Reducing particulate contamination during semiconductor device processing
First Claim
1. A method of removing particles from the surface of a substrate mounted in a plasma processing vacuum chamber comprisinga) reducing the pressure in the chamber while maintaining a plasma of a gas stream in the chamber so that the particles are elevated above any obstructions near the substrate being processed;
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Accused Products
Abstract
Contaminant particles in a vacuum plasma processing chamber can be removed from the surface of a substrate in the chamber by first reducing the pressure in the chamber so as to elevate the particles above any obstruction about the substrate, including a clamping ring and the like, maintaining a plasma from a gas fed to the chamber so that the particles are in the plasma, and then increasing the gas flow to the chamber so as to sweep the particles out of the chamber through the exhaust system of the processing chamber while maintaining a plasma in the chamber.
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Citations
13 Claims
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1. A method of removing particles from the surface of a substrate mounted in a plasma processing vacuum chamber comprising
a) reducing the pressure in the chamber while maintaining a plasma of a gas stream in the chamber so that the particles are elevated above any obstructions near the substrate being processed; - and
b) increasing the flow of the gas stream to carry the elevated particles in the gas stream away from the surface of the substrate. - View Dependent Claims (2, 3, 4, 5)
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6. A method for removing particles generated in a vacuum plasma reactor chamber having a plasma sheath region and a vacuum exhaust system during plasma processing of a substrate comprising:
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a) maintaining a plasma of an inert gas in said chamber; b) reducing the pressure in said chamber to elevate said particles to the plasma sheath region and away from the surface of said substrate; and c) increasing the flow of the inert gas without increasing the pressure in the chamber, thereby sweeping said particles in said inert gas stream into the vacuum chamber exhaust system. - View Dependent Claims (7, 8, 9, 10)
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11. A method of removing particles from the surface of a substrate mounted in a vacuum plasma processing chamber having a source of power and a gas inlet connected thereto which comprises
a) reducing the pressure in the chamber while maintaining a plasma from a gas stream supplied through said gas inlet in said chamber above the surface of the substrate so as to lift particles on the surface of the substrate into the plasma region; - and
b) increasing the gas flow rate of said gas stream so as to carry said elevated particles away from the substrate. - View Dependent Claims (12, 13)
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Specification