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Process for manufacturing a resin molded image pick-up semiconductor chip having a window

  • US 5,622,873 A
  • Filed: 01/23/1995
  • Issued: 04/22/1997
  • Est. Priority Date: 01/24/1994
  • Status: Expired due to Term
First Claim
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1. A process for manufacturing an image pick-up device, comprising the steps of:

  • forming a protecting layer comprising a photo-sensitive material on a light-receiving region of an image pick-up chip formed on a semiconductor wafer;

    separating the image pick-up chip from the wafer after forming the protecting layer;

    attaching the image pick-up chip on a lead frame and connecting the leads of the lead frame to pads of the separated image pick-up chip;

    sealing the chip within a chip-receiving body by molding with a resin and by using a mold having a projection, the projection extending to the protecting layer and forming a cavity over the protecting layer; and

    removing the protecting layer, and sealing a transparent plate on the cavity formed by the projection.

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