Process for manufacturing a resin molded image pick-up semiconductor chip having a window

• US 5,622,873 A
• Filed: 01/23/1995
• Issued: 04/22/1997
• Est. Priority Date: 01/24/1994
• Status: Expired due to Term

• Current Assignee: Intellectual Ventures II LLC (Intellectual Ventures LLC)
• Original Assignee: Goldstar Electron Co., Ltd. (SK Hynix Inc.)
• Inventors: Huh, Gi-Rok, Kim, Jin-Sung
• Primary Examiner(s): Niebling, John
• Assistant Examiner(s): Graybill, David E.
• Application Number:
  US08/376,723
• Time in Patent Office: 820 Days
• Field of Search: 437/2, 437/3, 437/211, 437/214, 437/219, 437/224, 437/212, 437/215, 437/216, 437/217, 264/272.17, 264/264, 257/434, 257/681, 257/707, 257/787, 257/100
• US Class Current: 438/65
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape

Abstract

A process for packaging a solid type image pick-up device and a device produced by the packaging process. The process includes the steps of: forming a protecting layer on a light receiving region of an image pick-up chip formed on a semiconductor wafer; separating the image pick-up chip after forming the protecting layer; attaching the image pick-up chip on a lead frame and connecting leads of the lead frame to a pad of the separated image pick-up chip; sealing the chip within a chip-receiving body by molding with a resin and by using a mold having a projection, the projection extending to the protecting layer; and removing the protecting layer, and sealing a transparent plate on a cavity formed by the projection.

Claims

1. A process for manufacturing an image pick-up device, comprising the steps of:

forming a protecting layer comprising a photo-sensitive material on a light-receiving region of an image pick-up chip formed on a semiconductor wafer;

separating the image pick-up chip from the wafer after forming the protecting layer;

attaching the image pick-up chip on a lead frame and connecting the leads of the lead frame to pads of the separated image pick-up chip;

sealing the chip within a chip-receiving body by molding with a resin and by using a mold having a projection, the projection extending to the protecting layer and forming a cavity over the protecting layer; and

removing the protecting layer, and sealing a transparent plate on the cavity formed by the projection.

2. The process of claim 1, wherein the protecting layer comprises photo resist.

3. The process of claim 1, wherein the protecting layer is formed on the wafer, wherein the wafer has a plurality of image pick-up chips formed therein, and a patterning is carried out with a photo-etching process so as for remaining portions of the protecting layer to cover the light-receiving regions of the image pick-up chips.

4. The process of claim 1, wherein the lead frame comprises a chip-attaching portion, an inner lead, and an outer lead connected to the inner lead, wherein the image pick-up chip is attached to the chip-attaching portion, and the image pick-up chip includes pad that is wire-bonded to the inner lead.

5. The process of claim 1, wherein the mold consists of an upper mold and a lower mold for forming a cavity;

and

the upper mold is provided with a first projection and a second projection connected to the first projection and extending to the protecting layer of the image pick-up chip; and

a molded chip-receiving body includes a cavity corresponding to the second projection, and a plate-receiving portion corresponding to the first projection.

6. The process of claim 5, wherein the thickness of the first projection corresponds to the thickness of the transparent plate.

7. The process of claim 5, wherein the transparent plate is placed on the plate-receiving portion and sealed with a sealant.

8. A process for manufacturing an image pick-up device, comprising the steps of:

bonding an image pick-up chip on a chip-attaching portion of a lead frame, the image pick-up chip having pads and a light-receiving region and a photo-sensitive protecting layer formed by a photo-etch process and extending over the light-receiving region but not the pads;

wire-bonding the pads to leads of the lead frame;

sealing the image pick-up chip within a chip-receiving body by resin-molding using a mold having a projection for contacting with the protecting layer; and

sealing a transparent plate onto the cavity of the chip receiving body, the cavity corresponding to the projection.

9. The process of claim 8, wherein the stepped projection contacting with the protecting layer is provided with a groove, wherein the groove has a size that corresponds to the light-receiving region and wherein the light-receiving region does not contact with the projection.

10. The process of claim 8, wherein the cavity corresponding to the projection comprises:

a first cavity formed between the light-receiving region of the image pick-up chip and the transparent plate; and

a second cavity having a stepped surface and communicating with the first cavity;

wherein the transparent plate is positioned inside of the second cavity, and the first cavity forms a space for transferring light beams incident on the transparent plate to the light-receiving region.

11. The process of claim 8, wherein the cavity has an angle diverged toward the outside of the chip-receiving body.

12. A process for manufacturing an image pick-up device, comprising the steps of:

bonding an image pick-up chip on a chip-attaching portion of a lead frame, the image pick-up chip having pads and a light-receiving region;

wire-bonding the pads to leads of the lead frame;

sealing the image pick-up chip within a chip-receiving body by resin-molding using a mold having a projection provided with a groove, wherein the groove has a size and position that correspond to the light-receiving region, wherein the light-receiving region does not contact with the projection; and

sealing a transparent plate onto the cavity of the chip receiving body, the cavity corresponding to the projection.

13. The process of claim 12, wherein the image pick-up chip has a protecting layer formed to extend over the light-receiving region but not the pads.

14. The process of claim 13, wherein the protecting layer is removed prior to sealing of the transparent plate.

15. The process of claim 13, wherein the protecting layer comprises a photo-sensitive material.

16. The process of claim 15, wherein the photo-sensitive material comprises photo-resist.

17. The process of claim 12, wherein the cavity corresponding to the projection comprises:

a first cavity formed between the light-receiving region of the image pick-up chip and the transparent plate; and

a second cavity having a stepped surface and communicating with the first cavity;

wherein the transparent plate is positioned inside of the second cavity, and the first cavity forms a space for transferring light beams incident on the transparent plate to the light-receiving region.

18. The process of claim 12, wherein the cavity has an angle diverged toward the outside of the chip-receiving body.