Patterned conductive textiles

• US 5,624,736 A
• Filed: 05/12/1995
• Issued: 04/29/1997
• Est. Priority Date: 05/12/1995
• Status: Expired due to Term

• Current Assignee: Milliken & Company
• Original Assignee: Milliken Research Corporation
• Inventors: Child, Andrew D., DeAngelis, Alfred R., Green, Dennis E.
• Primary Examiner(s): Chea, Thorl
• Application Number:
  US08/440,273
• Time in Patent Office: 718 Days
• Field of Search: 428/195, 428/196, 428/197, 428/224, 428/225, 428/253, 428/257, 428/258, 428/142, 428/147, 216/7, 216/95, 216/83, 252/500, 28/160, 28/168, 427/121
• US Class Current: 428/196
• CPC Class Codes: D06N 3/0056 characterised by the compounding ingredients of the macro-molecular coating D06N3/005 takes precedence
• CPC Class Codes: D06N 3/007 characterised by mechanical or physical treatments D06N3/0029, D06N3/0031 take precedence
• CPC Class Codes: D06N 3/12 with macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds , e.g. gelatine proteins
• CPC Class Codes: Y10T 428/2481 including layer of mechanically interengaged strands, strand-portions or strand-like strips
• CPC Class Codes: Y10T 428/24818 Knitted, with particular or differential bond sites or intersections

Abstract

A patterned conductive textile is provided by depositing a conductive polymer film on the fabric to provide a resistivity of 1000 ohms per square or less, coating selected areas of the fabric with a protective film, to protect the conductive polymer from a chemical etching agent, to provide an oxygen barrier and to retain areas of high conductivity, applying a chemical etching agent to the fabric thereby degrading the conductive polymer film on areas of the fabric which have not been coated with the protective film and create areas of low conductivity and rinsing the fabric to remove any residual etching agent.

Claims

1. A material comprising of fabric having an area of high conductivity, where the conductivity has been enhanced by a conductive polymer film having been deposited thereon, the conductive polymer film in the area of high conductivity is coated with a second film which is resistant to a chemical etching agent capable of degrading the conductive polymer, the fabric further having an area of low conductivity, which has not been coated with the second film, and where the conductivity is less than the area of high conductivity.

2. The material claim 1 wherein the ratio of conductivity between the area of high conductivity and the area of low conductivity is 100 or greater.

3. The material of claim 2 wherein the second film is an oxygen barrier.

4. The material of claim 2 wherein the second polymer is selected from the group consisting of PVC PVdC-PAA copolymer, PVdC, polyester and polyolefin polymers.

5. The material of claim 2 wherein the fabric is woven and is constructed of continuous filament yarn selected from the group consisting polyester, polyamide, polyolefin and glass filaments.

6. The material of claim 1 wherein the conductive polymer film is selected from the group consisting of polyaniline and polypyrrole and wherein the areas of low conductivity are devoid of the conductive polymer film.

7. The material of claim 1 wherein the conductive polymer film is a polypyrrole film and the area of high conductivity has a resistivity of 1000Ω

/square or less.

8. The material of claim 7 wherein the second film is an oxygen barrier.

9. The material of claim 7 wherein the second polymer is selected from the group consisting of PVC, PVdC-PAA copolymer, PVdC, polyester and polyolefin polymers.

10. The material of claim 7 wherein the fabric is woven and is constructed of continuous filament yarn selected from the group consisting polyester, polyamide, polyolefin and glass filaments.

11. The material of claim 7 wherein the area of low conductivity is devoid of the conductive polymer film.

12. A fabric having patterned conductivity, obtainable by a process comprising the steps of:

(a) depositing a conductive polymer film on a fabric;

(b) coating selected areas of the fabric of step (a) with a second film, whereby the second film is resistant to a chemical etching agent for the conductive polymer, to retain areas of high conductivity;

(c) and applying the chemical etching agent to the fabric of step (b) and degrading the conductive polymer in areas of the fabric which have not been coated with the second film thereby creating areas of low conductivity.

13. The fabric of claim 12 wherein the conductive polymer film is selected from the group consisting of polyaniline and polypyrrole and the areas of high conductivity have resistivity of 1000Ω

/square or less.

14. The fabric of claim 13 wherein the fabric is woven and is constructed of continuous filament yarn selected from the group consisting polyester, polyamide, polyolefin and glass filaments.

15. The fabric of claim 13 wherein the etching agent is selected from the group consisting of sodium hypochlorite, hydrogen peroxide, sodium borohydride and ammonium hydroxide.

16. The fabric of claim 13 wherein the second film is an oxygen barrier.

17. The fabric of claim 12 wherein the ratio of conductivity between the area of high conductivity and the area of low conductivity is 100 or greater.

18. The fabric of claim 17 wherein the conductive polymer film is selected from the group consisting of polyaniline and polypyrrole and wherein the areas of low conductivity are devoid of the conductive polymer film.

19. A fabric having patterned conductivity, obtainable by a process comprising the steps of:

(a) depositing a conductive polypyrrole film on a fabric to provide a resistivity of 500Ω

/square or less;

(b) coating selected areas of the fabric of step (a) with a non-conductive protective film, whereby the protective film is an oxygen barrier and is resistant to a chemical etching agent for the polypyrrole film, to retain areas of high conductivity;

(c) applying the chemical etching agent to the fabric of step (b) and degrading the polypyrrole film on areas of the fabric which have not been coated with the protective films to create areas of low conductivity; and

(d) rinsing the fabric of step (c) to remove residual etching agent.

20. The fabric of claim 19 wherein the etching agent is selected from the group consisting of sodium hypochlorite, hydrogen peroxide, sodium borohydride and ammonium hydroxide, and the protective film is selected from the group consisting of PVC, PVdC-PAA copolymer, PVdC, polyester and polyolefin polymers, and the thickness of the protective film is between 0.01 and 0.2 mm.