Opto-electronic hybrid integration platform, optical sub-module, opto-electronic hybrid integration circuit and process for fabricating platform

• US 5,621,837 A
• Filed: 08/08/1994
• Issued: 04/15/1997
• Est. Priority Date: 08/09/1993
• Status: Expired due to Term

• Current Assignee: Nippon Telegraph and Telephone Corporation
• Original Assignee: Nippon Telegraph and Telephone Corporation
• Inventors: Kato, Kuniharu, Yanagisawa, Masahiro, Yoshino, Kaoru, Hashimoto, Toshikazu, Mino, Shinji, Yamada, Yasufumi, Terui, Hiroshi, Sugita, Akio, Ogawa, Ikuo, Moriwaki, Kazuyuki
• Primary Examiner(s): Ngo, John
• Application Number:
  US08/286,968
• Time in Patent Office: 981 Days
• Field of Search: 385/88-94, 385/14, 257/81, 257/82, 257/98, 257/99, 257/433, 257/434
• US Class Current: 385/88
• CPC Class Codes: G02B 6/42 Coupling light guides with opto-electronic elements
• CPC Class Codes: G02B 6/421 the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
• CPC Class Codes: G02B 6/4219 Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
• CPC Class Codes: G02B 6/4224 using visual alignment markings, e.g. index methods
• CPC Class Codes: G02B 6/4225 by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
• CPC Class Codes: G02B 6/4227 Active alignment methods, e.g. procedures and algorithms
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4238 Soldering
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01S 5/021 Silicon based substrates
• CPC Class Codes: H01S 5/06226 Modulation at ultra-high frequencies
• CPC Class Codes: H01S 5/2068 : obtained by radiation treatment or annealing

Abstract

An opto-electronic hybrid integrated circuit of the present invention satisfy a low-loss optical waveguide function, an optical bench function and a high-frequency electrical wiring function. The circuit includes a substrate such as a silicon substrate, a dielectric optical waveguide part arranged in a recess of the substrate, and an optical device mounting part formed on a protrusion of the substrate. An electrical wiring part is disposed on the dielectric layer. The optical device is mounted on the substrate. An optical sub-module includes the optical device which is possible to mount on the substrate.

Claims

1. An optical sub-module, comprising:

an optical functional device having an active layer and an optical device height reference surface separated from said active layer by a predetermined distance;

a carrier having an optical device holding surface for holding said optical functional device, a carrier height reference surface separated from said optical device holding surface by a predetermined distance, and a carrier electrical wiring, wherein said carrier is formed of a substrate having a protrusion and a recess, wherein said optical device holding surface and said carrier height reference surface are formed of said substrate protrusion, and wherein said carrier electrical wiring is formed within said substrate recess;

said optical device height reference surface of said optical functional device being fixedly contacted with the optical device holding surface of said carrier, and an active-layer-side electrode of said optical functional device being electrically connected to said carrier electrical wiring.

2. An optical sub-module, comprising:

an optical functional device having an active layer and an optical device height reference surface separated from said active layer by a predetermined distance;

a carrier having an optical device holding surface for holding said optical functional device, a carrier height reference surface separated from said optical device holding surface by a predetermined distance, and a carrier electrical wiring, wherein said carrier is formed of a substrate having a protrusion and a recess, and a dielectric layer formed on said substrate recess, wherein said optical device holding surface and said carrier height reference surface are formed of said substrate protrusion, and wherein said carrier electrical wiring is formed on said dielectric layer,

said optical device height reference surface of said optical functional device being fixedly contacted with the optical device holding surface of said carrier, and an active-layer-side electrode of said optical functional device being electrically connected to said carrier electrical wiring.

3. An optical sub-module as claimed in claim 2, wherein said dielectric layer of said carrier is a film-formed material, and wherein said carrier electrical wiring is formed on the surface of and within said dielectric layer.