

wherein, assuming that a radius of said circular region is r1, and said outer region is an annular region having an inner radius r1 as well as an outer radius r2, a ratio r1/r2 of said radius r1 to said radius r2 is set within a range determined by making allowances of ±

15% for a value given by an expression of (0.34+0.12t).

10. A projection exposure apparatus comprising:

an illumination system for irradiating a mask with illuminating light;

a projection optical system for projecting an image of a pattern on said mask onto a photosensitive substrate;

an optical filter which is disposed on a Fourier transform plane in said projection optical system or on a plane near said Fourier transform plane, said optical filter having central circular region which is centered at an optical axis of said projection optical system, and an outer region which is provided outwardly of said central circular region so that an amplitude transmittance t1 of light passing through said circular region is different from an amplitude transmittance t2 of light passing through said outer region;

a driving system for stepwisely moving said substrate in said optical axis direction of said projection optical system for projecting said pattern image when said substrate is successively rearranged at three different positions spaced in said optical axis direction; and

a member for controlling an amount of exposure by which said mask is irradiated with said illuminating light so that amounts of exposure which are applied to said substrate by projection of said pattern image at two opposite extremity exposure positions in said optical axis direction are approximately equal to each other.

11. An apparatus according to claim 10, further comprising:

a transparent plate having an optical thickness which is approximately equal to that of said optical filter; and

a member for retaining said transparent plate so that, when said optical filter is withdrawn from an image-forming optical path of said projection optical system, said transparent plate is disposed on the Fourier transform plane of said projection optical system or on a plane near said Fourier transform plane.

12. An apparatus according to claim 10, wherein said driving system includes:

a stage which is movable in said optical axis direction with said substrate retained thereon; and

a member for driving said stage so that a distance d between each of the two extremity exposure positions and the exposure position intermediate between them is set in a range of from 1 to 2 times a standard distance U which is determined according to the following expression;

space="preserve" listing-type="equation">U=λ

/[2{1-(1-NA.sup.2).sup.1/2 }]

where λ

is a wavelength of said illuminating light, and NA is a substrate-side numerical aperture of said projection optical system.

13. An apparatus according to claim 10, wherein, assuming that said distance d is a times (1<

α

<

2) said standard distance U, said control member sets a ratio of the amount of exposure at said intermediate exposure position to the amount of exposure at one of said two extremity exposure positions in a range determined by making allowances of ±

5% for a value given by an expression of (-2.14α

² +7.37α

-5.15).

14. An apparatus according to claim 10, wherein said optical filter is set so that a ratio t of the amplitude transmittance t1 of said central circular region to the amplitude transmittance t2 of said outer region is not larger than zero;

and

wherein, assuming that a radius of said central circular region is r1, and said outer region is an annular region having an inner radius r1 as well as an outer radius r2, a ratio r1/r2 of said radius r1 to said radius r2 is set within a range determined by making allowances of ±

15% for a value given by an expression of (0.34+0.12t).