System with chip to chip communication
First Claim
1. A single electronic component comprising:
- (a) a first semiconductor chip comprising;
(1) a first circuit for providing a first signal conveying information; and
(2) a first transmitter for broadcasting information conveyed by the first signal; and
(b) a second semiconductor chip comprising;
(1) a first receiver for receiving the transmitted information, without any physical connection to the first semiconductor chip and independent of any alignment between the first semiconductor chip and the second semiconductor chip, and for providing a second signal conveying the transmitted information; and
(2) a second circuit responsive to the second signal; and
(c) a first enclosure, surrounding the first semiconductor chip and the second semiconductor chip, composed of an electrically conductive material for maintaining communication between the first transmitter and the first receiver of the single electronic component.
4 Assignments
0 Petitions
Accused Products
Abstract
A system for wireless communication between a plurality of semiconductor chips is disclosed. Each data line in the present invention is coupled with a transmitter for transmitting information to any other semiconductor chip. Furthermore, each data line is coupled with a receiver for receiving information transmitted by any transmitter. The system also comprises multiple antennas, fabricated from the chip'"'"'s metalization layer. Nonetheless, separate antennas within the chip packaging can also be used. The antenna unit comprises a dipole and a loop antenna in a planar arrangement, thereby forming a spherical electromagnetic pattern of coverage and making the orientation between semiconductor chips for transmission purposes substantially irrelevant. Each transmitter in the system comprises a modulator for modulating the information being transmitted, while each receiver comprises a demodulator for demodulating the information transmitted. Several modulation schemes can be employed, though amplitude modulation is preferred, whereby each transmitter has a distinct carrier frequency within the operative radio frequency spectra--preferably above 900 MHz. Each transmitter and receiver is coupled to a power source comprising a capacitor, as a signal generator, and a rectifying circuit. To ensure that the communication between chips is noise/interference free, the entire system is shielded with a metal housing.
362 Citations
21 Claims
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1. A single electronic component comprising:
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(a) a first semiconductor chip comprising; (1) a first circuit for providing a first signal conveying information; and (2) a first transmitter for broadcasting information conveyed by the first signal; and (b) a second semiconductor chip comprising; (1) a first receiver for receiving the transmitted information, without any physical connection to the first semiconductor chip and independent of any alignment between the first semiconductor chip and the second semiconductor chip, and for providing a second signal conveying the transmitted information; and (2) a second circuit responsive to the second signal; and (c) a first enclosure, surrounding the first semiconductor chip and the second semiconductor chip, composed of an electrically conductive material for maintaining communication between the first transmitter and the first receiver of the single electronic component.
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2. A single electronic component comprising:
a plurality of semiconductor chips which transfer data among each other, wherein each chips includes a transceiver, and wherein the transceiver of each chip includes a transmitter for modulating a radio frequency (RF) signal with data and for transmitting the modulated RF signal in a radiation pattern which encompasses each of the chips; and a receiver for receiving the respective modulated RF signal from the transmitter of each of the other chips, independent of the physical alignment between each two chips within said plurality of chips, wherein the received signals are received through RF wave propagation through space rather than through physical connection between the chips of the single electronic component. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. An single electrical circuit comprising:
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(a) a first semiconductor chip comprising; (1) a first circuit for providing a first signal conveying information; and (2) a first transmitter for broadcasting information conveyed by the first signal; and (b) a second semiconductor chip comprising; (1) a first receiver for receiving the transmitted information, without any physical connection to the first semiconductor chip and independent of any alignment between the first semiconductor chip and the second semiconductor chip and for providing a second signal conveying the transmitted information; and (2) a second circuit responsive to the second signal; and (c) a first metal enclosure, surrounding the first semiconductor chip and the second semiconductor chip, for maintaining communication between the first transmitter and the first receiver of the single electrical circuit.
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20. An single electrical circuit having a plurality of semiconductor chips which transfer data among each other, comprising:
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said plurality of semiconductor chips, wherein each chip includes a transmitter for modulating a radio frequency (RF) signal with data and for transmitting the modulated RF signal in a radiation pattern which encompasses each of the chips, and each chip includes a receiver for receiving the respective modulated RF signal from the transmitter of each of the other chips, independent of the physical alignment between each two chips within said plurality of chips, wherein the received signals are received through RF wave propagation through space rather than through physical connection between the chips; and a metal enclosure, surrounding all of the chips, for maintaining communication among the chips of the single electrical circuit.
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21. A method of manufacturing an single electronic component, comprising the steps of:
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providing an enclosure composed of electrically conductive material; and mounting within the enclosure a plurality of semiconductor chips, wherein each chip includes an RF transceiver for transmitting data to, and receiving data from, the other chips independent of the physical alignment between each two chips within said plurality of chips, and wherein the chips are mounted without any physical connectors between the chips for transferring said data; whereby the electrically conductive enclosure maintains communication among the chips of the single electronic component.
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Specification