Process of making an integrated circuit chip composite including parylene coated wire
First Claim
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1. A method for fabricating a composite which comprises providing an integrated circuit chip having electrically conductive site thereon;
- interconnecting conductive lead to said conductive site with electrically conductive wire;
then conformally coating said wire with a dielectric material wherein said dielectric is parylene;
then coating said dielectric material with an electrically conductive coating and then encapsulating the chip, wire and portion of said conductive lead in a dielectric encapsulating composition.
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Abstract
A composite containing an integrated circuit chip having conductive site thereon and electrically conductive leads that are interconnected to the conductive site by electrically conductive wire; wherein the wire is coated with a dielectric material. Also, a method for fabricating the composite is provided.
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Citations
14 Claims
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1. A method for fabricating a composite which comprises providing an integrated circuit chip having electrically conductive site thereon;
- interconnecting conductive lead to said conductive site with electrically conductive wire;
then conformally coating said wire with a dielectric material wherein said dielectric is parylene;
then coating said dielectric material with an electrically conductive coating and then encapsulating the chip, wire and portion of said conductive lead in a dielectric encapsulating composition. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
- interconnecting conductive lead to said conductive site with electrically conductive wire;
Specification