Apparatus and method for verifying the coplanarity of a ball grid array

• US 5,621,530 A
• Filed: 04/26/1995
• Issued: 04/15/1997
• Est. Priority Date: 04/26/1995
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Marrable, Walter E. Jr.
• Primary Examiner(s): Pham, Hoa Q.
• Application Number:
  US08/429,377
• Time in Patent Office: 720 Days
• Field of Search: 356/394, 356/398, 356/376, 356/375, 356/371, 356/237, 348/87, 348/126
• US Class Current: 356/394
• CPC Class Codes: G01B 11/306 for measuring evenness
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14

Abstract

The apparatus (10) includes a flat transparent surface (30) and two angled mirrored surfaces (32, 34) which direct the light to the ball grid array (12) on the underside of the semiconductor device (14) positioned on the flat transparent surface (30) in a live bug mode. The mirrored surfaces (32, 34) also direct the image of the ball grid array (12) to an image capturer (18) such as a video camera. The focus information of each solder ball is used to determine the distance to the tips of each solder ball. The coplanarity of the ball grid array can then be determined and/or verified.

Claims

1. A method for verifying the coplanarity of a ball grid array having a plurality of solder balls on the underside of a semiconductor device package, comprising the steps of:

positioning the semiconductor device with the ball grid array down on a flat transparent surface;

positioning a light source and an image capturer generally above the semiconductor device;

directing light from said light source through the flat transparent surface to the ball grid array;

directing the image of the ball grid array through the flat transparent surface to said image capturer;

focusing said image capturer on each of said plurality of solder balls and generating a focus data for each solder ball; and

determining the coplanarity of the ball grid array from said focus data.

2. The method, as set forth in claim 1, wherein said light and image directing steps include the step of reflecting the light and image with mirrored surfaces.

3. The method, as set forth in claim 1, further comprising the steps of perpendicularly aligning the light source and image capturer to the flat transparent surface.

4. The method, as set forth in claim 3, wherein said perpendicularly aligning step includes the steps of:

positioning at least three reference plane datums on the flat transparent surface;

focusing on each of the reference plane datums and generating a focus data for each datum; and

comparing the focus data of the datums.

5. The method, as set forth in claim 1, wherein said light and image directing steps include the steps of:

providing a first mirrored surface at a 45°

angle with respect to said flat transparent surface;

providing a second mirrored surface at a 135°

angle with respect to the flat transparent surface; and

positioning said light source so that the light therefrom is reflected by said first mirrored surface to said second mirrored surface and further reflected through said flat transparent surface to said ball grid array.

6. The method, as set forth in claim 5, further comprising the step of positioning said image capturer so that the image of said ball grid array is reflected by said second mirrored surface to said first mirrored surface to said image capturer.

7. The method, as set forth in claim 1, further comprising the step of verifying the accuracy of the step of determining the coplanarity by using a golden unit having known solder ball heights.

8. Apparatus for verifying the coplanarity of a plurality of solder balls of a ball grid array located on an underside of a semiconductor device, comprising:

an optical assembly having a flat transparent surface supporting said semiconductor device in a live bug mode;

a light source illuminating said ball grid array; and

an image capturer having a focus mechanism generating focus data for each of said plurality of solder balls.

9. The apparatus, as set forth in claim 8, wherein said optical assembly further includes:

a first mirrored surface positioned at a 45°

angle below said flat transparent surface; and

a second mirrored surface positioned at a 135°

angle below said flat transparent surface.

10. The apparatus, as set forth in claim 8, wherein said optical assembly includes:

a first prism having two transparent sides and a mirrored side;

a second prism having two transparent sides and a mirrored side; and

said first and second prism being positioned to direct light from said light source to said ball grid array, and to direct image of said ball grid array to said image capturer.

11. The apparatus, as set forth in claim 8, further comprising a video measuring system.

12. The apparatus, as set forth in claim 8, further comprising a set of reflective reference plane datums positioned on said flat transparent surface about said semiconductor device used for aligning said image capturer with said optical assembly.

13. The apparatus, as set forth in claim 8, further comprising a golden unit having known solder ball heights used for verifying the accuracy of the apparatus.