Method of preparing current collectors for electrochemical cells

• US 5,622,612 A
• Filed: 11/16/1995
• Issued: 04/22/1997
• Est. Priority Date: 06/02/1993
• Status: Expired due to Term

• Current Assignee: Duracell U.S. Operations, Inc. (Berkshire Hathaway Incorporated)
• Original Assignee: Duracell Incorporated (Berkshire Hathaway Incorporated)
• Inventors: Barton, Paul, Mihara, David R., Gustar, Robert E., Rose, Stephen J., Adamson, David V.
• Primary Examiner(s): Gorgos, Kathryn L.
• Assistant Examiner(s): Leader, William T.
• Application Number:
  US08/553,254
• Time in Patent Office: 523 Days
• Field of Search: 205/138, 205/222, 205/261, 29/623.1, 29/623.3, 29/623.5, 29/825, 29/885, 29/527.2, 29/730, 29/731, 29/415, 29/417, 29/DIG. 11, 29/DIG. 12, 72/47, 72/274, 72/275
• US Class Current: 205/138
• CPC Class Codes: H01M 2300/0014 Alkaline electrolytes
• CPC Class Codes: H01M 4/661 Metal or alloys, e.g. alloy coatings H01M4/669 take precedence
• CPC Class Codes: H01M 4/667 in the form of layers, e.g. coatings
• CPC Class Codes: H01M 4/75 Wires, rods or strips
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y10S 29/011 Method or apparatus with drawing
• CPC Class Codes: Y10S 29/012 Method or apparatus with electroplating
• CPC Class Codes: Y10T 29/49115 including coating or impregnating
• CPC Class Codes: Y10T 29/49982 Coating

Abstract

A process is recited for plating elongated current collectors with indium. The current collectors have particular utility in alkaline electrochemical cells, particularly zinc/manganese dioxide alkaline cells containing "zero-added" mercury. The process of the invention involves electroplating conductive wire with indium and then drawing the plated wire to a lesser diameter. The drawn plated wire may then be cut to the desired lengths, typically in the shape of a nail, for use as current collectors within the alkaline cell.

Claims

1. A method of manufacturing a plurality of elongated current collectors for alkaline electrochemical cells having an anode and a cathode comprising the steps of:

a) electroplating a metal conductive wire with indium to form an indium plated wire, wherein the indium plating on said conductive wire has a thickness of between about 0.1 and 10 micron; and

b) drawing the indium plated wire formed in step a) to reduce the diameter thereof; and

c) inserting the drawn indium plated wire into said anode.

2. The method of claim 1 wherein the drawing in step b) reduces the diameter of the plated wire by between about 5 and 15 percent of the diameter of said plated wire formed in step a).

3. The method of claim 1 wherein the electroplating in step a) is carried out by immersing said conductive wire in an electrolyte bath comprising an aqueous solution of indium sulphamate, said conductive wire forming the cathode (negative electrode) and indium forming the anode (positive electrode);

and passing direct current between said electrodes, whereupon indium plates onto said conductive wire.

4. The method of claim 3 wherein the electrolyte bath comprises a concentration of indium sulphamate yielding between about 50 and 100 gm/liter of indium metal.

5. The method of claim 3 wherein the current passed between said electrodes has a current density between about 50 and 150 amp. per sq. ft. of wire surface.

6. A method according to claim 1 wherein prior to step a) the surface of the conductive wire is cleaned to remove surface dirt and oxide.

7. A method according to claim 6 wherein said wire is electrolytically cleaned.

8. A method according to claim 7 wherein the surface of said wire is anodically activated prior to said electroplating.

9. A method according to claim 1 wherein the thickness of said plated indium is not reduced by said drawing.